IP Library Assignment 037726/0845
Patent Assignment
Reel/Frame 037726/0845

Assignment of Assignor's Interest

Recorded: 2016-02-12 Pages: 3
Assignors
ROY, PRADIP
Executed: 2006-01-13
DEOPURA, MANISH
Executed: 2006-01-13
MISRA, SUDHANSHU
Executed: 2006-01-13
Assignee
NEOPAD TECHNOLOGIES CORPORATION
1290 OAKMEAD PARKWAY, SUITE 305, SUNNYVALE, CALIFORNIA, 94085
Covered Property (1)
Customized Polishing Pads for Cmp and Methods of Fabrication and Use Thereof
Application: 15/042,777 →
Publication: US 2016/0229025
Related Assignments (9)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 19, 2017
From: NEXPLANAR CORPORATION
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 043046/0377 →
Change of Name Nov 6, 2018
From: NEOPAD TECHNOLOGIES CORPORATION
To: NEXPLANAR CORPORATION
Reel/Frame 047430/0493 →
Security Agreement Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
Change of Name Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
Release of Security Interest Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
Reel/Frame 060592/0260 →
Security Interest Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
Security Interest Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
Change of Name Nov 8, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065517/0783 →
Change of Name Nov 22, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065663/0466 →