IP Library › Granted Patent US 12,405,433
Granted Patent B2
US 12,405,433 · App. 17/842,625 · Granted Sep 2, 2025

Communication systems having pluggable modules

Inventors: Peter Johannes Winzer (Aberdeen, NJ); Peter James Pupalaikis (Ramsey, NJ); Brett Michael Dunn Sawyer (Pasadena, CA); Ron Zhang (Sunnyvale, CA); Clinton Randy Giles (Watchung, NJ)
Assignee: Nubis Communications, Inc.
G02B6/4261G02B6/4268G02B6/428G02B6/4285
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Quick Facts
Patent No.
US 12,405,433
App. No.
17/842,625
Granted
Sep 2, 2025
Kind
B2
Abstract

A system includes a housing having a front panel, a substrate that is positioned at a distance from the front panel, and a data processor mounted on the substrate. The system includes a pluggable module having an optical module, at least one first optical connector, a first fiber optic cable optically coupled between the optical module and the first optical connector, and a fiber guide positioned between the optical module and the first optical connector and provides mechanical support for the optical module and the first optical connector. The optical module receives optical signals from the first optical connector and generates electrical signals based on the received optical signals, and the electrical signals are transmitted to the data processor. The pluggable module has a shape that enables the pluggable module to pass through an opening in the front panel to enable the optical module to be coupled to the substrate.

Claims (67)

1. A system comprising:

a housing for a rackmount server having a front panel;

a first substrate that is positioned at a distance from the front panel, in which a data processor is mounted on the first substrate, wherein the first substrate is spaced apart from the front panel at a distance less than 12 inches, and the first substrate has a main surface that is oriented at an angle in a range of 0 to 45 degrees relative to the front panel; and

a pluggable module comprising an optical module, at least one first optical connector, a first fiber optic cable that is optically coupled between the optical module and the first optical connector, wherein the pluggable module has a bandwidth of at least 10 gigabits per second;

wherein the optical module is configured to receive optical signals from the first optical connector and generate electrical signals based on the received optical signals, and the electrical signals or processed versions of the electrical signals are transmitted to the data processor;

wherein the pluggable module has a shape that enables the pluggable module to pass through an opening in the front panel to enable the optical module to be coupled to the first substrate; and

wherein the data processor is capable of processing data at a rate of at least 100 gigabits per second.

2. The system of claim 1 in which the first optical connector is configured to mate with a corresponding optical connector of an external fiber optic cable.

3. The system of claim 1 in which the first optical connector comprises a multi-fiber push on (MPO) connector.

4. The system of claim 1 in which the pluggable module comprises at least two first optical connectors, and each first optical connector is configured to be mated with a second optical connector of an external fiber optic cable.

5. The system of claim 1 in which the pluggable module comprises at least four first optical connectors, and each first optical connector is configured to be mated with a second optical connector of an external fiber optic cable.

6. The system of claim 1 in which the first fiber optic cable comprises a fiber pigtail.

7. The system of claim 1 in which the first substrate is oriented parallel to the front panel.

8. The system of claim 1 in which the first substrate has a first side and a second side that is opposite the first side, the data processor comprises electrical contacts that are electrically coupled to electrical contacts on the first side of the first substrate, the pluggable module comprises electrical contacts that are electrically coupled to electrical contacts on the second side of the first substrate, and at least some of the electrical contacts on the first side of the first substrate are electrically coupled to at least some of the electrical contacts on the second side of the first substrate.

9. The system of claim 8 in which the first substrate comprises at least one of a ceramic substrate, an organic high density build-up substrate, or a silicon substrate.

10. The system of claim 1 in which the system comprises a second substrate, the data processor comprises electrical contacts that are electrically coupled to electrical contacts on the first substrate, the pluggable module comprises electrical contacts that are electrically coupled to electrical contacts on the second substrate, and at least some of the electrical contacts on the first substrate are electrically coupled to at least some of the electrical contacts on the second substrate.

11. The system of claim 10 in which the first substrate is mounted on a first side of a third substrate or circuit board, and the second substrate is mounted on a second side of the third substrate or circuit board.

12. The system of claim 11 in which each of the first and second substrate comprises at least one of a ceramic substrate, an organic high density build-up substrate, or a silicon substrate.

13. The system of claim 1 , comprising a laser module configured to provide optical power to the optical module.

14. The system of claim 13 , comprising a second optical connector optically coupled to the laser module,

wherein the pluggable module comprises a third optical connector that is configured to mate with the second optical connector when the pluggable module is coupled to the first substrate, and

wherein the first optical connector is optically coupled to the optical module to enable the optical module to receive the optical power from the laser module.

15. The system of claim 13 , comprising a first heat dissipating device and a second heat dissipating device, the first heat dissipating device is thermally isolated from the second heat dissipating device, the first heat dissipating device is thermally coupled to the optical module, and the second heat dissipating device is thermally coupled to the laser module.

16. The system of claim 1 wherein the pluggable module comprises a fiber guide that is positioned between the optical module and the first optical connector and provides mechanical support for the optical module and the first optical connector.

17. The system of claim 1 wherein the optical module has a first side and a second side, the first fiber optical cable has a first end that has a two-dimensional arrangement of optical fiber cores, the first side of the optical module is optically coupled to the two-dimensional arrangement of optical fiber cores, and the second side of the optical module has a two-dimensional arrangement of electrical contacts that are configured to mate with a two-dimensional arrangement of electrical contacts on the first substrate.

18. The system of claim 17 wherein the two-dimensional arrangement of electrical contacts of the optical module comprise at least two rows of electrical contacts, and each row includes at least two electrical contacts.

19. The system of claim 18 wherein the two-dimensional arrangement of electrical contacts of the optical module comprise at least four rows of electrical contacts, and each row includes at least four electrical contacts.

20. The system of claim 19 wherein the two-dimensional arrangement of electrical contacts of the optical module comprise at least ten rows of electrical contacts, and each row includes at least ten electrical contacts.

21. The system of claim 16 wherein the data processor comprises at least a network switch, a central processor unit, a graphics processor unit, a tensor processing unit, a neural network processor, an artificial intelligence accelerator, a digital signal processor, a microcontroller, an application specific integrated circuit (ASIC), or a storage device.

22. The system of claim 16 in which the fiber guide has a length configured such that when the pluggable module is inserted through the opening in the front panel and the optical module is coupled to the first substrate or a module mounted on the first substrate, the at least one first optical connector is in a vicinity of the front panel to enable a user to attach at least one external fiber optic cable to the at least one first optical connector.

23. The system of claim 16 in which the fiber guide has a length configured such that when the pluggable module is inserted through the opening in the front panel and the optical module is coupled to the first substrate or a module mounted on the first substrate, the at least one first optical connector has a front surface that is flush with, or protrudes from, a front surface of the front panel to enable a user to attach at least one external fiber optic cable to the at least one first optical connector.

24. The system of claim 16 in which the fiber guide has a length configured such that when the pluggable module is inserted through the opening in the front panel and the optical module is coupled to the first substrate or a module mounted on the first substrate, the at least one first optical connector has a front face that is within an inch of a front surface of the front panel.

25. The system of claim 16 in which the fiber guide has a length of at least one inch.

26. The system of claim 16 in which the fiber guide has a length of at least two inches.

27. The system of claim 16 in which the fiber guide has a length of at least four inches.

28. The system of claim 16 wherein the fiber guide has a length configured such that when the pluggable module is inserted through the opening in the front panel and the optical module is coupled to the first substrate or a module mounted on the first substrate, the at least one first optical connector has a front face that is within an inch of a front surface of the front panel.

29. The system of claim 28 , comprising two or more pluggable modules, in which each pluggable module comprises an optical module, at least one first optical connector, a first fiber optic cable that is optically coupled between the optical module and the first optical connector, and a fiber guide that is positioned between the optical module and the first optical connector;

wherein the fiber guides are configured to allow air blown from an inlet fan to flow past the fiber guides and carry away heat generated by the optical modules.

30. The system of claim 16 wherein the fiber guide comprises at least one of metal or a thermal conductive material.

31. The system of claim 16 wherein the fiber guide comprises a hollow tube.

32. The system of claim 16 wherein the fiber guide is rigid along a direction from the first optical connector to the optical module and has a strength sufficient to withstand a compression force exerted on the pluggable module when the pluggable module is inserted through the opening in the front panel and coupled to the first substrate.

33. The system of claim 16 wherein the fiber guide has a spatial fan-out design such that a first portion of the fiber guide near the optical module has a smaller dimension compared to the dimension of a second portion of the fiber guide near the at least one first optical connector.

34. The system of claim 33 wherein the at least one first optical connector has an overall footprint that is larger than a footprint of the optical module.

35. The system of claim 16 wherein a photon supply is disposed in, on, or near the fiber guide, and the photon supply is configured to provide optical power supply light to the optical module.

36. The system of claim 35 wherein the photon supply is thermally coupled to an inner surface or an outer surface of the fiber guide, and the fiber guide is configured to assist in dissipating heat from the photon supply.

37. The system of claim 16 , comprising guide rails configured to guide the optical module as the optical module moves from a first position near the front panel to a second position near the first substrate.

38. The system of claim 37 wherein the optical module comprises a co-packaged optical module comprising a photonic integrated circuit and one or more electrical integrated circuits that condition electrical signals transmitted to or from the photonic integrated circuit.

39. The system of claim 38 , comprising a co-packaged optical module (CPO) mount attached to the first substrate, and the guide rails are configured to provide rigid connections between the CPO mount and the front panel or a front portion of the fiber guide.

40. The system of claim 38 wherein the photonic integrated circuit comprises at least one of (i) a photodetector to convert optical signals to electrical signals, or (ii) a modulator to convert electrical signals to optical signals.

41. The system of claim 37 wherein the system comprises a co-packaged optical module (CPO) mount and a bolster plate, the co-packaged optical module is mounted on the first substrate through the CPO mount, and the bolster plate is positioned to the rear of the substrate and configured to exert a force in a front direction when the guide rails are fastened to a front portion of the fiber guide or to the front panel.

42. The system of claim 1 , in which the first substrate has a main surface that is oriented at an angle in a range of 0 to 45 degrees relative to the front panel.

43. The system of claim 1 , comprising a laser module configured to provide optical power to the optical module.

44. The system of claim 43 , comprising a first heat dissipating device and a second heat dissipating device, the first heat dissipating device is thermally isolated from the second heat dissipating device, the first heat dissipating device is thermally coupled to the optical module, and the second heat dissipating device is thermally coupled to the laser module.

45. The system of claim 1 in which the fiber guide comprises at least one of metal or a thermal conductive material.

46. The system of claim 1 in which the fiber guide comprises a hollow tube.

47. The system of claim 1 in which the fiber guide is rigid along a direction from the first optical connector to the optical module and has a strength sufficient to withstand a compression force exerted on the pluggable module when the pluggable module is inserted through the opening in the front panel and coupled to the first substrate.

48. The system of claim 1 in which the fiber guide has a spatial fan-out design such that a first portion of the fiber guide near the optical module has a smaller dimension compared to the dimension of a second portion of the fiber guide near the at least one first optical connector.

49. The system of claim 48 in which the at least one first optical connector has an overall footprint that is larger than a footprint of the optical module.

50. The system of claim 1 in which the data processor comprises at least a network switch, a central processor unit, a graphics processor unit, a tensor processing unit, a neural network processor, an artificial intelligence accelerator, a digital signal processor, a microcontroller, an application specific integrated circuit (ASIC), or a storage device.

51. The system of claim 1 in which a photon supply is disposed in, on, or near the fiber guide, and the photon supply is configured to provide optical power supply light to the optical module.

52. The system of claim 51 in which the photon supply is thermally coupled to an inner surface or an outer surface of the fiber guide, and the fiber guide is configured to assist in dissipating heat from the photon supply.

53. The system of claim 1 , comprising guide rails configured to guide the optical module as the optical module moves from a first position near the front panel to a second position near the first substrate.

