Patent Assignment
Reel/Frame 043067/0291
Assignment of Assignor's Interest
Recorded: 2017-07-21
Pages: 5
Assignors
LEFEVRE, PAUL ANDRE
Executed: 2013-06-03
ALLISON, WILLIAM C.
Executed: 2013-05-21
SIMPSON, ALEXANDER WILLIAM
Executed: 2013-05-31
SCOTT, DIANE
Executed: 2013-05-21
HUANG, PING
Executed: 2013-05-21
CHARNS, LESLIE M.
Executed: 2013-05-22
RINEHART, JAMES
Executed: 2013-05-31
KERPRICH, ROBERT
Executed: 2013-05-21
Assignee
NEXPLANAR CORPORATION
7175 NW EVERGREEN PARKWAY, SUITE 200, HILLSBORO, OREGON, 97124
Covered Property
(1)
Polishing Pad Having Polishing Surface with Continuous Protrusions
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 19, 2017
From: NEXPLANAR CORPORATION
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 043046/0377 →
Security Agreement
Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
Change of Name
Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
Release of Security Interest
Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
Reel/Frame 060592/0260 →
Security Interest
Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
Security Interest
Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
Change of Name
Nov 8, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065517/0783 →
Change of Name
Nov 22, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065663/0466 →