IP Library › Granted Patent US 7,504,044
Granted Patent B2
US 7,504,044 · App. 10/982,486 · Granted Mar 17, 2009

Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios

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Quick Facts
Patent No.
US 7,504,044
App. No.
10/982,486
Granted
Mar 17, 2009
Kind
B2
Abstract

The invention provides a chemical-mechanical polishing composition comprising a cationic abrasive, a cationic polymer, a carboxylic acid, and water. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition. The polishing composition exhibits selectivity for removal of silicon nitride over removal of silicon oxide.

Claims (14)

1. A chemical-mechanical polishing composition comprising:

(a) a cationic abrasive,

(b) about 0.1 ppm to about 200 ppm of a cationic copolymer comprising at least one cationic monomer and at least one nonionic monomer, wherein the at least one cationic monomer comprises 50% or less of the copolymer on a molar basis, and

(c) water,

wherein the polishing composition has a pH of about 6 or less, and wherein the cationic copolymer comprises diallyldimethylammonium chloride acrylamide.

2. The polishing composition of claim 1 ,wherein the cationic abrasive is selected from the group consisting of alumina, titania, and doped silica.

3. The polishing composition of claim 1 , wherein the cationic abrasive is ceria.

4. The polishing composition of claim 1 , wherein the cationic abrasive is zircoma.

5. The polishing composition of claim 1 , wherein the cationic abrasive is present in an amount of about 0.01 wt. % to about 1 wt. %.

6. The polishing composition of claim 1 , wherein the cationic polymer has an average molecular weight of about 5000 Daltons or more.

7. The polishing composition of claim 6 , wherein the cationic polymer comprises nitrogen, sulfonium groups, phosphonium groups, or a combination thereof.

8. The polishing composition of claim 1 , wherein the pH is about 4 to about 6.

9. The polishing composition of claim 1 , wherein the polishing composition further comprises a carboxylic acid.

10. The polishing composition of claim 9 , wherein the carboxylic acid is an amino carboxylic acid.

Assignments (10)
CHANGE OF NAME Recorded Nov 22, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065663/0466 →
CHANGE OF NAME Recorded Nov 8, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065517/0783 →
SECURITY INTEREST Recorded Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
SECURITY INTEREST Recorded Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
RELEASE OF SECURITY INTEREST Recorded Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; KMG-BERNUTH, INC.; MPOWER SPECIALTY CHEMICALS LLC; SEALWELD (USA), INC.; INTERNATIONAL TEST SOLUTIONS, LLC; CMC MATERIALS, INC.
Reel/Frame 060592/0260 →
CHANGE OF NAME Recorded Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
SECURITY AGREEMENT Recorded Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; MPOWER SPECIALTY CHEMICALS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
RELEASE OF SECURITY INTEREST Recorded Nov 16, 2018
From: BANK OF AMERICA, N.A.
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 047587/0119 →
NOTICE OF SECURITY INTEREST IN PATENTS Recorded Feb 16, 2012
From: CABOT MICROELECTRONICS CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 027727/0275 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2004
From: CARTER, PHILLIP W.; JOHNS, TIMOTHY P.
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 015465/0441 →