3D device and devices with bonding
A 3D device including: a first level including first single crystal transistors overlaid by a second level including second single crystal transistors; a third level including third single crystal transistors, the second level is overlaid by the third level; a fourth level including fourth single crystal transistors, the third level is overlaid by the fourth level; first bond regions including first oxide to oxide bonds, where the first bond regions are between the first level and the second level; second bond regions including second oxide to oxide bonds, where the second bond regions are between the second level and the third level; and third bond regions including third oxide to oxide bonds, where the third bond regions are between the third level and the fourth level, where the second level, third level, and fourth level each include one array of memory cells, and where the one array of memory cells is a DRAM type memory.
1. A 3D device, the device comprising:
a first level comprising first single crystal transistors; overlaid by
a second level comprising second single crystal transistors,
wherein said first level is overlaid by said second level;
a third level comprising third single crystal transistors,
wherein said second level is overlaid by said third level;
a fourth level comprising fourth single crystal transistors,
wherein said third level is overlaid by said fourth level;
first bond regions comprising first oxide to oxide bonds,
wherein said first bond regions are disposed between said first level and said second level;
second bond regions comprising second oxide to oxide bonds,
wherein said second bond regions are disposed between said second level and said third level; and
third bond regions comprising third oxide to oxide bonds,
wherein said third bond regions are disposed between said third level and said fourth level,
wherein said second level, said third level, and said fourth level each comprise at least one array of memory cells, and
wherein said at least one array of memory cells is a DRAM type memory.
2. The 3D device of claim 1 ,
wherein said second bond regions comprise metal to metal bonds.
3. The 3D device of claim 1 ,
wherein said first level comprises circuits to transfer data to be written into at least one of said memory cells.
4. The 3D device of claim 1 ,
wherein said first level comprises SerDes circuits to communicate with external devices.
5. The 3D device of claim 1 , further comprising:
a conductive pillar to connect said first level to said fourth level.
6. The 3D device of claim 1 ,
wherein said first level comprises connection contacts to external devices, and
wherein said contacts are at a bottom of said first level.
7. The 3D device of claim 1 ,
wherein at least one of said second transistors comprise at least two side gates.
8. A first 3D device, the device comprising:
a first level comprising first single crystal transistors;
a second level comprising second single crystal transistors,
wherein said first level is overlaid by said second level; and
a second 3D device comprising:
a third level comprising third single crystal transistors;
a fourth level comprising fourth single crystal transistors,
wherein said third level is overlaid by said fourth level; and
wherein said second level and said fourth level comprise at least a similar 20 levels of lithography based patterns, and
wherein said first level and said third level comprise less than 4 similar levels of lithography based patterns.
9. The first 3D device of claim 8 ,
wherein said second level comprises at least one array of memory cells.
10. The first 3D device of claim 8 ,
wherein said second level comprises SerDes circuits.
11. The first 3D device of claim 8 ,
wherein said first level comprises connection contacts to external devices, and
wherein said contacts are at a bottom of said first level.
12. The first 3D device of claim 8 , further comprising:
bond regions comprising oxide to oxide bonds, said bond regions disposed between said first level and said second level.
13. The first 3D device of claim 8 , further comprising:
bond regions comprising metal to metal bonds, said bond regions disposed between said first level and said second level.
14. The first 3D device of claim 8 ,
wherein at least one of said second transistors comprise at least two side gates.
15. A 3D device, the device comprising:
a first level comprising first single crystal transistors;
a second level comprising second single crystal transistors,
wherein said first level is overlaid by said second level; and
bond regions comprising hybrid bonds, said bond regions are disposed between said first level and said second level,
wherein at least one of said second transistors comprises at least two side gates, and
wherein said second level comprises an array of SRAM memory cells.
16. The 3D device of claim 15 ,
wherein said second level comprises SerDes circuits.
17. The 3D device of claim 15 ,
wherein said first level comprises connection contacts to external devices, and
wherein said contacts are at bottom of said first level.
18. The 3D device of claim 15 , further comprising:
a metal layer disposed in-between said first level and said second level,
wherein said metal layer is connected to provide power to a plurality of said second transistors.
19. The 3D device of claim 15 ,
wherein said first level comprises a first die area size and said second level comprises a second die area size, and
wherein said first die area size is clearly larger than said second die area size.
20. The 3D device of claim 15 ,
wherein said second level comprises FinFet transistors.