IP Library Granted Patent US 7,311,856
Granted Patent B2
US 7,311,856 · App. 11/093,806 · Granted Dec 25, 2007

Polymeric inhibitors for enhanced planarization

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Quick Facts
Patent No.
US 7,311,856
App. No.
11/093,806
Granted
Dec 25, 2007
Kind
B2
Abstract

The invention provides a chemical-mechanical polishing system comprising a polishing component, a surfactant, and a liquid carrier. The invention further provides a method of chemically-mechanically polishing a substrate with the polishing system.

Claims (120)

1. A chemical-mechanical polishing system comprising:

(a) a polishing component selected from the group consisting of a polishing pad, an abrasive, and a combination thereof,

(b) a surfactant comprising at least one azole group having a polymer chain attached thereto, wherein the surfactant is not polyvinylimidazole and wherein the surfactant does not comprise cyclic imide groups or both pendant amide and ester groups, and

(c) a liquid carrier.

2. The polishing system of claim 1 , wherein the at least one azole group is selected from the group consisting of 1,2,3-triazole, 1,2,4-triazole, pyrazole, imidazole, indazole, tetrazole, benzimidazole, benzotriazole, alkylated derivatives thereof, and combinations thereof.

3. The polishing system of claim 1 , wherein the surfactant comprises at least one azole group having a polyether chain attached thereto.

4. The polishing system of claim 1 , wherein the surfactant comprises at least one azole group having a polyacrylate chain attached thereto.

5. The polishing system of claim 3 , wherein the surfactant comprises a compound of the formula Het-X—(CH 2 CH 2 O) m (CH 2 CHR 1 O) n R 2 , wherein

Het is a heterocycle selected from the group consisting of 1,2,3-triazole, 1,2,4-triazole, pyrazole, imidazole, indazole, tetrazole, benzimidazole, and benzotriazole chemically bonded to X via a carbon atom of the heterocycle or a nitrogen atom which is part of the heterocycle;

X is (CH 2 ) p wherein p is an integer of 1-5, O, C(═O)O, CH 2 O, CH 2 CH 2 O, or a direct link;

m and n are integers from 0-20 with the proviso that m and n are not both 0;

R 1 is selected from the group consisting of H and C 1 -C 10 branched and straight chain alkyl and alkenyl; and

R 2 is selected from the group consisting of H, C 1 -C 10 branched and straight chain alkyl and alkenyl, and C 3 -C 10 cycloalkyl.

6. The polishing system of claim 1 , wherein the surfactant comprises at least one azole group having a polyamine chain attached thereto.

7. The polishing system of claim 6 , wherein the surfactant comprises a compound of the formula Het-X—(CH 2 CH 2 NR 3 ) n R 4 , wherein

Het is a heterocycle selected from the group consisting of 1,2,3-triazole, 1,2,4-triazole, pyrazole, imidazole, indazole, tetrazole, benzimidazole, and benzotriazole chemically bonded to X via a carbon atom of the heterocycle or a nitrogen atom which is part of the heterocycle;

X is selected from the group consisting of (CH 2 ) m wherein m is an integer of 1-5, NH, C(═O)NH, CH 2 NH, CH 2 CH 2 NH, and a direct link;

n is an integer from 1-20;

R 3 is H or (CH 2 CH 2 NHR 5 2 ) p wherein R 5 is a C 1 -C 5 branched and straight chain alkyl and p is an integer of 1-5; and

R 4 is selected from the group consisting of H, C 1 -C 10 branched and straight chain alkyl and alkenyl, and C 3 -C 10 cycloalkyl.

