IP Library › Assignment 036554/0152
Patent Assignment
Reel/Frame 036554/0152

Merger

Recorded: 2015-09-04 Pages: 52
Assignor
ISSC TECHNOLOGIES CORP.
Executed: 2015-05-30
Assignee
MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
C/O INTERTRUST CORPORATE SERVICES (CAYMAN) LIMITED, 190 ELGIN AVENUE, GEORGE TOWN, KY1-9005, CAYMAN ISLANDS
Covered Properties (6)
Low-Complexity Joint Symbol Cck Decoder
Patent: 7,113,553 →
Application: 10/382,756 →
Publication: US 2004/0091019
Digitally Controlled Tuner Circuit
Patent: 6,919,759 →
Application: 10/740,331 →
Publication: US 2005/0024151
Current-Matching Variable Gain Amplifier
Patent: 7,321,266 →
Application: 10/908,553 →
Publication: US 2006/0261893
Device and Method for Providing Dc-Offset Estimation
Patent: 7,496,341 →
Application: 11/089,075 →
Publication: US 2006/0217069
Differential Amplifier and Low Drop-Out Regulator with Thereof
Patent: 7,173,401 →
Application: 11/195,263 →
Publication: US 2007/0024350
Hybrid Dc-Offset Reduction Method and System for Direct Conversion Receiver
Patent: 7,933,361 →
Application: 11/399,127 →
Publication: US 2007/0237264
Related Assignments (23)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 18, 2003
From: CHUAN, CHIA-SO
To: WINBOND ELECTRONICS CORPORATION
Reel/Frame 014821/0754 →
Assignment of Assignor's Interest May 6, 2005
From: CHEN, WEI-HONG; LIN, HUASHIH; PENG, WEI-CHUNG
To: WINBOND ELECTRONICS CORPORATION
Reel/Frame 015978/0362 →
Assignment of Assignor's Interest May 17, 2005
From: CHIANG, MING-CHOU
To: WINBOND ELECTRONICS CORP.
Reel/Frame 016020/0461 →
Assignment of Assignor's Interest Aug 1, 2005
From: HUANG, CHUN-SHENG
To: WINBOND ELECTRONICS CORP.
Reel/Frame 016861/0727 →
Assignment of Assignor's Interest Apr 5, 2006
From: HUANG, KUANG-HU; PENG, WEI-CHUNG; CHUAN, CHIA-SO
To: WINBOND ELECTRONICS CORP.
Reel/Frame 017739/0352 →
Assignment of Assignor's Interest May 30, 2006
From: WINBOND ELECTRONICS CORP.
To: INTEGRATED SYSTEM SOLUTION CORP.
Reel/Frame 017711/0367 →
Change of Name Jun 24, 2010
From: INTEGRATED SYSTEM SOLUTION CORP
To: ISSC TECHNOLOGIES CORP.
Reel/Frame 024592/0020 →
Change of Name Oct 7, 2011
From: INTEGRATED SYSTEM SOLUTION CORP.
To: ISSC TECHNOLOGIES CORP.
Reel/Frame 027029/0240 →
Assignment of Assignor's Interest Sep 18, 2015
From: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 036631/0442 →
Security Interest Feb 10, 2017
From: MICROCHIP TECHNOLOGY INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0617 →
Security Interest Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
Security Interest Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
Security Interest Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
Release of Security Interest May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
Reel/Frame 053466/0011 →
Security Interest Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
Security Interest Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
Security Interest Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
Release of Security Interest Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
Reel/Frame 059333/0222 →
Release of Security Interest Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 059666/0545 →
Release of Security Interest Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
Reel/Frame 059358/0001 →
Release of Security Interest Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
Reel/Frame 059863/0400 →
Release of Security Interest Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
Reel/Frame 059363/0001 →
Release of Security Interest Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
Reel/Frame 060894/0437 →