IP Library › Assignment 027029/0240
Patent Assignment
Reel/Frame 027029/0240

Change of Name

Recorded: 2011-10-07 Pages: 4
Assignor
INTEGRATED SYSTEM SOLUTION CORP.
Executed: 2010-06-21
Assignee
ISSC TECHNOLOGIES CORP.
4F NO.8, DUSING RD., HSINCHU SCIENCE PARK,, HSINCHU CITY, 30078, TAIWAN
Covered Properties (7)
Low-Complexity Joint Symbol Cck Decoder
Patent: 7,113,553 →
Application: 10/382,756 →
Publication: US 2004/0091019
Digitally Controlled Tuner Circuit
Patent: 6,919,759 →
Application: 10/740,331 →
Publication: US 2005/0024151
Current-Matching Variable Gain Amplifier
Patent: 7,321,266 →
Application: 10/908,553 →
Publication: US 2006/0261893
Differential Amplifier and Low Drop-Out Regulator with Thereof
Patent: 7,173,401 →
Application: 11/195,263 →
Publication: US 2007/0024350
Hybrid Dc-Offset Reduction Method and System for Direct Conversion Receiver
Patent: 7,933,361 →
Application: 11/399,127 →
Publication: US 2007/0237264
Power Saving Method of Bi-Directional Communication Wireless Peripheral Device
Patent: 7,900,070 →
Application: 11/755,005 →
Publication: US 2008/0209083
Power on Reset Signal Generating Apparatus and Method
Patent: 8,536,907 →
Application: 13/244,279 →
Publication: US 2013/0076410
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 18, 2003
From: CHUAN, CHIA-SO
To: WINBOND ELECTRONICS CORPORATION
Reel/Frame 014821/0754 →
Assignment of Assignor's Interest May 17, 2005
From: CHIANG, MING-CHOU
To: WINBOND ELECTRONICS CORP.
Reel/Frame 016020/0461 →
Assignment of Assignor's Interest Aug 1, 2005
From: HUANG, CHUN-SHENG
To: WINBOND ELECTRONICS CORP.
Reel/Frame 016861/0727 →
Assignment of Assignor's Interest Apr 5, 2006
From: HUANG, KUANG-HU; PENG, WEI-CHUNG; CHUAN, CHIA-SO
To: WINBOND ELECTRONICS CORP.
Reel/Frame 017739/0352 →
Assignment of Assignor's Interest May 30, 2006
From: WINBOND ELECTRONICS CORP.
To: INTEGRATED SYSTEM SOLUTION CORP.
Reel/Frame 017711/0367 →
Assignment of Assignor's Interest Jun 11, 2007
From: WU, HSIN-JU; SU, DAR-CHERN; CHEN, ALBERT
To: INTEGRATED SYSTEM SOLUTION CORP.
Reel/Frame 019404/0946 →
Assignment of Assignor's Interest Sep 27, 2011
From: CHEN, YI-LUNG
To: INTEGRATED SYSTEM SOLUTION CORP.
Reel/Frame 026970/0963 →
Merger Sep 4, 2015
From: ISSC TECHNOLOGIES CORP.
To: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
Reel/Frame 036554/0152 →
Merger Sep 6, 2015
From: ISSC TECHNOLOGIES CORP.
To: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
Reel/Frame 036562/0001 →
Merger Sep 8, 2015
From: ISSC TECHNOLOGIES CORP.
To: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
Reel/Frame 036563/0263 →
Assignment of Assignor's Interest Sep 18, 2015
From: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 036631/0442 →
Assignment of Assignor's Interest Sep 18, 2015
From: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 036631/0555 →
Assignment of Assignor's Interest Sep 18, 2015
From: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 036632/0363 →
Security Interest Feb 10, 2017
From: MICROCHIP TECHNOLOGY INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0617 →
Security Interest Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
Security Interest Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
Security Interest Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
Release of Security Interest May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
Reel/Frame 053466/0011 →
Security Interest Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
Security Interest Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
Security Interest Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
Release of Security Interest Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
Reel/Frame 059333/0222 →
Release of Security Interest Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 059666/0545 →
Release of Security Interest Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
Reel/Frame 059358/0001 →
Release of Security Interest Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
Reel/Frame 059863/0400 →