Silicon carbide semiconductor devices with a regrown contact layer
View Patent ↗Silicon carbide semiconductor devices having regrown layers and methods of fabricating the same in a self-aligned manner. According to one aspect of the invention, the method includes growing at least one layer of silicon carbide on a substrate, removing the device from a growth chamber to perform at least one processing step, and regrowing another layer of silicon carbide on the at least one layer. According to one embodiment of the invention, the regrown layer may be a heavily doped contact layer for the formation of low resistivity ohmic contacts.
1. A method of forming a semiconductor device from Silicon Carbide (SiC), the method comprising the steps of:
growing on a substrate at least a first layer of SiC material having a p-conductivity type in a growth chamber;
removing the device from the growth chamber to perform at least one process on the device; and
subsequent to said removing, regrowing a layer of SiC material having said p-conductivity type on the first layer.
2. The method of claim 1 , the method comprising:
forming at least one ohmic contact on the device.
3. The method of claim 1 , wherein the regrowing step comprises:
regrowing a highly doped contact layer.
4. The method of claim 3 , the method comprising:
subsequent to growing the first layer, growing a second layer on the first layer.
5. The method of claim 4 , wherein the first layer includes a first conductivity type and the second layer includes a second conductivity type different from the first conductivity type.
6. The method of claim 5 , the method further comprising:
automatically controlling relative spacing of the first layer, the second layer, and the contact layer as a result of a processing sequence to construct the device in a self-aligned manner.
7. The method of claim 5 , wherein the contact layer includes the second conductivity type and has a conductivity, free from any subsequent annealing, greater than that of the second layer.
8. The method of claim 3 , the method comprising:
selectively removing portions of the contact layer to form individual contact areas.
9. The method of claim 1 , wherein the regrowing step comprises:
regrowing the layer of SiC material on selective portions of the device.
10. The method of claim 1 , further comprising forming a radio frequency power device including said first layer and said regrown layer.
11. The method of claim 1 , further comprising forming a p-n junction including said first layer and said regrown layer.
12. The method of claim 1 , further comprising forming a transistor including said first layer and said regrown layer.
13. The method of claim 1 , further comprising forming a thyristor including said first layer and said regrown layer.
14. A method of forming a bipolar transistor in Silicon Carbide (SiC), the method comprising:
growing a first layer of SiC material having a first conductivity type on a substrate, a second layer of SiC material having a second conductivity type on the first layer, and a third layer of SiC material having the first conductivity type on the second layer;
exposing a portion of the second layer of SiC material; and
regrowing a layer of SIC material on the exposed portion of the second layer of SiC material.
15. The method of claim 14 , the method further comprising:
forming at least one ohmic contact on the regrown layer.
16. The method of claim 14 , the method further comprising:
automatically controlling relative spacing of the first layer, the second layer, the third layer, and the regrown layer as a result of a processing sequence to construct the transistor in a self-aligned manner.
17. The method of claim 14 , wherein the regrown layer includes the second conductivity type and has a conductivity, free from any subsequent annealing, greater than that of the second layer.
18. The method of claim 14 , wherein the exposing step comprises:
patterning at least one pillar in the third layer.
19. The method of claim 15 , wherein the regrowing step comprises:
regrowing the layer of SiC material on the third layer and the exposed portion of the second layer; and
removing the regrown layer from the third layer.
20. The method of claim 14 , wherein the regrowing step comprises:
selectively regrowing the layer of SiC material on the exposed portion of the second layer.
21. The method of claim 16 , wherein the step of automatically controlling relative spacing comprises:
utilizing planarization to expose predetermined portions of the device to one of an etching process and a deposition process.
22. The method of claim 19 , wherein the step of forming the at least one ohmic contact comprises:
prior to removing the regrown layer from the third layer, depositing a metal layer on the contact layer;
removing the regrown layer and the metal layer to expose the third layer; and
forming the at least one ohmic contact on the metal layer.
23. The method of claim 22 , the method comprising:
forming another ohmic contact on the exposed third layer.
24. A method of forming a bipolar junction transistor from Silicon Carbide (SiC), the method comprising the steps of:
forming a multi-layer structure including a base layer formed from SiC disposed between an emitter layer formed from SiC and a collector layer formed from SiC, wherein the base layer has a first conductivity and the emitter and collector layers have a second conductivity opposite the base layer conductivity;
patterning at least one mesa structure in the emitter layer, wherein the mesa structure-patterning step exposes a portion of the base layer;
regrowing a contact layer of SiC on the exposed portion of the base layer; and
forming at least one ohmic contact on the contact layer.
25. The method of claim 24 , the method further comprising:
automatically controlling relative spacing of the base layer, the emitter layer, collector layer, the contact layer, and the at least one ohmic contact as a result of a processing sequence to construct the device in a self-aligned manner.
26. The method of claim 25 , wherein the step of automatically controlling relative spacing comprises:
utilizing planarization to expose predetermined portions of the device to one of an etching process and a deposition process.
27. The method of claim 25 , comprising:
providing an ohmic contact on the mesa structure.
28. A method as set forth in claim 1 , further comprising the step of patterning said first layer of SiC prior to said regrowing.
29. A method for use in forming a Silicon Carbide (SiC) product, comprising the steps of:
forming, on a first substrate, a first bipolar device including a first layer and a third layer of SiC material, each having a first conductivity type, and a second layer of SiC material having a second conductivity type, said second layer being disposed between said first and third layers; and
forming, on said first substrate, a second bipolar device including a fourth layer and a sixth layer of SiC material, each having a first conductivity type, and a fifth layer of SiC material having a second conductivity type, said fifth layer being disposed between said fourth and sixth layers,
wherein said first and second bipolar devices are substantially electrically isolated from one another.
30. A method as set forth in claim 29 , wherein each of said steps of forming a first bipolar device and forming a second bipolar device comprises forming a transistor.
31. A method as set forth in claim 29 , wherein each of said steps of forming a first bipolar device and forming a second bipolar device comprises forming a device on a semi-insulating substrate.
32. A method as set forth in claim 29 , wherein each of said steps of forming a first bipolar device and forming a second bipolar device comprises forming a device on a SiC substrate.
33. A method as set forth in claim 29 , wherein said step of forming a first bipolar device comprises forming a first collector contact and said step of forming a second bipolar device comprises forming a second collector contact electrically separated from said first collector contact.
34. A method as set forth in claim 33 , further comprising the step of electrically isolating said first collector contact from said second collector contact.
35. A method as set forth in claim 34 , wherein said step of electrically isolating comprises etching a collector layer.
36. A method as set forth in claim 34 , wherein said step of electrically isolating comprises processing a portion of a collector layer such that said portion is rendered insulating.
37. A method as set forth in claim 29 , wherein said steps of forming a first bipolar device and forming a second bipolar device are conducted concurrently.