54. A rackmount server comprising:

a housing having a front panel and a rear panel, in which the front panel defines an opening, and the rear panel is at a first distance from the front panel; and

a substrate that is positioned at a second distance from the front panel, in which the second distance is less than one-third of the first distance, a data processor is mounted on the substrate, the substrate has a main surface that is oriented at an angle in a range of 0 to 45 degrees relative to the front panel;

wherein at least one of (i) the substrate has electrical contacts that are configured to be electrically coupled to electrical contacts of a co-packaged optical module, or (ii) a first module is mounted on the substrate, in which the first module has electrical contacts that are configured to be electrically coupled to electrical contacts of a co-packaged optical module.

55. The rackmount server of claim 54 in which the opening in the front panel is configured to allow a pluggable module that includes the co-packaged optical module to be inserted through the opening to enable the co-packaged optical module to be electrically coupled to the electrical contacts on the substrate or the electrical contacts on the first module mounted on the substrate.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 10, 2026
From: NUBIS COMMUNICATIONS, INC.
To: CIENA CORPORATION
Reel/Frame 073746/0125 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 31, 2022
From: WINZER, PETER JOHANNES; PUPALAIKIS, PETER JAMES; SAWYER, BRETT MICHAEL DUNN; ZHANG, RON; GILES, CLINTON RANDY
To: NUBIS COMMUNICATIONS, INC.
Reel/Frame 061590/0786 →
Continuity (10)
Provisional Application 63324429 · Mar 28, 2022
Provisional Application 63316551 · Mar 4, 2022
Provisional Application 63272025 · Oct 26, 2021
Provisional Application 63245559 · Sep 17, 2021
Provisional Application 63245011 · Sep 16, 2021
Provisional Application 63245005 · Sep 16, 2021
Provisional Application 63225779 · Jul 26, 2021
Provisional Application 63223685 · Jul 20, 2021
Provisional Application 63212013 · Jun 17, 2021
Related Publication 20230018654A1 · Jan 19, 2023
References Cited (400)
US 5136410A · Heiling et al. · 1992 [cited by applicant]
US 5229925A · Spencer et al. · 1993 [cited by applicant]
US 5412497A · Kaetsu et al. · 1995 [cited by applicant]
US 6305848B1 · Gregory · 2001 [cited by applicant]
US 6396990B1 · Ehn et al. · 2002 [cited by applicant]
US 6411520B1 · Hauke et al. · 2002 [cited by applicant]
US 6563696B1 · Harris et al. · 2003 [cited by applicant]
US 6675976B2 · Steinman et al. · 2004 [cited by applicant]
US 6769812B1 · Handforth · 2004 [cited by examiner]
US 6822874B1 · Marler · 2004 [cited by applicant]
US 6924986B1 · Sardella et al. · 2005 [cited by applicant]
US 7042737B1 · Woolsey · 2006 [cited by examiner]
US 7170749B2 · Hoshino et al. · 2007 [cited by applicant]
US 7180751B1 · Geschke et al. · 2007 [cited by applicant]
US 7239523B1 · Collins et al. · 2007 [cited by applicant]
US 7643292B1 · Chen · 2010 [cited by applicant]
US 7787772B2 · Ota · 2010 [cited by applicant]
US 7813143B2 · Dorenkamp et al. · 2010 [cited by applicant]
US 8047856B2 · Mccolloch · 2011 [cited by applicant]
US 8090230B1 · Hasharoni et al. · 2012 [cited by applicant]
US 8116095B2 · Dorenkamp et al. · 2012 [cited by applicant]
US 8208253B1 · Goergen et al. · 2012 [cited by applicant]
US 8482917B2 · Rose · 2013 [cited by examiner]
US 8488921B2 · Doany et al. · 2013 [cited by applicant]
US 8780551B2 · Farnholtz · 2014 [cited by applicant]
US 8992099B2 · Blackwell et al. · 2015 [cited by applicant]
US 9250649B2 · Shabbir et al. · 2016 [cited by applicant]
US 9301025B2 · Kioski et al. · 2016 [cited by applicant]
US 9366832B2 · Arao et al. · 2016 [cited by applicant]
US 9461768B2 · Kipp · 2016 [cited by applicant]
US 9557478B2 · Doerr et al. · 2017 [cited by applicant]
US 9622388B1 · Gaal · 2017 [cited by applicant]
US 9645316B1 · Hasharoni et al. · 2017 [cited by applicant]
US 9722381B1 · Moen et al. · 2017 [cited by applicant]
US 9768881B2 · Georgas et al. · 2017 [cited by applicant]
US 9781546B2 · Barrett et al. · 2017 [cited by applicant]
US 9786641B2 · Budd et al. · 2017 [cited by applicant]
US 9794195B1 · Wilson et al. · 2017 [cited by applicant]
US 9874688B2 · Doerr et al. · 2018 [cited by applicant]
US 9927575B2 · Goodwill et al. · 2018 [cited by applicant]
US 10012811B2 · Rivaud et al. · 2018 [cited by applicant]
US 10018787B1 · Wang · 2018 [cited by examiner]
US 10025043B2 · Vallance et al. · 2018 [cited by applicant]
US 10054749B1 · Wang · 2018 [cited by examiner]
US 10082633B2 · Schaevitz et al. · 2018 [cited by applicant]
US 10135218B2 · Popovic et al. · 2018 [cited by applicant]
US 10135539B2 · Moss et al. · 2018 [cited by applicant]
US 10178798B1 · Christensen et al. · 2019 [cited by applicant]
US 10209464B2 · Pfnuer et al. · 2019 [cited by applicant]
US 10215944B2 · Sedor et al. · 2019 [cited by applicant]
US 10234646B2 · Mack et al. · 2019 [cited by applicant]
US 10271461B2 · Schmidtke · 2019 [cited by examiner]
US 10330875B2 · Fini et al. · 2019 [cited by applicant]
US 10365436B2 · Byrd et al. · 2019 [cited by applicant]
US 10365445B2 · Badihi · 2019 [cited by applicant]
US 10514509B2 · Popovic et al. · 2019 [cited by applicant]
US 10568238B1 · Leung · 2020 [cited by examiner]
US 10582639B1 · Chopra · 2020 [cited by examiner]
US 10615903B2 · Welch · 2020 [cited by applicant]
US 10725245B2 · Leigh et al. · 2020 [cited by applicant]
US 10750250B1 · Parker et al. · 2020 [cited by applicant]
US 10866376B1 · Ghiasi · 2020 [cited by applicant]
US 10884205B2 · Leigh et al. · 2021 [cited by applicant]
US 10905025B1 · Thomas et al. · 2021 [cited by applicant]
US 11005572B1 · Chiang et al. · 2021 [cited by applicant]
US 11051422B2 · Norton et al. · 2021 [cited by applicant]
US 11058034B2 · Leung · 2021 [cited by examiner]
US 11079559B2 · Leclair et al. · 2021 [cited by applicant]
US 11107770B1 · Ramalingam et al. · 2021 [cited by applicant]
US 11121776B2 · Aboagye · 2021 [cited by examiner]
US 11153670B1 · Winzer · 2021 [cited by applicant]
US 11165509B1 · Nagarajan et al. · 2021 [cited by applicant]
US 11190172B1 · Raj et al. · 2021 [cited by applicant]
US 11194109B2 · Winzer · 2021 [cited by applicant]
US 11276955B2 · Rivaud et al. · 2022 [cited by applicant]
US 11287585B2 · Winzer · 2022 [cited by applicant]
US 11381891B2 · Leigh · 2022 [cited by examiner]
US 11385426B2 · Bechtolsheim · 2022 [cited by examiner]
US 11411643B1 · Chaouch · 2022 [cited by applicant]
US 11483943B2 · Leigh et al. · 2022 [cited by applicant]
US 11509399B2 · Paraiso et al. · 2022 [cited by applicant]
US 11510329B2 · Leigh · 2022 [cited by examiner]
US 11521543B2 · Morris et al. · 2022 [cited by applicant]
US 11525967B1 · Bismuto et al. · 2022 [cited by applicant]
US 11543671B2 · Xu et al. · 2023 [cited by applicant]
US 11551636B1 · Buckley et al. · 2023 [cited by applicant]
US 11557875B2 · Kovsh · 2023 [cited by examiner]
US 11573387B2 · Sawyer et al. · 2023 [cited by applicant]
US 11580662B2 · Kimura · 2023 [cited by applicant]
US 11585977B2 · Lambert · 2023 [cited by applicant]
US 11592629B2 · Kawamura et al. · 2023 [cited by applicant]
US 11596073B2 · Zhang et al. · 2023 [cited by applicant]
US 11602086B2 · Crisp et al. · 2023 [cited by applicant]
US 11604347B2 · Axelrod et al. · 2023 [cited by applicant]
US 11609873B2 · Cannata et al. · 2023 [cited by applicant]
US 11612079B2 · Nagarajan et al. · 2023 [cited by applicant]
US 11615044B2 · Cannata et al. · 2023 [cited by applicant]
US 11620805B2 · Carminati et al. · 2023 [cited by applicant]
US 11627682B2 · Murakami · 2023 [cited by applicant]
US 11630261B2 · Xie · 2023 [cited by applicant]
US 11630799B2 · Nagarajan et al. · 2023 [cited by applicant]
US 11632175B2 · Di Mola et al. · 2023 [cited by applicant]
US 11639846B2 · Xian et al. · 2023 [cited by applicant]
US 11644628B1 · Brisebois et al. · 2023 [cited by applicant]
US 11650384B2 · Edwards et al. · 2023 [cited by applicant]
US 11650631B2 · Watamura et al. · 2023 [cited by applicant]
US 11652129B1 · Vincentsen et al. · 2023 [cited by applicant]
US 11657684B2 · Gupta et al. · 2023 [cited by applicant]
US 11662081B2 · Tamma et al. · 2023 [cited by applicant]
US 11665862B2 · Crisp et al. · 2023 [cited by applicant]
US 11665863B2 · Crisp et al. · 2023 [cited by applicant]
US 11668590B2 · Xie · 2023 [cited by applicant]
US 11675114B2 · Teissier et al. · 2023 [cited by applicant]
US 11677478B2 · Nagarajan et al. · 2023 [cited by applicant]
US 11681019B2 · O'Connor et al. · 2023 [cited by applicant]
US 11681209B1 · Sullivan et al. · 2023 [cited by applicant]
US 11681443B1 · Venugopal et al. · 2023 [cited by applicant]
US 11687480B2 · Heyd et al. · 2023 [cited by applicant]
US 11688088B2 · Kimura · 2023 [cited by applicant]
US 11699243B2 · Von Cramon · 2023 [cited by applicant]
US 11710914B2 · Azuma et al. · 2023 [cited by applicant]
US 11716278B1 · Grandhye et al. · 2023 [cited by applicant]
US 11719898B2 · Nagarajan et al. · 2023 [cited by applicant]
US 11720514B2 · Shah et al. · 2023 [cited by applicant]
US 11727858B2 · Peng et al. · 2023 [cited by applicant]
US 11735560B2 · Nishihara · 2023 [cited by applicant]
US 11736195B2 · Leclair et al. · 2023 [cited by applicant]
US 11754767B1 · Soskind et al. · 2023 [cited by applicant]
US 11757705B2 · Vobbilisetty et al. · 2023 [cited by applicant]
US 11764339B2 · Biebersdorf et al. · 2023 [cited by applicant]
US 11764878B2 · Pezeshki et al. · 2023 [cited by applicant]
US 11778354B2 · Chaouch et al. · 2023 [cited by applicant]
US 11817903B2 · Pleros et al. · 2023 [cited by applicant]
US 11828954B2 · Huang et al. · 2023 [cited by applicant]
US 11836019B2 · Dube et al. · 2023 [cited by applicant]
US 11844186B2 · Mcparland et al. · 2023 [cited by applicant]
US 11853587B2 · Tang et al. · 2023 [cited by applicant]
US 11863917B2 · Meister et al. · 2024 [cited by applicant]
US 11868279B2 · Long et al. · 2024 [cited by applicant]
US 11895798B2 · Winzer et al. · 2024 [cited by applicant]
US 11988874B2 · Winzer et al. · 2024 [cited by applicant]
US 11997819B2 · Winzer et al. · 2024 [cited by applicant]
US 12004318B2 · Winzer et al. · 2024 [cited by applicant]
US 12019289B2 · Winzer et al. · 2024 [cited by applicant]
US 12029004B2 · Winzer et al. · 2024 [cited by applicant]
US 12055766B2 · Pupalaikis et al. · 2024 [cited by applicant]
US 12066653B2 · Winzer et al. · 2024 [cited by applicant]
US 12101904B2 · Cole et al. · 2024 [cited by applicant]
US 12250024B2 · Winzer et al. · 2025 [cited by applicant]
US 20020003232A1 · Ahn et al. · 2002 [cited by applicant]
US 20020142634A1 · Poplawski et al. · 2002 [cited by applicant]
US 20030030977A1 · Garnett et al. · 2003 [cited by applicant]
US 20030081287A1 · Jannson et al. · 2003 [cited by applicant]
US 20030201462A1 · Pommer et al. · 2003 [cited by applicant]
US 20030211759A1 · Olzak et al. · 2003 [cited by applicant]
US 20040027462A1 · Hing · 2004 [cited by applicant]
US 20040033016A1 · Kropp · 2004 [cited by applicant]
US 20040257766A1 · Rasmussen et al. · 2004 [cited by applicant]
US 20040264838A1 · Uchida et al. · 2004 [cited by applicant]
US 20050025409A1 · Welch et al. · 2005 [cited by applicant]
US 20050083653A1 · Chen · 2005 [cited by applicant]
US 20050111810A1 · Giraud et al. · 2005 [cited by applicant]
US 20050124224A1 · Schunk · 2005 [cited by applicant]
US 20050147117A1 · Pettey et al. · 2005 [cited by applicant]
US 20050224946A1 · Dutta · 2005 [cited by applicant]
US 20060005038A1 · Kitahara et al. · 2006 [cited by applicant]
US 20060062526A1 · Ikeuchi · 2006 [cited by applicant]
US 20060128091A1 · Chidambarrao et al. · 2006 [cited by applicant]
US 20060239605A1 · Palen et al. · 2006 [cited by applicant]
US 20070223865A1 · Lu et al. · 2007 [cited by applicant]
US 20070258683A1 · Rolston et al. · 2007 [cited by applicant]
US 20080055847A1 · Belady et al. · 2008 [cited by applicant]
US 20080181608A1 · Parker et al. · 2008 [cited by applicant]
US 20080259566A1 · Fried · 2008 [cited by applicant]
US 20090093073A1 · Chan et al. · 2009 [cited by applicant]
US 20090113698A1 · Love et al. · 2009 [cited by applicant]
US 20090154932A1 · Hinderthuer et al. · 2009 [cited by applicant]
US 20100008038A1 · Coglitore · 2010 [cited by applicant]
US 20100054681A1 · Biribuze · 2010 [cited by examiner]
US 20100097752A1 · Doll et al. · 2010 [cited by applicant]
US 20100262285A1 · Teranaka · 2010 [cited by applicant]
US 20100265658A1 · Sawai et al. · 2010 [cited by applicant]
US 20100284698A1 · Mccolloch · 2010 [cited by applicant]
US 20100288420A1 · Kimura et al. · 2010 [cited by applicant]
US 20100302754A1 · Nordin et al. · 2010 [cited by applicant]
US 20110150486A1 · Davidson et al. · 2011 [cited by applicant]
US 20110188054A1 · Petronius et al. · 2011 [cited by applicant]
US 20110188815A1 · Blackwell et al. · 2011 [cited by applicant]
US 20110261427A1 · Hart et al. · 2011 [cited by applicant]
US 20120014639A1 · Doany et al. · 2012 [cited by applicant]
US 20120120596A1 · Bechtolsheim et al. · 2012 [cited by applicant]
US 20120201542A1 · Dahlfort · 2012 [cited by applicant]
US 20120219263A1 · Beamon et al. · 2012 [cited by applicant]
US 20120257355A1 · Yi et al. · 2012 [cited by applicant]
US 20130016947A1 · Roitberg et al. · 2013 [cited by applicant]
US 20130089293A1 · Howard et al. · 2013 [cited by applicant]
US 20130094827A1 · Haataja · 2013 [cited by applicant]
US 20130102237A1 · Zhou et al. · 2013 [cited by applicant]
US 20130107454A1 · Wilke et al. · 2013 [cited by applicant]
US 20130193304A1 · Yu et al. · 2013 [cited by applicant]
US 20130279916A1 · Cho et al. · 2013 [cited by applicant]
US 20130315586A1 · Kipp · 2013 [cited by applicant]
US 20130342993A1 · Singleton · 2013 [cited by applicant]
US 20140002988A1 · Roesner et al. · 2014 [cited by applicant]
US 20140049931A1 · Wellbrock et al. · 2014 [cited by applicant]
US 20140064659A1 · Doerr et al. · 2014 [cited by applicant]
US 20140098492A1 · Lam · 2014 [cited by examiner]
US 20140106582A1 · Wig et al. · 2014 [cited by applicant]
US 20140133101A1 · Sunaga et al. · 2014 [cited by applicant]
US 20140306131A1 · Mack et al. · 2014 [cited by applicant]
US 20140321803A1 · Thacker et al. · 2014 [cited by applicant]
US 20140321804A1 · Thacker · 2014 [cited by applicant]
US 20140327902A1 · Giger et al. · 2014 [cited by applicant]
US 20150037044A1 · Peterson et al. · 2015 [cited by applicant]
US 20150094896A1 · Cuddihy et al. · 2015 [cited by applicant]
US 20150107101A1 · DeCusatis et al. · 2015 [cited by applicant]
US 20150125110A1 · Anderson et al. · 2015 [cited by applicant]
US 20150139223A1 · Mayenburg · 2015 [cited by examiner]
US 20150261269A1 · Bruscoe · 2015 [cited by applicant]
US 20150293305A1 · Nakagawa et al. · 2015 [cited by applicant]
US 20150350914A1 · Baxley et al. · 2015 [cited by applicant]
US 20160011390A1 · Montalvo Urbano et al. · 2016 [cited by applicant]
US 20160062068A1 · Giraud et al. · 2016 [cited by applicant]
US 20160073544A1 · Heyd et al. · 2016 [cited by applicant]
US 20160116693A1 · Oki et al. · 2016 [cited by applicant]
US 20160125706A1 · Butterbaugh et al. · 2016 [cited by applicant]
US 20160127931A1 · Baxley et al. · 2016 [cited by applicant]
US 20160156999A1 · Liboiron-Ladouceur et al. · 2016 [cited by applicant]
US 20160209610A1 · Kurtz et al. · 2016 [cited by applicant]
US 20160291273A1 · Nguyen · 2016 [cited by applicant]
US 20160337727A1 · Graves et al. · 2016 [cited by applicant]
US 20160377821A1 · Vallance et al. · 2016 [cited by applicant]
US 20170005446A1 · Regnier · 2017 [cited by applicant]
US 20170077643A1 · Zbinden et al. · 2017 [cited by applicant]
US 20170123164A1 · Suematsu et al. · 2017 [cited by applicant]
US 20170131469A1 · Kobrinsky et al. · 2017 [cited by applicant]
US 20170139145A1 · Heanue et al. · 2017 [cited by applicant]
US 20170168253A1 · Wilcox et al. · 2017 [cited by applicant]
US 20170181314A1 · Leigh et al. · 2017 [cited by applicant]
US 20170308725A1 · Sardaryan et al. · 2017 [cited by applicant]
US 20170332519A1 · Schmidtke · 2017 [cited by examiner]
US 20170363826A1 · Zer et al. · 2017 [cited by applicant]
US 20170364295A1 · Sardinha · 2017 [cited by examiner]
US 20180131056A1 · Sato · 2018 [cited by applicant]
US 20180159651A1 · Li et al. · 2018 [cited by applicant]
US 20180188459A1 · Mekis et al. · 2018 [cited by applicant]
US 20180196196A1 · Byrd et al. · 2018 [cited by applicant]
US 20180223582A1 · Shin et al. · 2018 [cited by applicant]
US 20180231727A1 · Kurtz et al. · 2018 [cited by applicant]
US 20180278332A1 · Leigh et al. · 2018 [cited by applicant]
US 20180295737A1 · Balasubramanian · 2018 [cited by examiner]
US 20180303004A1 · Zhai et al. · 2018 [cited by applicant]
US 20180306990A1 · Badihi · 2018 [cited by examiner]
US 20180329159A1 · Mathai et al. · 2018 [cited by applicant]
US 20180335558A1 · Fini et al. · 2018 [cited by applicant]
US 20180335595A1 · Takeuchi et al. · 2018 [cited by applicant]
US 20190027898A1 · Bovington et al. · 2019 [cited by applicant]
US 20190027899A1 · Krishnamoorthy et al. · 2019 [cited by applicant]
US 20190027901A1 · Zheng et al. · 2019 [cited by applicant]
US 20190028207A1 · Saeedi et al. · 2019 [cited by applicant]
US 20190033528A1 · Ootorii · 2019 [cited by applicant]
US 20190086618A1 · Shastri et al. · 2019 [cited by applicant]
US 20190098788A1 · Leigh et al. · 2019 [cited by applicant]
US 20190116689A1 · Chen et al. · 2019 [cited by applicant]
US 20190207342A1 · Aden et al. · 2019 [cited by applicant]
US 20190208290A1 · Olson · 2019 [cited by examiner]
US 20190258175A1 · Dietrich et al. · 2019 [cited by applicant]
US 20190293971A1 · Yu et al. · 2019 [cited by applicant]
US 20190307014A1 · Adiletta · 2019 [cited by examiner]
US 20190312642A1 · Neilson et al. · 2019 [cited by applicant]
US 20190317287A1 · Raghunathan et al. · 2019 [cited by applicant]
US 20200015386A1 · Gupta · 2020 [cited by applicant]
US 20200033544A1 · Costello · 2020 [cited by applicant]
US 20200053904A1 · Panella et al. · 2020 [cited by applicant]
US 20200073061A1 · Leigh et al. · 2020 [cited by applicant]
US 20200077544A1 · Leung et al. · 2020 [cited by applicant]
US 20200158964A1 · Winzer et al. · 2020 [cited by applicant]
US 20200158967A1 · Winzer et al. · 2020 [cited by applicant]
US 20200161243A1 · Lee et al. · 2020 [cited by applicant]
US 20200163242A1 · Leigh et al. · 2020 [cited by applicant]
US 20200183104A1 · Truong et al. · 2020 [cited by applicant]
US 20200219865A1 · Nelson et al. · 2020 [cited by applicant]
US 20200292769A1 · Zbinden · 2020 [cited by applicant]
US 20210044356A1 · Aboagye · 2021 [cited by examiner]
US 20210072473A1 · Wall, Jr. · 2021 [cited by applicant]
US 20210084749A1 · Devalla et al. · 2021 [cited by applicant]
US 20210091536A1 · Nagarajan et al. · 2021 [cited by applicant]
US 20210112683A1 · Mohajer et al. · 2021 [cited by applicant]
US 20210142177A1 · Mallya et al. · 2021 [cited by applicant]
US 20210157076A1 · Mazzini et al. · 2021 [cited by applicant]
US 20210210894A1 · Rivaud et al. · 2021 [cited by applicant]
US 20210211785A1 · Rose · 2021 [cited by examiner]
US 20210239927A1 · Rivaud et al. · 2021 [cited by applicant]
US 20210247580A1 · Reagan · 2021 [cited by examiner]
US 20210263247A1 · Bechtolsheim · 2021 [cited by examiner]
US 20210279841A1 · Liu et al. · 2021 [cited by applicant]
US 20210281323A1 · Williams et al. · 2021 [cited by applicant]
US 20210281932A1 · Chaouch · 2021 [cited by examiner]
US 20210286140A1 · Winzer · 2021 [cited by applicant]
US 20210294052A1 · Winzer · 2021 [cited by applicant]
US 20210305127A1 · Refai-Ahmed et al. · 2021 [cited by applicant]
US 20210345024A1 · Leigh · 2021 [cited by examiner]
US 20210345511A1 · Leigh et al. · 2021 [cited by applicant]
US 20210367674A1 · Leclair et al. · 2021 [cited by applicant]
US 20210376950A1 · Winzer · 2021 [cited by applicant]
US 20210385000A1 · Nagarajan et al. · 2021 [cited by applicant]
US 20210389536A1 · Dietrich et al. · 2021 [cited by applicant]
US 20210409117A1 · Sengupta · 2021 [cited by applicant]
US 20220003946A1 · Edwards, Jr. et al. · 2022 [cited by applicant]
US 20220029379A1 · Kovsh · 2022 [cited by examiner]
US 20220029380A1 · Kovsh · 2022 [cited by examiner]
US 20220092795A1 · Liu et al. · 2022 [cited by applicant]
US 20220102583A1 · Baumheinrich et al. · 2022 [cited by applicant]
US 20220109501A1 · Latchman · 2022 [cited by examiner]
US 20220114125A1 · Thakur et al. · 2022 [cited by applicant]
US 20220141949A1 · Devalla · 2022 [cited by examiner]
US 20220141990A1 · Gupta · 2022 [cited by examiner]
US 20220159860A1 · Winzer · 2022 [cited by examiner]
US 20220159878A1 · Dillman et al. · 2022 [cited by applicant]
US 20220187559A1 · Lin et al. · 2022 [cited by applicant]
US 20220244465A1 · Winzer · 2022 [cited by examiner]
US 20220263586A1 · Winzer · 2022 [cited by examiner]
US 20220264759A1 · Sawyer · 2022 [cited by examiner]
US 20220279256A1 · Chaouch · 2022 [cited by examiner]
US 20220329020A1 · Narayanan et al. · 2022 [cited by applicant]
US 20230003958A1 · Shimazu et al. · 2023 [cited by applicant]
US 20230018654A1 · Winzer · 2023 [cited by examiner]
US 20230039781A1 · Mohajer et al. · 2023 [cited by applicant]
US 20230043794A1 · Winzer · 2023 [cited by applicant]
US 20230064740A1 · Rathinasamy · 2023 [cited by examiner]
US 20230077979A1 · Winzer · 2023 [cited by applicant]
US 20230161109A1 · Pupalaikis · 2023 [cited by examiner]
US 20230176304A1 · Winzer · 2023 [cited by examiner]
US 20230209761A1 · Winzer · 2023 [cited by applicant]
US 20230258873A1 · Pupalaikis et al. · 2023 [cited by applicant]
US 20230305247A1 · Hemp et al. · 2023 [cited by applicant]
US 20230305249A1 · Hemp et al. · 2023 [cited by applicant]
US 20230354541A1 · Cole et al. · 2023 [cited by applicant]
US 20230358979A1 · Winzer et al. · 2023 [cited by applicant]
US 20230375793A1 · Winzer et al. · 2023 [cited by applicant]
US 20230380095A1 · Winzer et al. · 2023 [cited by applicant]
US 20240036254A1 · Winzer · 2024 [cited by applicant]
US 20240049434A1 · Mohajer et al. · 2024 [cited by applicant]
US 20240064922A1 · Winzer · 2024 [cited by applicant]
US 20240118484A1 · Winzer et al. · 2024 [cited by applicant]
US 20240142731A1 · Hemp et al. · 2024 [cited by applicant]
US 20240159979A1 · Winzer et al. · 2024 [cited by applicant]
US 20240302612A1 · Winzer et al. · 2024 [cited by applicant]
US 20240418943A1 · Winzer et al. · 2024 [cited by applicant]
US 20250031336A1 · Winzer et al. · 2025 [cited by applicant]
US 20250098095A1 · Cole et al. · 2025 [cited by applicant]
CA 3055376A1 · 2018 [cited by applicant]
CN 103402337B · 2016 [cited by applicant]
CN 103339439B · 2016 [cited by applicant]
CN 112969946A · 2021 [cited by applicant]
CN 110879442A · 2022 [cited by applicant]
DE 2833302A1 · 1980 [cited by applicant]
JP 2010176010 · 2010 [cited by applicant]
JP 2013051448A · 2013 [cited by applicant]
WO WO2006113094A2 · 2006 [cited by applicant]
WO WO2009107671A1 · 2009 [cited by applicant]
WO WO2020083845 · 2020 [cited by applicant]
WO WO2021183792 · 2021 [cited by applicant]
WO WO2021188648 · 2021 [cited by applicant]
WO WO2021211725 · 2021 [cited by applicant]
WO WO2021247521 · 2021 [cited by applicant]
WO WO2022061160 · 2022 [cited by applicant]
WO WO2022076539 · 2022 [cited by applicant]
WO WO2022109349 · 2022 [cited by applicant]
WO WO2023183703 · 2023 [cited by applicant]
Extended European Search Report in European Appln. No. 22195981, dated Feb. 14, 2023, 9 pages. [cited by applicant]
[No Author Listed], “Support Tomorrow's Speeds Inside Today's Footprint; Molex Solutions for 112 Gbps Architecture,” Molex, 2019, 7 pages. [cited by applicant]
Amazon.com [online], “IBM Midplane Board-8852Refurbished, 25R5780Refurbished),” Jun. 30, 2014, retrieved on Nov. 22, 2022, retrieved from URL< https://www.amazon.com/IBM-MIDPLANE-BOARD-8852-Refurbished-25R5780/dp/B00LEQ… [cited by applicant]
