IP Library › Assignment 031868/0561
Patent Assignment
Reel/Frame 031868/0561

Intellectual Property Security Agreement Supplement

Recorded: 2013-12-23 Pages: 12
Assignor
CABOT MICROELECTRONICS CORPORATION
Executed: 2012-11-20
Assignee
BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
135 S. LASALLE STREET, IL4-135-05-41, CHICAGO, ILLINOIS, 60603
Covered Properties (13)
Polishing Pad with Light-Stable Light-Transmitting Region
Patent: 9,156,125 →
Application: 13/444,620 →
Publication: US 2013/0273813
Cmp Composition Containing Zirconia Particles and Method of Use
Patent: 8,778,212 →
Application: 13/477,535 →
Publication: US 2013/0313225
Polishing Composition for Nickel-Phosphorous-Coated Memory Disks
Patent: 9,039,914 →
Application: 13/478,292 →
Publication: US 2013/0313226
Polishing Composition for Nickel Phosphorous Memory Disks
Patent: 8,557,137 →
Application: 13/546,128 →
Publication: US 2012/0273715
Compositions and Methods for Selective Polishing of Silicon Nitride Materials
Patent: 9,633,863 →
Application: 13/546,552 →
Publication: US 2014/0017892
Gst Cmp Slurries
Patent: 8,778,211 →
Application: 13/551,423 →
Publication: US 2014/0024216
Compositions for Polishing Silicon-Containing Substrates
Patent: 8,597,540 →
Application: 13/554,829 →
Publication: US 2012/0280170
Compositions and Methods for Selective Polishing of Platinum and Ruthenium Materials
Application: 13/593,634 →
Publication: US 2014/0054266
Polishing Composition Containing Hybrid Abrasive for Nickel-Phosphorous Coated Memory Disks
Patent: 8,518,135 →
Application: 13/594,947 →
Polypyrrolidone Polishing Composition and Method
Patent: 8,821,215 →
Application: 13/606,599 →
Publication: US 2014/0073226
Cmp Compositions Selective for Oxide and Nitride with High Removal Rate and Low Defectivity
Application: 61/610,818 →
Cmp Compositions Selective for Oxide and Nitride with High Removal Rate and Low Defectivity
Application: 61/610,843 →
Composition and Method for Polishing Molybdenum
Application: 61/658,076 →
Related Assignments (18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 9, 2012
From: REISS, BRIAN; WHITENER, GLENN
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 028017/0816 →
Assignment of Assignor's Interest Jan 11, 2013
From: REISS, BRIAN; WILLHOFF, MICHAEL; MATEJA, DANIEL
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 029616/0760 →
Assignment of Assignor's Interest Jan 18, 2013
From: PRASAD, ABANESHWAR
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 029658/0628 →
Assignment of Assignor's Interest Jan 18, 2013
From: PALANISAMY CHINNATHAMBI, SELVARAJ; SIRIWARDANE, HARESH
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 029658/0886 →
Assignment of Assignor's Interest Jan 18, 2013
From: JIN, WIECHANG; PARKER, JOHN; REMSEN, ELIZABETH
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 029658/0804 →
Assignment of Assignor's Interest May 20, 2013
From: LORPITTHAYA, RUJEE; PALANISAMY CHINNATHAMBI, SELVARAJ; SIRIWARDANE, HARESH
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 030445/0665 →
Assignment of Assignor's Interest Jul 8, 2013
From: WARD, WILLIAM
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 030748/0784 →
Assignment of Assignor's Interest Jul 8, 2013
From: STENDER, MATTHIAS; WHITENER, GLENN; NAM, CHUL WOO
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 030748/0945 →
Assignment of Assignor's Interest Aug 13, 2013
From: NAGUIB SANT, NEVIN
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 031002/0194 →
Assignment of Assignor's Interest Aug 13, 2013
From: JIN, WEICHANG; REMSEN, ELIZABETH
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 031002/0072 →
Release of Security Interest Nov 16, 2018
From: BANK OF AMERICA, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.
Reel/Frame 047521/0729 →
Security Agreement Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
Change of Name Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
Release of Security Interest Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
Reel/Frame 060592/0260 →
Security Interest Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
Security Interest Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
Change of Name Nov 8, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065517/0783 →
Change of Name Nov 22, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065663/0466 →