Compositions and methods for CMP of low-k-dielectric materials
View Patent ↗The present invention provides a chemical-mechanical polishing (CMP) composition suitable for polishing low-k dielectric materials. The composition comprises a particulate abrasive material, at least one silicone-free nonionic surfactant comprising a hydrophilic portion and a lipophilic portion, at least one silicone-containing nonionic surfactant comprising a hydrophilic portion and a lipophilic portion, and an aqueous carrier therefor. A CMP method for polishing a low-k dielectric surface utilizing the composition is also disclosed.
1. A chemical-mechanical polishing (CMP) composition for polishing a low-k dielectric material, the composition comprising:
(a) a particulate abrasive material;
(b) at least one silicone-free nonionic surfactant comprising a hydrophilic portion and a lipophilic portion, wherein the hydrophilic portion comprises a polyol;
(c) at least one silicone-containing nonionic surfactant comprising a hydrophilic portion and a lipophilic portion; and
(d) an aqueous carrier therefor.
2. The CMP composition of claim 1 wherein the particulate abrasive material is present in the composition in an amount in the range of about 0.5 to about 20 percent by weight.
3. The GMP composition of claim 1 wherein the particulate abrasive material comprises silica.
4. The CMP composition of claim 1 wherein the at least one silicone-free nonionic surfactant and the at least one silicone-containing nonionic surfactant are both present in the composition at concentrations in the range of about 25 to about 10,000 ppm.
5. The CMP composition of claim 1 wherein the at least one silicone-free nonionic surfactant and the at least one silicone-containing nonionic surfactant are present in the composition in a respective silicon-free surfactant-to-silicon-containing surfactant concentration ratio of about 1:1 or greater.
6. The CMP composition of claim 1 wherein the polyol is selected from the group consisting of a polyglycerol, a carbohydrate, and a combination thereof.
7. The CMP composition of claim 1 wherein the hydrophilic portion of the at least one silicone-free nonionic surfactant comprises a C 2 to C 3 polyoxyalkylene group.
8. The CMP composition of claim 7 wherein the C 2 to C 3 polyoxyalkylene group is a polyoxyethylene group.
9. The CMP composition of claim 1 wherein the lipophilic portion of the at least one silicone-free nonionic surfactant comprises a C 6 to C 30 hydrocarbon moiety.
10. The CMP composition of claim 9 wherein the C 6 to C 30 hydrocarbon moiety comprises at least one hydrocarbon moiety selected from the group consisting of an alkyl group, an alkyl-substituted aryl group, an aryl-substituted alkyl group, and an aryl group.
11. The CMP composition of claim 1 wherein the hydrophilic portion of the at least one silicone-containing nonionic surfactant comprises a polyol.
12. The CMP composition of claim 11 wherein the polyol is selected from the group consisting of a polyglycerol, a carbohydrate, and a combination thereof.
13. The CMP composition of claim 1 wherein the hydrophilic portion of the at least one silicone-containing nonionic surfactant comprises a C 2 to C 3 polyoxyalkylene group.
14. The CMP composition of claim 13 wherein the C 2 to C 3 polyoxyalkylene group is a polyoxyethylene group.
15. The CMP composition of claim 1 wherein the lipophilic portion of the at least one silicone-containing nonionic surfactant comprises a silicone group.
16. The CMP composition of claim 15 wherein silicone group comprises a polydimethylsioxane group.
17. The CMP composition of claim 1 further comprising at least one oxidizing agent.
18. The CMP composition of claim 1 wherein the at least on silicone-free nonionic surfactant comprises a nonylphenol ethoxylate.
19. The CMP composition of claim 1 wherein the at least one silicone-containing nonionic surfactant comprises a dimethicone copolyol.