IP Library Granted Patent US 10,848,158
Granted Patent B2
US 10,848,158 · App. 16/693,370 · Granted Nov 24, 2020

Configurable processor

Inventor: Guobiao Zhang (Corvallis, OR)
Assignees: HangZhou HaiCun Information Technology Co., Ltd.; Guobiao Zhang
H03K19/1776G11C5/02H03K19/1737H03K19/17728H03K19/17744G11C5/025
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,848,158
App. No.
16/693,370
Granted
Nov 24, 2020
Kind
B2
Abstract

A configurable processor comprises at least an array of configurable computing elements (CCE's). Each CCE comprises at least a three-dimensional (3-D) memory (3D-M) array; an arithmetic logic circuit (ALC); and, a plurality of inter-storage-processor (ISP) connections. Not penetrating through any semiconductor substrate, the ISP-connections are short, small and numerous.

Claims (28)

1. A configurable processor, comprising a single-crystalline semiconductor substrate and an array of configurable computing elements (CCE's), each of said CCE's comprising:

at least a three-dimensional memory (3D-M) array including memory cells for storing at least a portion of a look-up table (LUT) of a mathematical function, wherein said memory cells are neither in contact with nor interposed therebetween by any semiconductor substrate including said single-crystalline semiconductor substrate; and, said memory cells do not comprise any single-crystalline semiconductor material;

an arithmetic logic circuit (ALC) and at least a portion of a peripheral circuit of said 3D-M array disposed on said single-crystalline semiconductor substrate, wherein said ALC performs at least one arithmetic operation on selected data of said LUT; said ALC and said portion of said peripheral circuit are communicatively coupled; and, said ALC and said portion of said peripheral circuit comprise at least a single-crystalline semiconductor material;

a plurality of inter-storage-processor (ISP) connections for communicatively coupling said memory cells and said portion of said peripheral circuit, wherein said ISP-connections do not penetrate through any semiconductor substrate including said single-crystalline semiconductor substrate; and, said memory cells and said ALC at least partially overlap.

2. The configurable processor according to claim 1 , further comprising at least an array of configurable logic elements (CLE's), wherein each of said CLE's selectively realizes a logic function from a logic library.

3. The configurable processor according to claim 1 , further comprising at least an array of configurable interconnects (CIT's), wherein each of said CIT's selectively realizes an interconnect from an interconnect library.

4. The configurable processor according to claim 1 , further comprising at least one multiplier disposed on said single-crystalline semiconductor substrate.

5. The configurable processor according to claim 1 being a singlet, comprising no more semiconductor substrate other than said single-crystalline semiconductor substrate.

6. The configurable processor according to claim 1 being a doublet, further comprising:

a processing die including said ALC and said portion of said peripheral circuit disposed on said single-crystalline semiconductor substrate;

a 3D-M die including said 3D-M array disposed on another semiconductor substrate different from said single-crystalline semiconductor substrate;

wherein said processing die and said 3D-M die are face-to-face bonded;

and, said doublet includes only said single-crystalline semiconductor substrate and said another semiconductor substrate.

7. The configurable processor according to claim 1 , wherein said configurable processor comprises at least one thousand CCE's.

8. The configurable processor according to claim 1 , wherein each of said CCE's comprises at least first and second 3D-M arrays disposed side-by-side and overlapping with said ALC.

9. The configurable processor according to claim 1 , wherein said 3D-M array is a three-dimensional non-volatile memory (3D-NVM) array.

10. The configurable processor according to claim 1 , wherein said memory cells comprise diodes or diode-like devices.

11. The configurable processor according to claim 1 , wherein said memory cells comprise transistors or transistor-like devices.

12. The configurable processor according to claim 1 , wherein said memory cells are re-programmable, whereby each of said CCE's can be re-configured to realize a different mathematical function by loading the LUT of said different mathematical function into said memory cells.

