IP Library Granted Patent US 7,585,340
Granted Patent B2
US 7,585,340 · App. 11/412,369 · Granted Sep 8, 2009

Polishing composition containing polyether amine

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Quick Facts
Patent No.
US 7,585,340
App. No.
11/412,369
Granted
Sep 8, 2009
Kind
B2
Abstract

The inventive chemical-mechanical polishing system comprises a polishing component, a liquid carrier, and a polyether amine. The inventive method comprises chemically-mechanically polishing a substrate with the aforementioned polishing system.

Claims (15)

1. A chemical-mechanical polishing composition comprising:

(a) an abrasive,

(b) a liquid carrier, and

(c) a compound selected from the group consisting of

(1) a compound of the Formula (I)

wherein x=2-6,

(2) a compound of the Formula (II)

wherein x+z=2-4 and y=1-50, and

(3) combinations thereof, wherein the concentration of the compound is about 50 ppm to about 1200 ppm.

2. The polishing composition of claim 1 , wherein the polishing composition further comprises a compound selected from the group 4,7,10-trioxatridecane-1,13-diamine, piperazine, and combinations thereof.

3. The polishing composition of claim 1 , wherein the polishing composition comprises a compound of the Formula (I) wherein x is 2-3 or x=5-6.

4. The polishing composition of claim 1 , wherein the polishing composition comprises a compound of Formula (II) wherein either (1) x+z=3-4 and y=8-9, (2) x+z=2-3 and y=15-16, or (3) x+z=2-3 and y=40-41.

5. The polishing composition of claim 1 , wherein the polishing composition further comprises a component different from the compound and selected from the group consisting of primary amines, secondary amines, tertiary amines, aminoalcohols, quaternary amines, and combinations thereof.

6. The polishing composition of claim 5 , wherein the component is tetramethylammonium hydroxide.

7. The polishing composition of claim 1 , wherein the polishing composition further comprises a compound selected from the group consisting of EDTA, oxalic acid, polyphosphonates, and combinations thereof.

Assignments (10)
CHANGE OF NAME Recorded Nov 22, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065663/0466 →
CHANGE OF NAME Recorded Nov 8, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065517/0783 →
SECURITY INTEREST Recorded Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
SECURITY INTEREST Recorded Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; KMG-BERNUTH, INC.; MPOWER SPECIALTY CHEMICALS LLC; SEALWELD (USA), INC.; INTERNATIONAL TEST SOLUTIONS, LLC; CMC MATERIALS, INC.
Reel/Frame 060592/0260 →
CHANGE OF NAME Recorded Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
RELEASE OF SECURITY INTEREST Recorded Nov 16, 2018
From: BANK OF AMERICA, N.A.
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 047587/0119 →
SECURITY AGREEMENT Recorded Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; MPOWER SPECIALTY CHEMICALS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
NOTICE OF SECURITY INTEREST IN PATENTS Recorded Feb 16, 2012
From: CABOT MICROELECTRONICS CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 027727/0275 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2006
From: DYSARD, JEFFREY M; FEENEY, PAUL M; ANJUR, SRIRAM P; JOHNS, TIMOTHY P; XIN, YUN-BIAO; WANG, LI
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 017673/0561 →