Silicon carbide polishing method utilizing water-soluble oxidizers
View Patent ↗The inventive method comprises chemically-mechanically polishing a substrate comprising at least one layer of silicon carbide with a polishing composition comprising a liquid carrier, an abrasive, and an oxidizing agent.
1. A method of chemically-mechanically polishing a substrate, which method comprises:
(i) contacting a substrate comprising at least one layer of single crystal silicon carbide with a chemical-mechanical polishing composition comprising:
(a) a liquid carrier,
(b) an abrasive suspended in the liquid carrier, wherein the abrasive is alumina and is present in an amount of about 3 wt. % or less based on the weight of the liquid carrier and any components dissolved or suspended therein, and
(c) an oxidizing agent, wherein the oxidizing agent is present in an amount of about 0.001 wt. % to about 2.5 wt. % based on the weight of the liquid carrier and any components dissolved or suspended therein, and wherein the oxidizing agent is selected from the group consisting of hydrogen peroxide, oxone, ammonium cerium nitrate, periodates, periodic acid, iodates, persulfates, chromates, chlorates, permanganates, bromates, perbromates, ferrates, perrhenates, perruthenates, and mixtures thereof, and
(ii) moving the polishing composition relative to the substrate, and
(iii) abrading at least a portion of the silicon carbide of the substrate to polish the substrate.
2. The method of claim 1 , wherein the abrasive is present in an amount about 1 wt. % or less based on the weight of the liquid carrier and any components dissolved or suspended therein.
3. The method of claim 1 , wherein the oxidizing agent is present in an amount of about 0.1 wt. % to about 0.5 wt. % based on the weight of the liquid carrier and any components dissolved or suspended therein.
4. The method of claim 1 , wherein the liquid carrier with any components dissolved or suspended therein has a pH of about 2 to about 6.
5. The method of claim 1 , wherein the oxidizing agent is potassium permanganate.
6. The method of claim 1 , wherein the oxidizing agent is periodic acid.
7. The method of claim 1 , wherein the silicon carbide is removed from the substrate at a rate of about 30 nm/hr to about 2700 nm/hr.
8. A method of chemically-mechanically polishing a substrate, which method comprises:
(i) contacting a substrate comprising at least one layer of single crystal silicon carbide with a chemical-mechanical polishing composition comprising:
(a) a liquid carrier,
(b) an abrasive suspended in the liquid carrier, wherein the abrasive is selected from the group consisting of alumina, titania, ceria, and zirconia, and wherein the abrasive is present in an amount of about 3 wt. % or less based on the weight of the liquid carrier and any components dissolved or suspended therein, and
(c) a permanganate salt, wherein the permanganate salt is present in an amount of about 0.001 wt. % to about 2.5 wt. % based on the weight of the liquid carrier and any components dissolved or suspended therein,
(ii) moving the polishing composition relative to the substrate, and
(iii) abrading at least a portion of the silicon carbide of the substrate to polish the substrate.
9. The method of claim 8 , wherein the abrasive is present in amount of about 1 wt. % or less based on the weight of the liquid carrier and any components dissolved or suspended therein.
10. The method of claim 8 , wherein the abrasive is alumina.
11. The method of claim 8 , wherein the permanganate salt is present in an amount of amount of about 0.1 wt. % to about 1 wt. % based on the weight of the liquid carrier and any components dissolved or suspended therein.
12. The method of claim 8 , wherein the liquid carrier with any components dissolved or suspended therein has a pH of about 2 to about 6.
13. A method of chemically-mechanically polishing a substrate, which method comprises:
(i) contacting a substrate comprising at least one layer of single crystal silicon carbide with a chemical-mechanical polishing composition comprising:
(a) a liquid carrier,
(b) an abrasive suspended in the liquid carrier, wherein the abrasive is selected from the group consisting of alumina, titania, ceria, and zirconia, and wherein the abrasive is present in an amount of about 3 wt. % or less based on the weight of the liquid carrier and any components dissolved or suspended therein, and
(c) periodic acid or periodates, wherein the periodic acid or periodates are present in an amount of about 0.001 wt. % to about 1 wt. % based on the weight of the liquid carrier and any components dissolved or suspended therein,
(ii) moving the polishing composition relative to the substrate, and
(iii) abrading at least a portion of the silicon carbide of the substrate to polish the substrate.
14. The method of claim 13 , wherein the abrasive is present in amount of about 1 wt. % or less based on the weight of the liquid carrier and any components dissolved or suspended therein.
15. The method of claim 13 , wherein the abrasive is alumina.
16. The method of claim 13 , wherein the permanganate salt is present in an amount of amount of about 0.1 wt. % to about 0.5 wt. % based on the weight of the liquid carrier and any components dissolved or suspended therein.
17. The method of claim 13 , wherein the liquid carrier with any components dissolved or suspended therein has a pH of about 2 to about 6.