8. The polishing system of claim 1 , wherein the surfactant comprises a compound of the formula Het 1 -X—(CH 2 CHR 6 Z) n —Y-Het 2 , wherein

Het 1 and Het 2 are independently selected from the group consisting of 1,2,3-triazole, 1,2,4-triazole, pyrazole, imidazole, indazole, tetrazole, benzimidazole, and benzotriazole wherein Het 1 is chemically bonded to X, and wherein Het 2 is chemically bonded to Y via a carbon atom of the heterocycle or a nitrogen atom which is part of the heterocycle;

X is (CH 2 ) m wherein m is an integer of 1-5, Z, C(═O)Z, CH 2 Z, or a direct link;

n is an integer from 1-20;

R 6 is selected from the group consisting of H, C 1 -C 10 branched and straight chain alkyl and, when Z is N, (CH 2 CH 2 NR 7 2 ) m wherein R 7 is a C 1 -C 5 branched and straight chain alkyl and m is an integer of 1-5;

Y is (CH 2 ) m wherein m is as defined above, C(═O), or a direct link; and

Z is O or NR 1 , wherein R 1 is selected from the group consisting of H and C 1 -C 10 branched and straight chain alkyl and alkenyl.

9. The polishing system of claim 1 , wherein the surfactant comprises a polymer comprising three or more azole groups.

10. The polishing system of claim 9 , wherein the polymer comprises a polyester comprising monomers comprising at least one dicarboxylic acid and at least one diol, wherein the at least one dicarboxylic acid and/or diol comprises azole groups.

11. The polishing system of claim 9 , wherein the surfactant comprises about 20% or less of monomers comprising azole groups.

12. The polishing system of claim 10 , wherein the polyester comprises 1,2,3-triazole-4,5-dicarboxylic acid repeating groups.

13. The polishing system of claim 9 , wherein the polymer comprises a polyamide comprising monomers comprising at least one dicarboxylic acid and at least one diamine, wherein the at least one dicarboxylic acid and/or diamine comprises azole groups.

14. The polishing system of claim 13 , wherein the polyamide comprises 1,2,3-triazole-4,5-dicarboxylic acid repeating groups.

15. The polishing system of claim 9 , wherein the polymer comprises a polyamine comprising three or more azole groups.

16. The polishing system of claim 9 , wherein the polymer comprises chemical components A, B, and C; wherein

A is selected from the group consisting of one or more end groups selected from initiator fragments, chain transfer fragments, solvent fragments, and combinations thereof;

B is absent or is at least one ethylenically unsaturated monomer of the formula Het-W—CR 8 ═C(R 9 )(R 10 ), wherein Het is a heterocycle selected from the group consisting of 1,2,3-triazole, 1,2,4-triazole, pyrazole, imidazole, indazole, tetrazole, benzimidazole, and benzotriazole chemically bonded to W via a carbon atom of the heterocycle or a nitrogen atom which is part of the heterocycle;

W is (CH 2 ) n wherein n is an integer of 1-10 or a direct link;

R 8 is H or C 1 -C 10 branched and straight chain alkyl and alkenyl;

R 9 and R 10 are independently selected from the group consisting of H, C 1 -C 10 branched and straight chain alkyl and alkenyl, C 3 -C 10 cycloalkyl, and C 6 -C 10 aryl; with the proviso that if C is absent then R 8 , R 9 , and R 10 are not H, and

C is absent or includes an ethylenically unsaturated group of the formula CH(R 11 )═C(R 12 )(R 13 ),

wherein R 11 is selected from the group consisting of H, C 1 -C 10 branched and straight chain alkyl and alkenyl, C 3 -C 10 cycloalkyl, and Het-W wherein Het and W are as defined above;

R 12 and R 13 are independently selected from the group consisting of H, C 1 -C 5 branched and straight-chain alkyl and alkenyl, phenyl, substituted phenyl, COR 14 , and Het-W wherein Het and W are as defined above,

wherein R 14 is H, alkyl, OR 15 , or NR 16 R 17 ,

wherein R 15 is H or C 1 -C 5 branched and straight chain alkyl,

wherein R 16 and R 17 are independently H, C 1 -C 10 branched and straight chain alkyl, CN, or taken together form a 5-membered or 6-membered ring structure,

with the proviso that at least one of B and C comprises a heterocycle as defined herein.

17. The polishing system of claim 16 , wherein C comprises an ethylenically unsaturated group of the formula CH(R 11 )═C(R 12 )(R 13 ),

wherein R 11 is selected from the group consisting of H, C 1 -C 10 branched and straight chain alkyl and alkenyl, and C 3 -C 10 cycloalkyl,

wherein R 12 is COOR 15 wherein R 15 is as defined herein, and

wherein R 13 is selected from the group consisting of H, C 1 -C 5 branched and straight chain alkyl, phenyl, and substituted phenyl.

18. The polishing system of claim 1 , wherein the polymer comprises a hydrophilic polymer or copolymer functionalized with azole groups.

19. The polishing system of claim 18 , wherein the polymer comprises polyvinyl alcohol functionalized with azole groups.

20. The polishing system of claim 1 , wherein the azole group comprises at least a part of the polymer backbone.

21. The polishing system of claim 1 , wherein the polishing system further comprises an abrasive suspended in the liquid carrier.

22. The polishing system of claim 21 , wherein the abrasive is selected from the group consisting of alumina, ceria, germania, magnesia, silica, titania, zirconia, co-formed products thereof, and combinations thereof.

23. The polishing system of claim 1 , wherein the polishing system comprises an abrasive fixed on a polishing pad.

24. The polishing system of claim 1 , wherein the polishing system further comprises one or both of an oxidizing agent and a chelating agent.

25. A method of chemically-mechanically polishing a substrate, comprising:

(i) contacting a substrate with a polishing system comprising:

(a) a polishing component selected from the group consisting of a polishing pad, an abrasive, and a combination thereof,

(b) a surfactant comprising at least one azole group having a polymer chain attached thereto, wherein the surfactant is not polyvinylimidazole and wherein the surfactant does not comprise cyclic imide groups or both of pendant amide and ester groups, and

(c) a liquid carrier,

(ii) moving the polishing pad relative to the substrate, and

(iii) abrading at least a portion of the substrate to polish the substrate.

26. The method of claim 25 , wherein the at least one azole group is selected from the group consisting of 1,2,3-triazole, 1,2,4-triazole, pyrazole, imidazole, indazole, tetrazole, benzimidazole, benzotriazole, alkylated derivatives thereof, and combinations thereof.

27. The method of claim 25 , wherein the surfactant comprises at least one azole group having a polyether chain attached thereto.

28. The method of claim 25 , wherein the surfactant comprises at least one azole group having a polyacrylate chain attached thereto.

29. The method of claim 27 , wherein the surfactant comprises a compound of the formula Het-X—(CH 2 CH 2 O) m (CH 2 CHR 1 O) n R 2 , wherein

Het is a heterocycle selected from the group consisting of 1,2,3-triazole, 1,2,4-triazole, pyrazole, imidazole, indazole, tetrazole, benzimidazole, and benzotriazole chemically bonded to X via a carbon atom of the heterocycle or a nitrogen atom which is part of the heterocycle;

X is (CH 2 ) p wherein p is an integer of 1-5, O, C(═O)O, CH 2 O, CH 2 CH 2 O, or a direct link;

m and n are integers from 0-20 with the proviso that m and n are not both 0;

R 1 is selected from the group consisting of H and C 1 -C 10 branched and straight chain alkyl and alkenyl; and

R 2 is selected from the group consisting of H, C 1 -C 10 branched and straight chain alkyl and alkenyl, and C 3 -C 10 cycloalkyl.

30. The method of claim 25 , wherein the surfactant comprises at least one azole group having a polyamine chain attached thereto.