13. The configurable processor according to claim 1 , wherein said mathematical function involves more operations than arithmetic operations performable by said ALC.

14. The configurable processor according to claim 1 , wherein said LUT includes functional values and/or derivative values of said mathematical function.

15. The configurable processor according to claim 1 , wherein said mathematical function includes a mathematical model.

16. The configurable processor according to claim 15 , wherein said mathematical model includes raw measurement data and/or smoothed measurement data.

17. The configurable processor according to claim 1 , wherein said ALC comprises at least an adder, a multiplier, and/or a multiplier accumulator (MAC).

18. The configurable processor according to claim 1 , wherein:

each of said CCE's comprises at least one thousand ISP connections; and/or,

the length of said ISP connections is on the order of one micrometer.

19. The configurable processor according to claim 1 , wherein said ISP connections include contact vias, contacted vias and/or micro-bumps.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 30, 2025
From: HANGZHOU HAICUN INFORMATION TECHNOLOGY CO., LTD.
To: SHENZHEN CUNTIAN TECHNOLOGY CO., LTD.
Reel/Frame 072727/0390 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2025
From: ZHANG, GUOBIAO, DR.
To: HANGZHOU HAICUN INFORMATION TECHNOLOGY CO., LTD.
Reel/Frame 070720/0331 →
Priority Claims (26)
CN 2016 1 0083747 · Feb 13, 2016 · national
CN 2016 1 0125227 · Mar 5, 2016 · national
CN 2016 1 0260845 · Apr 22, 2016 · national
CN 2016 1 0289592 · May 2, 2016 · national
CN 2016 1 0307102 · May 10, 2016 · national
CN 2017 1 0122749 · Mar 3, 2017 · national
CN 2017 1 0126067 · Mar 6, 2017 · national
CN 2017 1 0237780 · Apr 12, 2017 · national
CN 2017 1 0980620 · Oct 19, 2017 · national
CN 2017 1 0980779 · Oct 20, 2017 · national
CN 2017 1 0980813 · Oct 20, 2017 · national
CN 2017 1 0980826 · Oct 20, 2017 · national
CN 2017 1 0980827 · Oct 20, 2017 · national
CN 2017 1 0989881 · Oct 23, 2017 · national
CN 2017 1 0989885 · Oct 23, 2017 · national
CN 2017 1 0989901 · Oct 23, 2017 · national
CN 2018 1 1506212 · Dec 10, 2018 · national
CN 2018 1 1508130 · Dec 11, 2018 · national
CN 2018 1 1520357 · Dec 12, 2018 · national
CN 2018 1 1527885 · Dec 13, 2018 · national
CN 2018 1 1527911 · Dec 13, 2018 · national
CN 2018 1 1528014 · Dec 14, 2018 · national
CN 2018 1 1546476 · Dec 15, 2018 · national
CN 2018 1 1546592 · Dec 15, 2018 · national
CN 2019 1 0002944 · Jan 2, 2019 · national
CN 2019 1 0029523 · Jan 13, 2019 · national
Continuity (18)
Continuation In Part 16249021 · Jan 16, 2019
Continuation In Part 16186571 · Nov 11, 2018
Continuation In Part 16059023 · Aug 8, 2018
Continuation In Part 16693370
Continuation In Part 16055170 · Aug 6, 2018
Continuation In Part 15793968 · Oct 25, 2017
Continuation In Part 15793912 · Oct 25, 2017
Continuation In Part 15793912
Continuation In Part 15793933 · Oct 25, 2017
Continuation In Part 15793927 · Oct 25, 2017
Continuation In Part 16693370
Continuation In Part 15487366 · Apr 13, 2017
Continuation In Part 15450049 · Mar 6, 2017
Continuation 15450049
Continuation In Part 15450049
Continuation In Part 15450049
Continuation In Part 15450017 · Mar 5, 2017
Related Publication 20200127665A1 · Apr 23, 2020