International Search Report and Written Opinion in International Appln. No. PCT/US2022/033870, mailed Sep. 28, 2022, 15 pages. [cited by applicant]
Dogruoz et al., “Optimizing QSFP-DD Systems to Achieve at Least 25 Watt Thermal Port Performance,” QSFP-DD, Jan. 2021, 30 pages. [cited by applicant]
Kocsis et al., “OSFP MDI Proposal,” Amphenol, High Speed Interconnects, Mar. 6, 2016, 13 pages. [cited by applicant]
Narasimha et al., “A 40-GB/s QSFP Optoelectronic Transceiver in a 0.13μm CMOS Silicon-on-Insulator Technology,” OFC/NFOEC 2008—2008 Conference on Optical Fiber Communication/National Fiber Optic Engineers Conference, Fe… [cited by applicant]
Samtec.com [online], “Flyover® QSFP Cable Systems, Cages, and Heat Sinks,” 2022, retrieved on Dec. 22, 2022, retrieved from URL<https://www.samtec.com/cables/high-speed/assemblies/qsfp-flyover>, 12 pages. [cited by applicant]
Tracy, “Supporting Data to Demonstrate 100Gbps Capability of Proposed MDIs,” TW Connectivity, Sep. 13, 2018, 9 pages. [cited by applicant]
U.S. Appl. No. 17/495,338, filed Oct. 6, 2021, Winzer et al. [cited by applicant]
U.S. Appl. No. 17/531,470, filed Nov. 19, 2021, Sawyer et al. [cited by applicant]
U.S. Appl. No. 17/592,232, filed Feb. 3, 2022, Winzer. [cited by applicant]
[No Author Listed] [online], “InnoLight's 400G QSFP-DD Optical Transceiver,” 2021, Internet Archive: Wayback Machine URL<https://web.archive.org/web/20210124174453/https://www.systemplus.fr/reverse-costing-reports/innol… [cited by applicant]
[No Author Listed], “QSFP-DD/QSFP-DD800/QSFP112 Hardware Specification for QSFP Double Density 8X and QSFP 4X Pluggable Transceivers,” QSFP-DD, Revision 6.01, May 28, 2021, 167 pages. [cited by applicant]
[No Author Listed], “Specification for OSFP OCTAL Small Form Factor Pluggable Module,” OSFP MSA, Rev 4.0, May 28, 2021, 109 pages. [cited by applicant]
Edn.com [Online], “Transceiver targets 4x Fibre Channel Applications,” Jan. 20, 2005, retrieved on Jul. 5, 2022, retrieved from URL<https://www.edn.com/transceiver-targets-4x-fibre-channel-applications/>, 6 pages. [cited by applicant]
Indico.cern.ch [online], “A New High-Speed Optical Transceiver for Data Transmission at the LHC Experiments,” Jan. 30, 2014, retrieved Jul. 5, 2022, retrieved from URL<https://indico.cern.ch/event/287628/contributions/1… [cited by applicant]
Mymellanox.force.com [online], “Inside the Silicon Photonics Transceiver,” Dec. 5, 2018, retrieved on Jul. 5, 2022, retrieved from URL<https://community.mellanox.com/s/article/inside-the-silicon-photonics-transceiver>, … [cited by applicant]
Raj et al., “50Gb/s Hybrid Integrated Si-Photonic Optical Link in 16nm FinFET,” 2020 European Conference on Optical Communications (ECOC), Dec. 6-10, 2020, 4 pages. [cited by applicant]
Raj et al., “Design of a 50-Gb/s Hybrid Integrated Si-Photonic Optical Link in 16-nm FinFET,” IEEE Journal of Solid-State Circuits, Apr. 2020, 55:1086-1095. [cited by applicant]
Viavisolutions.com [online], “QSFP-DD Module Testing,” 2020, retrieved on Jul. 5, 2022, retrieved from URL<https://www.viavisolutions.com/en-us/literature/qsfp-dd-module-testing-white-papers-books-en.pdf>, 12 pages. [cited by applicant]
Brusberg et al., “On-board Optical Fiber and Embedded Waveguide Interconnects,” 2018 7th Electronic System-Integration Technology Conference (ESTC), Nov. 29, 2018, pp. 1-7. [cited by applicant]
Cook et al., “36-Channel Parallel Optical Interconnect Module Based on Optoelectronics-on-VLSI Technology,” IEEE Journal of Selected Topics in Quantum Electronics, Mar./Apr. 2003, 9(2):387-391. [cited by applicant]
Young et al., “Optical I/O Technology for Tera-Scale Computing,” IEEE Journal of Solid-State Circuits, Jan. 2010, 45(1):235-242. [cited by applicant]
[No Author Listed] [online], “The Promise of Co-Packaged Optics: Paving the Way for Improved Power Efficiency, Size, and Cost,” The Institute for Energy Efficiency, Oct. 2, 2020, retrieved on Jan. 11, 2023, <https://www… [cited by applicant]
[No Author Listed], “2020 Optical Fiber Communication Conference and Exhibition: Conference Schedule,” OFC 2020 tutorial M1H.4, Mar. 8-12, 2020, 152 pages. [cited by applicant]
[No Author Listed], “Hands-on with Intel Co-Packaged Optics and Silicon Photonics Switch,” Serve the Home, Mar. 18, 2020, retrieved on Feb. 15, 2022, <https://www.youtube.com/watch?v=Esgyj26vdxs>, 31 pages. [cited by applicant]
[No Author Listed], “MTP/MPO Breakout Cable Datasheet,” FS Technical Documents, Apr. 26, 2020, 9 pages. [cited by applicant]
[No Author Listed], “MTP/MPO Fiber Cables, Quick Start Guide V1.0,” FS Technical Documents, Mar. 24, 2020, 5 pages. [cited by applicant]
[No Author Listed], “Paradigm Change: Reinventing HPC Architectures with In-Package Optical I/O,” Ayar Labs, Solution Brief, Jul. 2, 2020, 9 pages. [cited by applicant]
Cited By (1)
US 12,621,056