31. The method of claim 30 , wherein the surfactant comprises a compound of the formula Het-X—(CH 2 CH 2 NR 3 ) n R 4 , wherein

Het is a heterocycle selected from the group consisting of 1,2,3-triazole, 1,2,4-triazole, pyrazole, imidazole, indazole, tetrazole, benzimidazole, and benzotriazole chemically bonded to X via a carbon atom of the heterocycle or a nitrogen atom which is part of the heterocycle;

X is selected from the group consisting of (CH 2 ) m wherein m is an integer of 1-5, NH, C(═O)NH, CH 2 NH, CH 2 CH 2 NH, and a direct link;

n is an integer from 1-20;

R 3 is H or (CH 2 CH 2 NHR 5 2 ) p wherein R 5 is a C 1 -C 5 branched and straight chain alkyl and p is an integer of 1-5; and

R 4 is selected from the group consisting of H, C 1 -C 10 branched and straight chain alkyl and alkenyl, and C 3 -C 10 cycloalkyl.

32. The method of claim 25 , wherein the surfactant comprises a compound of the formula Het 1 -X—(CH 2 CHR 6 Z) n —Y-Het 2 , wherein

Het 1 and Het 2 are independently selected from the group consisting of 1,2,3-triazole, 1,2,4-triazole, pyrazole, imidazole, indazole, tetrazole, benzimidazole, and benzotriazole wherein Het 1 is chemically bonded to X, and wherein Het 2 is chemically bonded to Y via a carbon atom of the heterocycle or a nitrogen atom which is part of the heterocycle;

X is (CH 2 ) m wherein m is an integer of 1-5, Z, C(═O)Z, CH 2 Z, or a direct link;

n is an integer from 1-20;

R 6 is selected from the group consisting of H, C 1 -C 10 branched and straight chain alkyl and, when Z is N, (CH 2 CH 2 NR 7 2 ) m wherein R 7 is a C 1 -C 5 branched and straight chain alkyl and m is an integer of 1-5;

Y is (CH 2 ) m wherein m is as defined above, C(═O), or a direct link; and

Z is O or NR 1 , wherein R 1 is selected from the group consisting of H and C 1 -C 10 branched and straight chain alkyl and alkenyl.

33. The method of claim 25 , wherein the surfactant comprises a polymer comprising three or more azole groups.

34. The method of claim 33 , wherein the polymer comprises a polyester comprising monomers comprising at least one dicarboxylic acid and at least one diol, wherein the at least one dicarboxylic acid and/or diol comprises azole groups.

35. The method of claim 33 , wherein the surfactant comprises about 20% or less of monomers comprising azole groups.

36. The method of claim 34 , wherein the polyester comprises 1,2,3-triazole-4,5-dicarboxylic acid repeating groups.

37. The method of claim 33 , wherein the polymer comprises a polyamide comprising monomers comprising at least one dicarboxylic acid and at least one diamine, wherein the at least one dicarboxylic acid and/or diamine comprises azole groups.

38. The method of claim 37 , wherein the polyamide comprises 1,2,3-triazole-4,5-dicarboxylic acid repeating groups.

39. The method of claim 33 , wherein the polymer comprises a polyamine comprising three or more azole groups.

40. The method of claim 33 , wherein the polymer comprises chemical components A, B, and C; wherein

A is selected from the group consisting of one or more end groups selected from initiator fragments, chain transfer fragments, solvent fragments, and combinations thereof;

B is absent or is at least one ethylenically unsaturated monomer of the formula Het-W—CR 8 ═C(R 9 )(R 10 ), wherein Het is a heterocycle selected from the group consisting of 1,2,3-triazole, 1,2,4-triazole, pyrazole, imidazole, indazole, tetrazole, benzimidazole, and benzotriazole chemically bonded to W via a carbon atom of the heterocycle or a nitrogen atom which is part of the heterocycle;

W is (CH 2 ) n wherein n is an integer of 1-10 or a direct link;

R 8 is H or C 1 -C 10 branched and straight chain alkyl and alkenyl;

