Patent Assignment
Reel/Frame 072333/0665
Assignment of Assignor's Interest
Recorded: 2025-09-22
Pages: 11
Assignors
AGGARWAL, ANKUR
Executed: 2025-09-04
POTHUKUCHI, SURESH VENKATA
Executed: 2025-09-04
RATHI, ANMOL
Executed: 2025-09-04
Assignee
CELESTIAL AI INC.
2962 BUNKER HILL LANE, SUITE 200, SANTA CLARA, CALIFORNIA, 95054
Covered Properties
(14)
Converting Processing Dimensions of a Wafer Package
Converting Processing Dimensions of a Wafer Package
Application:
19/097,737 →
Publication:
US 2025/0370201
Packaging Optical Components in a Circuit Package
Application:
19/097,749 →
Publication:
US 2025/0370205
Packaging Optical Components in a Circuit Package
Application:
19/097,751 →
Publication:
US 2025/0370202
Preserving Access to Optical Components on a Wafer Package with Sacrificial Die
Application:
19/098,959 →
Publication:
US 2025/0372586
Preserving Access to Optical Components on a Wafer Package with Sacrificial Die
Preserving Access to Optical Components on a Wafer Package with Sacrificial Cap
Preserving Access to Optical Components on a Wafer Package with Sacrificial Cap
Application:
19/170,664 →
Publication:
US 2025/0370204
Preserving Access to Edge Coupling Components on a Wafer Package
Preserving Access to Edge Coupling Components on a Wafer Package
Application:
19/172,495 →
Publication:
US 2025/0370198
Electro-Optical Memory Circuit Package
Application:
19/192,020 →
Publication:
US 2025/0372587
Electro-Optical Memory Circuit Package
Application:
19/192,050 →
Publication:
US 2025/0370183
Electro-Optical Memory Circuit Package
Application:
19/192,064 →
Publication:
US 2025/0372590
Packaging Optical Components
Application:
63/694,684 →
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.