Polishing pad with light-stable light-transmitting region
The invention provides a polishing pad that contains at least one light-transmitting region and optionally a polishing pad body. The light-transmitting region is composed of a material comprising (a) a polymeric resin and (b) at least one light-absorbing compound, and the light-transmitting region has a total light transmittance of about 25% or more at one or more wavelengths in a range of 250 nm to 395 nm.
1. A polishing pad comprising at least one light-transmitting region, wherein the light-transmitting region is composed of a material comprising (a) a polymeric resin and (b) at least one light-absorbing compound, and wherein the light-transmitting region has a total light transmittance of 25% or more at one or more wavelengths in a range of 250 nm to 395 nm, wherein the light-transmitting region is discolored 45% or less at one or more wavelengths in a range of 395 nm to 800 nm upon ultraviolet light irradiation, as measured according to ASTM D1148-95.
2. The polishing pad of claim 1 , wherein the total light transmittance of the light-transmitting region prior to ultraviolet light irradiation differs from the total light transmittance of the light-transmitting region after ultraviolet light irradiation by 30% or less at one or more wavelengths in a range of 250 nm to 395 nm and/or 395 nm to 35,000 nm, and wherein the ultraviolet light irradiation comprises irradiating the light-transmitting region with a 100 watt mercury vapor lamp at an intensity of at least 1,000 mW/cm 2 for a duration of four minutes.
3. The polishing pad of claim 1 , wherein the light-transmitting region has a total light transmittance of 25% or more at one or more wavelengths in a range of 250 nm to 395 nm and/or 395 nm to 35,000 nm after the light-transmitting region has been exposed to ultraviolet light irradiation, and wherein the ultraviolet light irradiation comprises irradiating the light-transmitting region with a 100 watt mercury vapor lamp at an intensity of at least 1,000 mW/cm 2 for a duration of four minutes.
4. The polishing pad of claim 1 , wherein a solution consisting of the light-absorbing compound at a concentration of 10 mg/L has an absorbance of 0.5 or less in a range of 330 nm to 400 nm.
5. The polishing pad of claim 1 , wherein a solution consisting of the tight-absorbing compound does not have a maximum light absorption located in a range of 335 nm to 400 nm.
6. The polishing pad of claim 1 , wherein the light-transmitting region has a total light transmittance of 25% or more at one or more wavelengths in a range of 395 nm to 35,000 nm.
7. The polishing pad of claim 1 , wherein the light-transmitting region has a total light transmittance of 25% or more at one or more wavelengths in a range of 360 nm to 380 nm.
8. The polishing pad of claim 1 , wherein the light-transmitting region comprises 50% or more of the polishing pad by surface area.
9. The polishing pad of claim 1 , wherein the polymeric resin is a thermoplastic polymeric resin.
10. The polishing pad of claim 1 , wherein the polymeric resin comprises at least one aliphatic polymer selected from the group consisting of polyurethanes, polycarbonate-based polyurethanes, polycarbonate-based diol or triol polyurethanes, linear aliphatic polycarbonate-based polyurethanes, branched aliphatic polycarbonate-based polyurethanes, cycloalkane-based aliphatic polyurethanes, polysiloxane-based polyurethanes, (alkyl)acrylates, (alkyl)acrylic acids, polyvinylidene fluorides, polyvinylidene difluorides, polychlorotrifluoroethylenes, polysiloxanes, polycarbonates, linear aliphatic polycarbonates, polymethylpentene-1, and combinations thereof.
11. The polishing pad of claim 10 , wherein the aliphatic polymer is a thermoplastic polymer, a thermoset polymer, or any combination thereof.
12. The polishing pad of claim 11 , wherein the thermoplastic polymer is selected from the group consisting of thermoplastic polyurethanes, polycarbonate-based thermoplastic polyurethanes, cycloalkane-based thermoplastic polyurethanes, polysiloxane-based thermoplastic polyurethanes, random copolymers thereof, block copolymers thereof, and blends thereof.
13. The polishing pad of claim 10 , wherein the aliphatic polymer is a polyurethane comprising monomeric units of (a) one or more diols selected from the group consisting of a polyol, a polyol comprising cyclic aliphatic rings, a polycarbonate polyol, a polyhexamethylene carbonate diol comprising 1 to 1000 repeat units, a polyethylene ether carbonate diol comprising 1 to 1000 repeat units, 1,12-dodecanediol, 1,4-butanediol, and combinations thereof, and (b) dicyclohexylmethane 4,4′-diisocyanate.
14. The polishing pad of claim 1 , wherein the light-absorbing compound is selected from the group consisting of pentaerythritol tetrakis(2-cyano-3,3-diphenylacrylate), 2-ethylhexyl-p-methoxycinnamate, ethyl-2-cyano-3,3′-diphenylacrylate, octyl-p-methoxycinnamate, 4-aminobenzoate-trialkylorthoformate, ethyl(4-ethoxycarbonylphenyl)-N-methyl-N-phenylformamidine, N,N-bis-(4-ethoxycarbonylphenyl)-N-methylformamidine, N2-(4-ethoxycarbonylphenyl)-N1-methyl-N1-phenylformamidine, 2-hydroxy-4-n-octoxybenzophenone, 2-propenoic acid-3-(4-methoxyphenyl)-2-ethylhexyl ester, ethyl-2-cyano-3,3-diphenylacrylate, 2-ethylhexyl-3,3-diphenylacrylate, ethyl-3,3-bis(4-methoxyphenyl)acrylate, 2-ethylhexyl-2-cyano-3,3-diphenylacrylate, homomethyl salicylate, 2-phenyl-benzimidazole-5-sulphonic acid, triethyl salicylate, octyldimethyl 4-aminobenzoic acid, 4-methylbenzilidene camphor, di-2′-ethylhexyl-3,5-dimethoxy-4-hydroxy benzylidene malonate, cyanoacrylates, triazines, bis-methines, camphor derivatives, and combinations thereof.
15. The polishing pad of claim 1 , wherein the light-transmitting region has a thickness of 0.2 mm to 3 mm.
16. The polishing pad of claim 1 , wherein the light-transmitting region has one or more of the following properties:
(a) a Shore hardness of 10 A to 80 D,
(b) a porosity of 0.1% to 10%, wherein 50% or more of the pores of the light-transmitting region have a size of 1 μm or less,
(c) a % elongation of 50% or more,
(d) an ultimate tensile strength of 65 kPa or more,
(e) a flexural modulus at room temperature of 700 kPa to 3,500,000 kPa,
(f) a resin melt index or melt flow rate of less than 500 g/10 min at 2160 g load at 210° C.,
(g) a resin melt viscosity range of 10 Pa·s to 20,000 Pa·s., as measured by a capillary rheometer at a shear rate of 18/s at 210° C.,
(h) a % crystallinity of less than 30%,
(i) a glass transition temperature of about −100° C. to 160° C.,
(j) a surface roughness of 0.1 to 100 μm, and
(k) a refractive index of 1.1 to 2.0.
17. The polishing pad of claim 1 , wherein the polishing pad further comprises a polishing pad body.
18. The polishing pad of claim 17 , wherein the polishing pad body has one or more of the following properties:
(a) a Shore hardness of 10 A to 80 D,
(b) a porosity of 0.1% to 80%, wherein 50% or more of the pores of the polishing pad have a size of 200 μm or less,
(c) a % elongation of 50% or more,
(d) an ultimate tensile strength of 65 kPa or more,
(e) a flexural modulus at room temperature of 700 kPa to 3,500,000 kPa,
(f) a resin melt index or melt flow rate of less than 500 g/10 min at 2160 g load at 210° C.,
(g) a resin melt viscosity range of 10 Pa·s to 20,000 Pa·s., as measured by a capillary rheometer at a shear rate of 18/s at 210° C.,
(h) a % crystallinity of 0% to 60%,
(i) a glass transition temperature of about −100° C. to 160° C.,
(j) a surface roughness of 0.1 to 100 μm, and
(k) a refractive index of 1.1 to 2.0.
19. The polishing pad of claim 17 , wherein the light-transmitting region is attached to the polishing pad body by a process selected from the group consisting of heat-melting chemical bond fusion, ultrasonic welding, radio frequency welding, arc welding, heat compression, frictional heating, and combinations thereof.
20. The polishing pad of claim 17 , wherein the polishing pad, polishing pad body, and/or light-transmitting region is formed by film or sheet extrusion, injection molding, blow molding, thermoforming, compression molding, co-extrusion molding, reaction injection molding, profile extrusion molding, rotational molding, gas injection molding, film insert molding, foaming, casting, or any combination thereof.
21. The polishing pad of claim 1 , wherein the light-transmitting region is formed by compressing at least a portion of the polishing pad.
22. The polishing pad of claim 1 , wherein the light-absorbing compound is present in an amount of 0.05% to 20% by weight based on the weight of the light-transmitting region.
23. The polishing pad of claim 1 , wherein
the polymeric resin is an aliphatic polycarbonate-based thermoplastic polyurethane comprising monomeric units of (a) a polyakylene carbonate diol comprising 1 to 1000 repeat units, (b) an aliphatic diisocyanate, and (c) an alkyl diol different from the polyalkylene carbonate diol (a),
a solution consisting of the light-absorbing compound at a concentration of 10 mg/L has an absorbance of 0.5 or less in a range of 330 nm to 400 nm,
the light-transmitting region has a total light transmittance of 25% or more at one or more wavelengths in a range of 360 nm to 380 nm,
the light-transmitting region is discolored 45% or less at one or more wavelengths in a range of 395 nm to 800 nm upon ultraviolet light irradiation, as measured according to ASTM D1148-95, and
the light-transmitting region has a total light transmittance of 25% or more at one or more wavelengths in a range of 250 nm to 395 nm after the light-transmitting region has been exposed to ultraviolet light irradiation, and wherein the ultraviolet light irradiation comprises irradiating the light-transmitting region with a 100 watt mercury vapor lamp at an intensity of at least 1,000 mW/cm 2 for a duration of four minutes.
24. A method of polishing a workpiece comprising:
(a) providing a workpiece to be polished,
(b) contacting the workpiece with the polishing pad of claim 1 and a chemical-mechanical polishing composition, and
(c) moving the workpiece relative to the polishing pad so as to abrade at least a portion of the surface of the workpiece to polish the workpiece.
25. The method of claim 24 , wherein the method further comprises detecting a polishing endpoint in situ using light.