R 9 and R 10 are independently selected from the group consisting of H, C 1 -C 10 branched and straight chain alkyl and alkenyl, C 3 -C 10 cycloalkyl, and C 6 -C 10 aryl; with the proviso that if C is absent then R 8 , R 9 , and R 10 are not H, and

C is absent or includes an ethylenically unsaturated group of the formula CH(R 11 )═C(R 12 )(R 13 ),

wherein R 11 is selected from the group consisting of H, C 1 -C 10 branched and straight chain alkyl and alkenyl, C 3 -C 10 cycloalkyl, and Het-W wherein Het and W are as defined above;

R 12 and R 13 are independently selected from the group consisting of H, C 1 -C 5 branched and straight-chain alkyl and alkenyl, phenyl, substituted phenyl, COR 14 , and Het-W wherein Het and W are as defined above,

wherein R 14 is H, alkyl, OR 15 , or NR 16 R 17 ,

wherein R 15 is H or C 1 -C 5 branched and straight chain alkyl,

wherein R 16 and R 17 are independently H, C 1 -C 10 branched and straight chain alkyl, CN, or taken together form a 5-membered or 6-membered ring structure, with the proviso that at least one of B and C comprises a heterocycle as defined herein.

41. The method of claim 40 , wherein C comprises an ethylenically unsaturated group of the formula CH(R 11 )═C(R 12 )(R 13 ),

wherein R 11 is selected from the group consisting of H, C 1 -C 10 branched and straight chain alkyl and alkenyl, and C 3 -C 10 cycloalkyl,

wherein R 12 is COOR 15 wherein R 15 is as defined herein, and

wherein R 13 is selected from the group consisting of H, C 1 -C 5 branched and straight chain alkyl, phenyl, and substituted phenyl.

42. The method of claim 25 , wherein the polymer comprises a hydrophilic polymer or copolymer functionalized with azole groups.

43. The method of claim 42 , wherein the polymer comprises polyvinyl alcohol functionalized with azole groups.

44. The method of claim 25 , wherein the azole group comprises at least a part of the polymer backbone.

45. The method of claim 25 , wherein the polishing system further comprises an abrasive suspended in the liquid carrier.

46. The method of claim 45 , wherein the abrasive is selected from the group consisting of alumina, ceria, germania, magnesia, silica, titania, zirconia, co-formed products thereof, and combinations thereof.

47. The method of claim 25 , wherein the polishing system comprises an abrasive fixed on a polishing pad.

48. The method of claim 25 , wherein the polishing system further comprises one or both of an oxidizing agent and a chelating agent.

49. The method of claim 25 , wherein the substrate comprises one or both of a metallic layer and an insulating layer.

50. The method of claim 49 , wherein the metallic layer comprises copper.

Assignments (10)
CHANGE OF NAME Recorded Nov 22, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065663/0466 →
CHANGE OF NAME Recorded Nov 8, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065517/0783 →
SECURITY INTEREST Recorded Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
SECURITY INTEREST Recorded Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; KMG-BERNUTH, INC.; MPOWER SPECIALTY CHEMICALS LLC; SEALWELD (USA), INC.; INTERNATIONAL TEST SOLUTIONS, LLC; CMC MATERIALS, INC.
Reel/Frame 060592/0260 →
CHANGE OF NAME Recorded Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
RELEASE OF SECURITY INTEREST Recorded Nov 16, 2018
From: BANK OF AMERICA, N.A.
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 047587/0119 →
SECURITY AGREEMENT Recorded Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; MPOWER SPECIALTY CHEMICALS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
NOTICE OF SECURITY INTEREST IN PATENTS Recorded Feb 16, 2012
From: CABOT MICROELECTRONICS CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 027727/0275 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2006
From: CHERIAN, ISAAC K.; ZHOU, RENJIE; GRUMBINE, STEVEN K.; ZHANG, JIAN
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 017386/0593 →