Patent Assignment
Reel/Frame 031448/0284
Corrective Assignment to Correct the Spelling of Third Inventor's Name Heeso Lee Previously Recorded on Reel 031281 Frame 0302. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2013-10-21
Pages: 11
Assignors
KIM, OH HAN
Executed: 2013-09-25
JUNG, SEIL
Executed: 2013-09-25
LEE, HEESOO
Executed: 2013-09-25
CHUNG, JAE HAN
Executed: 2013-09-25
KIM, YOUNGCHUL
Executed: 2013-09-25
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Heat Spreader and Method of Manufacture Thereof
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 25, 2013
From: KIM, OH HAN; JUNG, SEIL; LEE, HEESO; CHUNG, JAE HAN
To: STATS CHIPPAC LTD.
Reel/Frame 031281/0302 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0400 →
Release of Security Interest
Jun 16, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052950/0497 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0400. Assignor(S) Hereby Confirms the Assignment.
Sep 5, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064806/0593 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →