IP Library › Granted Patent US 7,531,105
Granted Patent B2
US 7,531,105 · App. 11/294,853 · Granted May 12, 2009

Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios

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Quick Facts
Patent No.
US 7,531,105
App. No.
11/294,853
Granted
May 12, 2009
Kind
B2
Abstract

The invention provides a chemical-mechanical polishing composition comprising a cationic abrasive, a cationic polymer, an inorganic halide salt, and an aqueous carrier. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition. The polishing composition exhibits selectivity for removal of silicon nitride over removal of silicon oxide and polysilicon.

Claims (21)

1. A chemical-mechanical polishing (CMP) composition suitable for polishing a substrate comprising silicon, silicon nitride, and silicon dioxide, the composition comprising:

(a) a cationic abrasive present in the composition at about 2% by weight or less;

(b) a cationic polymer wherein the cationic polymer is a polydiallyldimethylammonium halide;

(c) an inorganic halide salt; and

(d) an aqueous carrier;

the composition having a pH of less than 7.

2. The composition of claim 1 wherein the cationic abrasive is selected from the group consisting of alumina, titania, zirconia, ceria, and doped silica.

3. The composition of claim 1 wherein the cationic abrasive is ceria.

4. The composition of claim 1 wherein the inorganic halide salt is ammonium chloride.

5. The composition of claim 1 wherein the cationic abrasive is present in the composition in an amount in the range of about 0.01 to about 1 percent by weight.

6. The composition of claim 1 wherein the cationic polymer is present in the composition in an amount in the range of about 0.1 to about 500 ppm.

7. The composition of claim 1 wherein the inorganic halide salt is present in the composition in an amount in the range of about 100 to about 1000 ppm.

8. The composition of claim 1 wherein the composition has a pH in the range of about 4 to about 6.

9. The composition of claim 1 wherein the composition further comprises an aminocarboxylic acid.

10. A chemical-mechanical polishing composition suitable for polishing substrates comprising silicon, silicon nitride, and silicon dioxide, the composition comprising:

(a) about 0.01 to about 1 percent by weight of ceria;

(b) about 1 to about 20 ppm of a polydiallyldimethylammonium halide;

(c) about 100 to about 1000 ppm of ammonium chloride; and

(d) an aqueous carrier;

the composition having a pH in the range of about 4 to about 7.

11. The composition of claim 10 wherein the composition further comprises an amino carboxylic acid.

Assignments (10)
CHANGE OF NAME Recorded Nov 22, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065663/0466 →
CHANGE OF NAME Recorded Nov 8, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065517/0783 →
SECURITY INTEREST Recorded Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
SECURITY INTEREST Recorded Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; KMG-BERNUTH, INC.; MPOWER SPECIALTY CHEMICALS LLC; SEALWELD (USA), INC.; INTERNATIONAL TEST SOLUTIONS, LLC; CMC MATERIALS, INC.
Reel/Frame 060592/0260 →
CHANGE OF NAME Recorded Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
SECURITY AGREEMENT Recorded Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; MPOWER SPECIALTY CHEMICALS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
RELEASE OF SECURITY INTEREST Recorded Nov 16, 2018
From: BANK OF AMERICA, N.A.
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 047587/0119 →
NOTICE OF SECURITY INTEREST IN PATENTS Recorded Feb 16, 2012
From: CABOT MICROELECTRONICS CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 027727/0275 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 28, 2006
From: DYSARD, JEFFREY M.; JOHNS, TIMOTHY P.
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 017544/0291 →