Low surface energy CMP pad
View Patent ↗The invention provides a polishing pad substrate comprising a copolymer, wherein the copolymer has at least one hydrophilic repeat unit and at least one hydrophobic repeat unit. The invention also provides a polishing pad substrate comprising a polymer, wherein the polymer is a modified polymer having at least one hydrophilic unit and at least one hydrophobic unit attached to the polymer chain. The invention further provides a method of polishing a workpiece comprising (i) providing a workpiece to be polished, (ii) contacting the workpiece with a chemical-mechanical polishing system comprising the polishing pad substrate of the invention, and (iii) abrading at least a portion of the surface of the workpiece with the polishing system to polish the workpiece.
1. A polishing pad substrate for use in chemical-mechanical polishing comprising a copolymer, wherein the copolymer has at least one hydrophilic repeat unit and at least one hydrophobic repeat unit, and wherein the polishing pad substrate has a surface energy of about 34 mN/m or less.
2. The polishing pad substrate of claim 1 , wherein the hydrophilic repeat unit is selected from the group consisting of esters, ethers, acrylic acids, acrylamides, amides, imides, vinylalcohols, vinylacetates, acrylates, methacrylates, sulfones, urethanes, vinylchlorides, etheretherketones, carbonates, and oligomers and combinations thereof.
3. The polishing pad substrate of claim 1 , wherein the hydrophilic repeat unit is urethane.
4. The polishing pad substrate of claim substrate 1 , wherein the hydrophobic repeat unit is selected from the group consisting of fluorocarbons, tetrafluoroethylenes, vinylfluorides, siloxanes, dimethylsiloxanes, butadiene, ethylene, olefins, styrene, propylene, and oligomers and combinations thereof.
5. The polishing pad substrate of claim 1 , wherein the hydrophobic repeat unit is fluorocarbon or siloxane.
6. The polishing pad substrate of claim 1 , wherein the polishing pad substrate is a solid, non-porous polishing pad substrate.
7. The polishing pad substrate of claim 1 , wherein the polishing pad substrate has a density of about 90% or more of the maximum theoretical density of the copolymer.
8. The polishing pad substrate of claim 1 , wherein the polishing pad substrate is a porous polishing pad substrate.
9. The polishing pad substrate of claim 8 , wherein the polishing pad substrate has a density of about 70% or less of the maximum theoretical density of the copolymer.
10. The polishing pad substrate of claim 8 , wherein the polishing pad substrate has a void volume of about 75% or less.
11. The polishing pad substrate of claim 1 , wherein the polishing pad substrate is a polishing layer.
12. The polishing pad substrate of claim 11 , wherein the polishing layer further comprises grooves.
13. The polishing pad substrate of claim 1 , wherein the polishing pad substrate is a subpad.
14. The polishing pad substrate of claim 1 , wherein the polishing pad substrate further comprises an optically transmissive region.
15. The polishing pad substrate of claim 14 , wherein the optically transmissive region has a light transmission of at least 10% at one or more wavelengths between from about 190 nm to about 3500 nm.
16. The polishing pad substrate of claim 14 , wherein the optically transmissive region comprises the copolymer.
17. The polishing pad substrate of claim 1 , wherein the polishing pad substrate further comprises abrasive particles.
18. The polishing pad substrate of claim 17 , wherein the abrasive particles comprise metal oxide selected from the group consisting of alumina, silica, titania, ceria, zirconia, germania, magnesia, co-formed products thereof, and combinations thereof.
19. A polishing pad substrate for use in chemical-mechanical polishing comprising a polymer, wherein the polymer has at least one hydrophilic unit and at least one hydrophobic unit attached to the polymer chain, and wherein the polishing pad substrate has a surface energy of about 34 mN/m or less.
20. The polishing pad substrate of claim 19 , wherein the polymer is a thermoplastic polymer or a thermoset polymer.
21. The polishing pad substrate of claim 20 , wherein the thermoplastic polymer or the thermoset polymer is selected from the group consisting of polyurethanes, polyolefins, polyvinylalcohols, polyvinylacetates, polycarbonates, polyacrylic acids, polyacrylamides, polyethylenes, polypropylenes, nylons, fluorocarbons, polyesters, polyethers, polyamides, polyimides, polytetrafluoroethylenes, polyetheretherketones, copolymers thereof, and mixtures thereof.
22. The polishing pad substrate of claim 21 , wherein the thermoplastic polymer or the thermoset polymer is selected from the group consisting of polyurethanes and polyolefins.
23. The polishing pad substrate of claim 19 , wherein the hydrophilic unit is selected from the group consisting of esters, ethers, acrylic acids, acrylamides, amides, imides, vinylalcohols, vinylacetates, acrylates, methacrylates, sulfones, urethanes, vinylchlorides, etheretherketones, carbonates, and oligomers and combinations thereof.
24. The polishing pad substrate of claim 19 , wherein the hydrophilic unit is urethane.
25. The polishing pad substrate of claim substrate 19 , wherein the hydrophobic unit is selected from the group consisting of fluorocarbons, tetrafluoroethylenes,vinylfluorides, siloxanes, dimethylsiloxanes, butadiene, ethylene, olefins, styrene, propylene, and oligomers and combinations thereof.
26. The polishing pad substrate of claim 19 , wherein the hydrophobic unit is fluorocarbon or siloxane.
27. The polishing pad substrate of claim 19 , wherein the at least one hydrophilic unit and the at least one hydrophobic unit are attached to a terminal repeat unit of the polymer chain.
28. The polishing pad substrate of claim 19 , wherein the polishing pad substrate is a solid, non-porous polishing pad substrate.
29. The polishing pad substrate of claim 19 , wherein the polishing pad substrate has a density of about 90% or more of the maximum theoretical density of the copolymer.
30. The polishing pad substrate of claim 19 , wherein the polishing pad substrate is a porous polishing pad substrate.
31. The polishing pad substrate of claim 30 , wherein the polishing pad substrate has a density of about 70% or less of the maximum theoretical density of the polymer.
32. The polishing pad substrate of claim 30 , wherein the polishing pad substrate has a void volume of about 75% or less.
33. The polishing pad substrate of claim 19 , wherein the polishing pad substrate is a polishing layer.
34. The polishing pad substrate of claim 33 , wherein the polishing layer further comprises grooves.
35. The polishing pad substrate of claim 19 , wherein the polishing pad substrate is a subpad.
36. The polishing pad substrate of claim 19 , wherein the polishing pad substrate further comprises an optically transmissive region.
37. The polishing pad substrate of claim 36 , wherein the optically transmissive region has a light transmission of at least 10% at one or more wavelengths between from about 190 nm to about 3500 nm.
38. The polishing pad substrate of claim 36 , wherein the optically transmissive region comprises the polymer having at least one hydrophilic unit and at least one hydrophobic unit attached to the polymer chain.
39. The polishing pad substrate of claim 19 , wherein the polishing pad substrate further comprises abrasive particles.
40. The polishing pad substrate of claim 39 , wherein the abrasive particles comprise metal oxide selected from the group consisting of alumina, silica, titania, ceria, zirconia, germania, magnesia, co-formed products thereof, and combinations thereof.