Patent Assignment
Reel/Frame 062013/0396
Corrective Assignment to Correct the the Name of the Assignee on the Assignment Previously Recorded at Reel: 016866 Frame: 0029. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2022-11-29
Pages: 12
Assignors
YANG, XIAOYU
Executed: 2005-09-30
SCHEUERLEIN, ROY E.
Executed: 2005-09-30
LI, FENG
Executed: 2005-09-29
MEEKS, ALBERT T.
Executed: 2005-09-30
Assignee
MATRIX SEMICONDUCTOR, INC.
3230 SCOTT BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Properties
(2)
Memory with high dielectric constant antifuses and method for using at low voltage
Application:
11/173,973 →
Publication:
US 2007/0069241
Resistance-Switching Memory Cells Adapted for Use at Low Voltage
Related Assignments
(10)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 10, 2005
From: YANG, XIAOYU; SCHEUERLEIN, ROY E.; LI, FENG; MEEKS, ALBERT T.
To: MATRIX SEMICONDUCTOR
Reel/Frame 016866/0029 →
Merger
Apr 28, 2006
From: MATRIX SEMICONDUCTOR, INC.
To: SANDISK 3D LLC
Reel/Frame 017544/0769 →
Corrective Assignment to Correct the Corrective Merger to Add Pages to the Merger Document Previously Recorded Previously Recorded on Reel 017544 Frame 0769. Assignor(S) Hereby Confirms the Merger.
Mar 2, 2007
From: MATRIX SEMICONDUCTOR, INC.
To: SANDISK 3D LLC
Reel/Frame 018950/0686 →
Assignment of Assignor's Interest
Mar 30, 2016
From: SANDISK 3D LLC.
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038300/0665 →
Corrective Assignment to Correct the Incorrect Listed Patent Number 8853569 to the Correct Patent Number 8883569 Previously Recorded on Reel 038300 Frame 0665. Assignor(S) Hereby Confirms the Assignment.
Apr 25, 2016
From: SANDISK 3D LLC
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038520/0552 →
Change of Name
May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038807/0898 →
Change of Name
May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038807/0980 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →