3D semiconductor device with vias and isolation layers
A 3D semiconductor device, the device including: a first level including a plurality of first metal layers; a second level, where the second level overlays the first level, where the second level includes at least one single crystal silicon layer, where the second level includes a plurality of transistors, where each of the plurality of transistors includes a single crystal channel, where the second level includes a plurality of second metal layers, where the plurality of second metal layers include interconnections between the plurality of transistors, and where the second level is overlaid by a first isolation layer; and a connective path between the plurality of transistors and the plurality of first metal layers, where the connective path includes a via disposed through at least the single crystal silicon layer, and where the via has a diameter of less than 400 nm and greater than 5 nm.
1. A 3D semiconductor device, the device comprising:
a first level comprising a plurality of first metal layers;
a second level,
wherein said second level overlays said first level,
wherein said second level comprises at least one single crystal silicon layer,
wherein said second level comprises a plurality of transistors,
wherein each of said plurality of transistors comprises a single crystal channel,
wherein said second level comprises a plurality of second metal layers,
wherein said plurality of second metal layers comprise interconnections between said plurality of transistors, and
wherein said second level is overlaid by a first isolation layer; and
a connective path between said plurality of transistors and said plurality of first metal layers,
wherein said connective path comprises a via disposed through at least said single crystal silicon layer, and
wherein said via has a diameter of less than 400 nm and greater than 5 nm.
2. The device according to claim 1 ,
wherein said single crystal silicon layer has a thickness of less than 2,000 nm and greater than 5 nm.
3. The device according to claim 1 , further comprising:
a third level comprising single crystal third transistors,
wherein said first isolation layer is overlaid by said third level,
wherein said third level is overlaid by a third isolation layer,
wherein said third level is bonded to said second isolation layer, and
wherein said bonded comprises at least one oxide to oxide bond.
4. The device according to claim 1 ,
wherein at least one of said plurality of transistors comprises two side gates.
5. The device according to claim 1 ,
wherein at least one of said plurality of transistors comprises a gate all around structure.
6. The device according to claim 1 ,
wherein said first metal layers comprise Vdd supply lines.
7. The device according to claim 1 ,
wherein said first metal layers comprise Vss supply lines.
8. A 3D semiconductor device, the device comprising:
a first level comprising a plurality of first metal layers;
a second level,
wherein said second level is overlaying said first level,
wherein said second level comprises at least one single crystal silicon layer,
wherein said second level comprises a plurality of transistors,
wherein each of said plurality of transistors comprises a single crystal channel,
wherein said second level comprises a plurality of second metal layers,
wherein said plurality of second metal layers comprise interconnections between said plurality of transistors,
wherein said second level is overlaid by a first isolation layer; and
a connective path between said plurality of transistors and said plurality of first metal layers,
wherein said connective path comprises a via disposed through at least said single crystal silicon layer, and
wherein said single crystal silicon layer has a thickness of less than 2,000 nm and greater than 5 nm.
9. The device according to claim 8 ,
wherein said via has a diameter of less than 400 nm and greater than 5 nm.
10. The device according to claim 8 , further comprising:
a third level comprising single crystal third transistors,
wherein said isolation layer is overlaid by said third level,
wherein said third level is overlaid by a second isolation layer,
wherein said third level is bonded to said second isolation layer, and
wherein said bonded comprises at least one oxide to oxide bond.
11. The device according to claim 8 ,
wherein at least one of said plurality of transistors comprises two side gates.
12. The device according to claim 8 ,
wherein at least one of said plurality of transistors comprises a gate all around structure.
13. The device according to claim 8 ,
wherein said first metal layers comprise Vdd supply lines.
14. The device according to claim 8 ,
wherein said first metal layers comprise Vss supply lines.
15. A 3D semiconductor device, the device comprising:
a first level comprising a plurality of first metal layers;
a second level,
wherein said second level is overlaying said first level,
wherein said second level comprises at least one single crystal silicon layer,
wherein said second level comprise a plurality of first transistors,
wherein each of said plurality of first transistors comprises a single crystal channel,
wherein said second level comprises a plurality of second metal layers,
wherein said plurality of second metal layers comprise interconnections between said plurality of first transistors,
wherein said second level is overlaid by a first isolation layer;
a connective path between said plurality of first transistors and said plurality of first metal layers,
wherein said connective path comprises a via disposed through said single crystal silicon layer, and
a third level comprising single crystal second transistors,
wherein said first isolation layer is overlaid by said third level,
wherein said third level is overlaid by a second isolation layer,
wherein said third level is bonded to said second isolation layer,
wherein said bonded comprises at least one oxide to oxide bond, and
wherein at least one of said plurality of first transistors comprises two side gates.