IP Library Assignment 066141/0473
Patent Assignment
Reel/Frame 066141/0473

Corrective Assignment to Correct the 2ND Application Number Should Be Deleted Previously Recorded at Reel: 064275 Frame: 0442. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2023-12-28 Pages: 6
Assignors
TIRUKKONDA, ROSHAN JAYAKHAR
Executed: 2023-05-09
SONDHI, KARTIK
Executed: 2023-05-09
MAKALA, RAGHUVEER S.
Executed: 2023-05-11
KANAKAMEDALA, SENAKA
Executed: 2023-05-09
Assignee
INC., WESTERN DIGITAL TECHNOLOGIES
5601 GREAT OAKS PARKWAY, SAN JOSE, CALIFORNIA, 95119
Covered Properties (8)
Method of Making a Three-Dimensional Memory Device Using Composite Hard Masks for Formation of Deep via Openings
Application: 17/355,955 →
Publication: US 2022/0208556
Method of Making a Three-Dimensional Memory Device Using Composite Hard Masks for Formation of Deep via Openings
Application: 17/494,114 →
Publication: US 2022/0208788
Method of Making a Three-Dimensional Memory Device Using Composite Hard Masks for Formation of Deep via Openings
Application: 17/508,036 →
Publication: US 2022/0208600
Method of Making a Three-Dimensional Memory Device Using Composite Hard Masks for Formation of Deep via Openings
Application: 17/590,278 →
Publication: US 2022/0208776
Method of Making a Three-Dimensional Memory Device Using Composite Hard Masks for Formation of Deep via Openings
Application: 17/657,521 →
Publication: US 2022/0223470
Method of Making a Three-Dimensional Memory Device Using Composite Hard Masks for Formation of Deep via Openings
Application: 18/346,520 →
Publication: US 2023/0343641
Method of Making a Three-Dimensional Memory Device Using Composite Hard Masks for Formation of Deep via Openings
Application: 63/464,823 →
Method of Making a Three-Dimensional Memory Device Using Composite Hard Masks for Formation of Deep via Openings
Application: 63/489,231 →
Related Assignments (20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 7, 2021
From: TIRUKKONDA, ROSHAN JAYAKHAR; KANAKAMEDALA, SENAKA; SHARANGPANI, RAHUL; MAKALA, RAGHUVEER S
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 056778/0372 →
Assignment of Assignor's Interest Oct 5, 2021
From: OKAMOTO, KATSUFUMI; TITUS, MONICA
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 057702/0170 →
Assignment of Assignor's Interest Oct 22, 2021
From: TIRUKKONDA, ROSHAN JAYAKHAR; KANAKAMEDALA, SENAKA; MAKALA, RAGHUVEER S; SHARANGPANI, RAHUL
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 057875/0697 →
Assignment of Assignor's Interest Feb 1, 2022
From: TITUS, MONICA; TIRUKKONDA, ROSHAN JAYAKHAR; KANAKAMEDALA, SENAKA; MAKALA, RAGHUVEER S.
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 058847/0075 →
Assignment of Assignor's Interest Mar 31, 2022
From: TIRUKKONDA, ROSHAN JAYAKHAR; TITUS, MONICA; KANAKAMEDALA, SENAKA; MAKALA, RAGHUVEER S.
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 059463/0668 →
Assignment of Assignor's Interest Mar 23, 2023
From: SHARANGPANI, RAHUL; KANAKAMEDALA, SENAKA; MAKALA, RAGHUVEER S.; TIRUKKONDA, ROSHAN JAYAKHAR
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 063073/0001 →
Assignment of Assignor's Interest Jun 13, 2023
From: TIRUKKONDA, ROSHAN JAYAKHAR; SONDHI, KARTIK; MAKALA, RAGHUVEER S.; KANAKAMEDALA, SENAKA
To: WESTERN DIGITAL TECHNOLOGIES, INC.,
Reel/Frame 063936/0054 →
Assignment of Assignor's Interest Jul 15, 2023
From: TIRUKKONDA, ROSHAN JAYAKHAR; SONDHI, KARTIK; MAKALA, RAGHUVEER S.; KANAKAMEDALA, SENAKA
To: WESTERN DIGITAL TECHNOLOGIES, INC.,
Reel/Frame 064275/0442 →
Assignment of Assignor's Interest Jul 15, 2023
From: SHARANGPANI, RAHUL; KANAKAMEDALA, SENAKA; MAKALA, RAGHUVEER S.; TIRUKKONDA, ROSHAN JAYAKHAR
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 064275/0472 →
Patent Collateral Agreement - a&R Loan Agreement Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
Patent Collateral Agreement - Ddtl Loan Agreement Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
Corrective Assignment to Correct the 9TH Application Number Should Be Deleted Previously Recorded at Reel: 064275 Frame: 0472. Assignor(S) Hereby Confirms the Assignment. Dec 28, 2023
From: SHARANGPANI, RAHUL; KANAKAMEDALA, SENAKA; MAKALA, RAGHUVEER S.; TIRUKKONDA, ROSHAN J.
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 066141/0921 →
Corrective Assignment to Correct the Conveying Party Data, Receiving Party Data Previously Recorded at Reel: 66141 Frame: 473. Assignor(S) Hereby Confirms the Assignment. Mar 18, 2024
From: OKAMOTO, KATSUFUMI; TITUS, MONICA
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 066816/0838 →
Corrective Assignment to Correct the Inventors Execution Date and Assignee's Name and Address Previously Recorded at Reel: 66141 Frame: 473. Assignor(S) Hereby Confirms the Assignment . Mar 18, 2024
From: TIRUKKONDA, ROSHAN JAYAKHAR; KANAKAMEDALA, SENAKA; SHARANGPANI, RAHUL; MAKALA, RAGHUVEER S.
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 066816/0822 →
Assignment of Assignor's Interest May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
Change of Name Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
Patent Collateral Agreement Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
Assignment of Assignor's Interest Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →