IP Library › Assignment 075999/0354
Patent Assignment
Reel/Frame 075999/0354

Release of Security Interest in Intellectual Property

Recorded: 2026-07-13 Pages: 8
Assignor
CITIBANK, N.A.
Executed: 2026-07-13
Assignee
SK SILTRON CSS, LLC
1311 STRAITS DR., BAY CITY, MICHIGAN, 48706
Covered Properties (13)
High Voltage Power Semiconductor Devices on Sic
Patent: 8,860,040 →
Application: 13/959,855 →
Publication: US US20140070234A1
Graphite Crucible for Sublimation Growth of Sic Crystal
Application: 15/419,993 →
Publication: US US20170137963A1
Furnace for Seeded Sublimation of Wide Band Gap Crystals
Application: 15/548,082 →
Publication: US US20180002828A1
Method to Manufacture Large Uniform Ingots of Silicon Carbide by Sublimation/Condensation Processes
Patent: 8,765,091 →
Application: 12/744,532 →
Publication: US US20120114545A1
Method of Manufacturing Substrates Having Improved Carrier Lifetimes
Patent: 9,337,027 →
Application: 13/745,066 →
Publication: US US20140203297A1
Method of Reducing Memory Effects in Semiconductor Epitaxy
Patent: 8,343,854 →
Application: 12/993,938 →
Publication: US US20110073874A1
Flat Sic Semiconductor Substrate
Patent: 9,018,639 →
Application: 13/959,896 →
Publication: US US20140117380A1
Method to Reduce Dislocations in Sic Crystal Growth
Patent: 9,017,804 →
Application: 13/937,149 →
Publication: US US20140220325A1
SiC SUBSTRATE WITH SiC EPITAXIAL FILM
Patent: 8,940,614 →
Application: 14/213,888 →
Publication: US US20140264384A1
Method for Manufacturing Sic Wafer Fit for Integration with Power Device Manufacturing Technology
Patent: 9,279,192 →
Application: 14/585,101 →
Publication: US US20160032486A1
A Method for Growing a Sic Crystal by Vapor Deposition Onto a Seed Crystal Provided on a Support Shelf Which Permits Thermal Expansion
Patent: 9,797,064 →
Application: 14/058,167 →
Publication: US US20140220296A1
Method for Manufacturing Sic Wafer Fit for Integration with Power Device Manufacturing Technology
Application: 15/061,959 →
Publication: US US20160189956A1
Furnace for Seeded Sublimation of Wide Band Gap Crystals
Application: 16/504,172 →
Publication: US US20190330763A1
Related Assignments (22)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 22, 2010
From: LOBODA, MARK
To: DOW CORNING CORPORATION
Reel/Frame 025391/0084 →
Assignment of Assignor's Interest Feb 26, 2013
From: CHUNG, GILYONG; LOBODA, MARK
To: DOW CORNING CORPORATION
Reel/Frame 029876/0702 →
Assignment of Assignor's Interest Jul 8, 2013
From: LOBODA, MARK
To: DOW CORNING CORPORATION
Reel/Frame 030754/0024 →
Assignment of Assignor's Interest Aug 6, 2013
From: LOBODA, MARK; CHUNG, GILYONG
To: DOW CORNING CORPORATION
Reel/Frame 030947/0815 →
Assignment of Assignor's Interest Aug 6, 2013
From: LOBODA, MARK; PARFENIUK, CHRISTOPHER
To: DOW CORNING CORPORATION
Reel/Frame 030947/0925 →
Assignment of Assignor's Interest Oct 18, 2013
From: LOBODA, MARK; DRACHEV, ROMAN; HANSEN, DARREN; SANCHEZ, EDWARD
To: DOW CORNING CORPORATION
Reel/Frame 031439/0579 →
Assignment of Assignor's Interest Dec 8, 2014
From: LOBODA, MARK; ZHANG, JIE
To: DOW CORNING CORPORATION
Reel/Frame 034424/0661 →
Assignment of Assignor's Interest Feb 9, 2015
From: HANSEN, DARREN; LOBODA, MARK; MANNING, IAN; MOEGGENBORG, KEVIN
To: DOW CORNING CORPORATION
Reel/Frame 034923/0503 →
Assignment of Assignor's Interest Mar 4, 2016
From: HANSEN, DARREN; LOBODA, MARK; MANNING, IAN; MOEGGENBORG, KEVIN
To: DOW CORNING CORPORATION
Reel/Frame 037899/0129 →
Assignment of Assignor's Interest Jan 30, 2017
From: LOBODA, MARK; DRACHEV, ROMAN; HANSEN, DARREN; SANCHEZ, EDWARD
To: DOW CORNING CORPORATION
Reel/Frame 041126/0748 →
Assignment of Assignor's Interest Aug 1, 2017
From: LOBODA, MARK
To: DOW CORNING CORPORATION
Reel/Frame 043161/0759 →
Change of Name Feb 27, 2018
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 045460/0278 →
Change of Name Feb 28, 2018
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 045470/0188 →
Assignment of Assignor's Interest Jul 5, 2019
From: LOBODA, MARK
To: DOW CORNING CORPORATION
Reel/Frame 049677/0592 →
Change of Name Sep 4, 2019
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 050269/0184 →
Assignment of Assignor's Interest Sep 5, 2019
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 050296/0365 →
Assignment of Assignor's Interest Sep 10, 2019
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 050326/0889 →
Assignment of Assignor's Interest Nov 14, 2019
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 051005/0941 →
Assignment of Assignor's Interest Nov 14, 2019
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 051006/0041 →
Assignment of Assignor's Interest Mar 12, 2020
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 052162/0001 →
Assignment of Assignor's Interest Mar 30, 2020
From: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
To: SK SILTRON CSS, LLC
Reel/Frame 052264/0831 →
Intellectual Property Security Agreement Nov 25, 2024
From: SK SILTRON CSS, LLC
To: CITIBANK, N.A.
Reel/Frame 069440/0523 →