Patent Assignment
Reel/Frame 032276/0179
Security Agreement
Recorded: 2014-02-19
Pages: 11
Assignee
CREDIT SUISSE AG, AS COLLATERAL AGENT (SECOND LIEN)
11 MADISON AVENUE, NEW YORK, NEW YORK, 10010
Covered Properties
(35)
Magnetic Instrument Pickup
PCT:
PCT/US2011/058597 ↗
Improved Magnetic Instrument Pickup
PCT:
PCT/US2012/042573 ↗
Stripline Balun
Patent:
6,294,965 →
Application:
09/266,564 →
Microwave Circuit Connector
Patent:
6,464,510 →
Application:
09/317,507 →
Surface Mount Crossover Component
Patent:
6,734,750 →
Application:
09/466,288 →
Balun formed from symmetrical couplers and method for making same
Patent:
6,292,070 →
Application:
09/491,449 →
Integrated Circuit Heat Sink Device Including Through Hole to Facilitate Communication
Dynamic Combiner/Splitter for Rf Signal Systems
Quadrifilar Antenna Serial Feed
Multiport Serial Feed Device
Circulator and Method of Manufacture
Non-Switching Adaptable 4-Way Power Splitter/Combiner
Auxiliary Amplifier Network
Vertical Inter-Digital Coupler
Inverted Style Balun with Dc Isolated Differential Ports
Surface Mount Stripline Devices Having Ceramic and Soft Board Hybrid Materials
Circulator Device and a Method for Assembly
Coupler Device
Patent:
8,044,749 →
Application:
12/392,649 →
Power Splitter/Combiner
Compact Balun
Circulator/Isolator with an Asymmetric Resonator
Surface Mountable Circulator
Magnetic Instrument Pickup
Wideband Balun Using Re-Entrant Coupled Lines and Ferrite Material
Impedance Transforming Coupler
Magnetic Instrument Pickup
Application:
13/523,294 →
Publication:
US 2012/0272815
Doherty Power Amplifier Network
Compact Broadband Impedance Transformer
Wideband Doherty Amplifier Network
Rf Resistor with Lossy Traces
A Stripline Assembly Having First and Second Pre-Fired Ceramic Substrates Bonded to Each Other Through a Conductive Bonding Layer
First and Second Microstrip Networks Stacked in an Inverted Arrangement to Each Other Using an Integrated Support and Shielding Structure
Hybrid Coupler Device Having Plural Transmission Line Structures with Unwound-Rewound Geometry
Stacked Microstrip Circuit with Integrated Support and Shielding Structure
Application:
61/733,921 →
Laminated Ceramic Rf Assembly
Application:
61/734,113 →
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement
Feb 18, 2014
From: ANAREN, INC.; ANAREN MICROWAVE, INC.
To: CREDIT SUISSE AG, AS COLLATERAL AGENT (FIRST LIEN)
Reel/Frame 032275/0473 →
Release of First Lien Security Interest in Intellectual Property Recorded at Reel/Frame 032275/0473
Apr 18, 2018
From: CREDIT SUISSE AG, AS COLLATERAL AGENT
To: ANAREN, INC.; ANAREN MICROWAVE, INC.
Reel/Frame 045978/0510 →
Release of Second Lien Security Interest in Intellectual Property Recorded at Reel/Frame: 032276/0179
Apr 18, 2018
From: CREDIT SUISSE AG, AS COLLATERAL AGENT
To: ANAREN, INC.; ANAREN MICROWAVE, INC.
Reel/Frame 045972/0001 →
Supplement to Patent Security Agreement - Abl
Apr 23, 2018
From: ANAREN, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 045998/0401 →
Supplement to Patent Security Agreement - Tl
Apr 23, 2018
From: ANAREN, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046000/0815 →
Assignment of Assignor's Interest
Jun 23, 2021
From: ANAREN, INC.
To: TTM TECHNOLOGIES INC.
Reel/Frame 056635/0640 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →