CMP porous pad with particles in a polymeric matrix

1. A chemical-mechanical polishing pad comprising a polymeric matrix and 0.1-15 wt. % of metal oxide particles, wherein the pad has pores, the metal oxide particles are uniformly distributed throughout the pores, and the metal oxide particles have a specific surface area of about 25 m 2 /g to about 450 m 2 /g, wherein the polymeric matrix comprises thermoplastic polyurethane.

2. The polishing pad of claim 1 , wherein the metal oxide particles comprise silica particles.

3. The polishing pad of claim 2 , wherein the metal oxide particles comprise fumed silica particles.

4. The polishing pad of claim 1 , wherein the pad has a Shore A hardness measurement of about 65 to about 85.

5. The polishing pad of claim 1 , wherein the pad has a void volume of about 20% to about 60%.

6. The polishing pad of claim 1 , wherein the average pore size is about 50 μm to about 150 μm.

7. The polishing pad of claim 1 , wherein the pad has a glass transition temperature Tg of about −30° C. to about +10° C.

8. The polishing pad of claim 1 , wherein the pad has an elastic modulus E of about 30 MPa to about 100 MPa at 30° C.

9. The polishing pad of claim 1 , wherein the pad has a water contact angle of about 20° to about 70° in 15 min.

10. The polishing pad of claim 1 , wherein the metal oxide particles comprise fumed silica particles, the polymeric matrix comprises thermoplastic polyurethane, and where the pad has a void volume of about 20% to about 60%, an average pore size of about 50 μm to about 150 μm, a Shore A hardness measurement of about 65 to about 85, a glass transition temperature of about −30° C. to about +10° C., an elastic modulus E of about 30 MPa to about 100 MPa at 30° C., and a water contact angle of about 20° to about 70° in 15 min.

11. A method of polishing a substrate, the method comprising:

(i) providing a polishing pad having a polishing layer comprised of a polymeric matrix and 0.1-15 wt % of metal oxide particles, wherein the pad has pores, the metal oxide particles are uniformly distributed throughout the pores, the metal oxide particles have a specific surface area of about 25 m 2 /g to about 450 m 2 /g, and the polymeric matrix comprises thermoplastic polyurethane,

(ii) applying a chemical-mechanical polishing composition to the polishing layer of the polishing pad,

(iii) contacting the polishing layer of the polishing pad with a substrate, and

(iv) moving the polishing pad with respect to the substrate so as to abrade at least a portion of the substrate and thereby polish the substrate.

12. The method of claim 11 , wherein the metal oxide particles comprise silica particles.

13. The method of claim 12 , wherein the metal oxide particles comprise fumed silica particles.

14. The method of claim 11 , wherein the pad has a Shore A hardness measurement of about 65 to about 85.

15. The method of claim 11 , wherein the pad has a void volume of about 20% to about 60%.

16. The method of claim 11 , wherein the average pore size is about 50 μm to about 150 μm.

17. The method of claim 11 , wherein the pad has a transition temperature Tg of about −30° C. to about +10° C.

18. The method of claim 11 , wherein the pad has an elastic modulus E of about 30 MPa to about 100 MPa at 30° C.

19. The method of claim 11 , wherein the pad has a water contact angle of about 20° to about 70° in 15 min.

20. The method of claim 11 , wherein the metal oxide particles comprise fumed silica particles, the polymeric matrix comprises thermoplastic polyurethane, and where the pad has a void volume of about 20% to about 60%, an average pore size of about 50 μm to about 150 μm, a Shore A hardness measurement of about 65 μm to about 85 μm, a glass transition temperature of about −30° C. to about +10° C., an elastic modulus E of about 30 MPa to about 100 MPa at 30° C., and a water contact angle of about 20° to about 70° in 15 min.