Patent Assignment
Reel/Frame 036561/0944
Merger
Recorded: 2015-09-06
Pages: 52
Assignor
ISSC TECHNOLOGIES CORP.
Executed: 2015-05-30
Assignee
MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
C/O INTERTRUST CORPORATE SERVICES (CAYMAN) LIMITED, 190 ELGIN AVENUE, GEORGE TOWN, KY1-9005, CAYMAN ISLANDS
Covered Properties
(6)
Packet Type Arbitrator in Wlan and Corresponding Arbitrating Method
Method and System for Channel Estimation in Wlan
Galois Field Computation
Methods and Apparatus for Circulation Transmissions for Ofdm-Based Mimo Systems
System and Method for Providing 3-Dimensional Joint Interleaver and Circulation Transmissions
Adaptive Quantization Method and Apparatus for an Ofdm Receiver
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 24, 2003
From: LIAO, YEN-CHIN; MA, KUANG-PING; CHIU, CHIA-YUNG; HUANG, ERIC
To: INTEGRATED SYSTEMS SOLUTION CORP.
Reel/Frame 014742/0695 →
Assignment of Assignor's Interest
Nov 26, 2003
From: MA, KUANG-PING; WU, AARON; CHIU, CHIA-YUNG; HUANG, CHEN-YEN
To: INTEGRATED SYSTEM SOLUTION CORP.
Reel/Frame 014746/0235 →
Re-Record to Correct Signature Page on a Document Previously Recorded on Reel 014742, Frame 0695
Aug 4, 2004
From: LIAO, YEN-CHIN; MA, KUANG-PING; CHIU, CHIA-YUNG; HUANG, ERIC
To: INTEGRATED SYSTEM SOLUTIONS CORP.
Reel/Frame 016533/0247 →
Assignment of Assignor's Interest
Dec 1, 2004
From: LIN, HUASHIH; WELCH, LLOYD; LU, HSIAO-FENG
To: WINBOND ELECTRONICS CORPORATION
Reel/Frame 016041/0967 →
Correction to Assignment Previously Recorded at Reel 014742, Frame 0695
Aug 15, 2005
From: LIAO, YEN-CHIN; MA, KUANG-PING; CHIU, CHIA-YUNG; HUANG, ERIC
To: INTEGRATED SYSTEM SOLUTION CORP.
Reel/Frame 016888/0500 →
Assignment of Assignor's Interest
Nov 2, 2005
From: CHEN, JENG-HONG; KIM, PANSOP
To: WINBOND ELECTRONICS CORPORATION
Reel/Frame 016721/0729 →
Assignment of Assignor's Interest
May 30, 2006
From: WINBOND ELECTRONICS CORP.
To: INTEGRATED SYSTEM SOLUTION CORP.
Reel/Frame 017711/0367 →
Assignment of Assignor's Interest
Jul 24, 2006
From: CHEN, JENG-HONG; LEE, YUMIN; LIN, YUH-CHUN
To: INTEGRATED SILICON SOLUTION CORPORATION
Reel/Frame 017981/0490 →
Assignment of Assignor's Interest
Sep 26, 2006
From: CHEN, JENG-HONG; KIM, PANSOP
To: WINBOND ELECTRONICS CORPORATION
Reel/Frame 018305/0882 →
Assignment of Assignor's Interest
Dec 25, 2007
From: CHEN, JENG-HONG; LEE, YUMIN; LIN, YUH-CHUN
To: INTEGRATED SYSTEM SOLUTION CORPORATION
Reel/Frame 020286/0694 →
Change of Name
Jun 24, 2010
From: INTEGRATED SYSTEM SOLUTION CORP
To: ISSC TECHNOLOGIES CORP.
Reel/Frame 024592/0020 →
Change of Name
Oct 18, 2011
From: INTEGRATED SYSTEM SOLUTION CORP.
To: ISSC TECHNOLOGIES CORP.
Reel/Frame 027082/0905 →
Assignment of Assignor's Interest
Sep 18, 2015
From: MICROCHIP TECHNOLOGY (BARBADOS) II INCORPORATED
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 036631/0442 →
Security Interest
Feb 10, 2017
From: MICROCHIP TECHNOLOGY INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0617 →
Security Interest
Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
Security Interest
Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
Security Interest
Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
Release of Security Interest
May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
Reel/Frame 053466/0011 →
Security Interest
Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
Security Interest
Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
Security Interest
Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
Release of Security Interest
Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
Reel/Frame 059333/0222 →
Release of Security Interest
Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 059666/0545 →
Release of Security Interest
Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
Reel/Frame 059358/0001 →
Release of Security Interest
Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION
Reel/Frame 059863/0400 →