Patent Assignment
Reel/Frame 031281/0302
Assignment of Assignor's Interest
Recorded: 2013-09-25
Pages: 10
Assignors
KIM, OH HAN
Executed: 2013-09-25
JUNG, SEIL
Executed: 2013-09-25
LEE, HEESO
Executed: 2013-09-25
CHUNG, JAE HAN
Executed: 2013-09-25
KIM, YOUNGCHUL
Executed: 2013-09-25
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Heat Spreader and Method of Manufacture Thereof
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Spelling of Third Inventor's Name Heeso Lee Previously Recorded on Reel 031281 Frame 0302. Assignor(S) Hereby Confirms the Assignment.
Oct 21, 2013
From: KIM, OH HAN; JUNG, SEIL; LEE, HEESOO; CHUNG, JAE HAN
To: STATS CHIPPAC LTD.
Reel/Frame 031448/0284 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0400 →
Release of Security Interest
Jun 16, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052950/0497 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0400. Assignor(S) Hereby Confirms the Assignment.
Sep 5, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064806/0593 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →