Method to produce 3D semiconductor devices and structures with memory
A method for producing a 3D semiconductor device including: providing a first level, the first level including a first single crystal layer; forming first alignment marks and control circuits in and/or on the first level, where the control circuits include first single crystal transistors and at least two interconnection metal layers; forming at least one second level disposed above the control circuits; performing a first etch step into the second level; forming at least one third level disposed on top of the second level; performing additional processing steps to form first memory cells within the second level and second memory cells within the third level, where each of the first memory cells include at least one second transistor, where each of the second memory cells include at least one third transistor, and where the additional processing steps include depositing a gate electrode simultaneously for the second and third transistors.
1. A method for producing a 3D semiconductor device, the method comprising:
providing a first level, said first level comprising a first single crystal layer;
forming first alignment marks and control circuits in and/or on said first level,
wherein said control circuits comprise first single crystal transistors, and
wherein said control circuits comprise at least two interconnection metal layers;
forming at least one second level disposed above said control circuits;
performing a first etch step into said second level;
forming at least one third level disposed on top of said second level; and
performing additional processing steps to form a plurality of first memory cells within said second level and a plurality of second memory cells within said third level,
wherein each of said plurality of first memory cells comprise at least one second transistor,
wherein each of said plurality of second memory cells comprise at least one third transistor, and
wherein said additional processing steps comprise depositing a gate electrode simultaneously for said second transistors and said third transistors.
2. The method according to claim 1 , further comprising: processing said first memory cells into nonvolatile type memory cells.
3. The method according to claim 1 ,
wherein said second level comprises at least two overlaying layers.
4. The method according to claim 1 ,
wherein said first etch step comprises performing a lithography step aligned to said first alignment marks.
5. The method according to claim 1 ,
wherein said performing additional processing steps comprises using Atomic Layer Deposition (ALD).
6. The method according to claim 1 , further comprising:
processing a second etch step to open lithography windows to underlying alignment marks.
7. The method according to claim 1 ,
wherein said forming control circuits comprises using a weaker anneal process in consideration of subsequent thermal processing.
8. A method for producing a 3D semiconductor device, the method comprising:
providing a first level, said first level comprising a first single crystal layer;
forming first alignment marks and control circuits in and/or on said first level,
wherein said control circuits comprise first single crystal transistors, and
wherein said control circuits comprise at least two interconnection metal layers;
forming at least one second level disposed above said control circuits;
performing a first etch step into said second level;
forming at least one third level disposed on top of said second level; and
performing additional processing steps to form a plurality of first memory cells within said second level and plurality of second memory cells within said third level,
wherein each of said plurality of first memory cells comprise at least one second transistor,
wherein each of said plurality of second memory cells comprise at least one third transistor,
wherein said additional processing steps comprise depositing a gate electrode simultaneously for said second transistors and said third transistors, and
wherein said performing additional processing steps comprises using Atomic Layer Deposition (ALD).
9. The method according to claim 8 , further comprising:
processing said first memory cells into NAND nonvolatile type memory cells.
10. The method according to claim 8 ,
wherein said second level comprises at least two overlaying layers.
11. The method according to claim 8 ,
wherein said first etch step comprises performing a lithography step aligned to said first alignment marks.
12. The method according to claim 8 , further comprising:
forming at least one pair of bonded layers,
wherein said bonded comprises oxide to oxide bonds.
13. The method according to claim 8 , further comprising:
processing a second etch step to open lithography windows to underlying alignment marks.
14. The method according to claim 8 ,
wherein said forming control circuits comprises using a weaker anneal process in consideration of subsequent thermal processing.
15. A method for producing a 3D semiconductor device, the method comprising:
providing a first level, said first level comprising a first single crystal layer;
forming first alignment marks and control circuits in and/or on said first level,
wherein said control circuits comprise first single crystal transistors, and
wherein said control circuits comprise at least two interconnection metal layers;
forming at least one second level disposed above said control circuits;
performing a first etch step into said second level;
forming at least one third level disposed on top of said second level; and
performing additional processing steps to form a plurality of first memory cells within said second level and a plurality of second memory cells within said third level,
wherein each of said plurality of first memory cells comprise at least one second transistor,
wherein each of said plurality of second memory cells comprise at least one third transistor,
wherein said additional processing steps comprise depositing a gate electrode simultaneously for said second transistors and said third transistors, and
wherein said forming control circuits comprises using a weaker anneal process in consideration of subsequent thermal processing.
16. The method according to claim 15 , further comprising:
processing said plurality of first memory cells into NAND nonvolatile type memory cells.
17. The method according to claim 15 ,
wherein said second level comprises at least two overlaying layers.
18. The method according to claim 15 , further comprising:
forming at least one pair of bonded layers,
wherein said bonded comprises oxide to oxide bonds.
19. The method according to claim 15 , further comprising:
processing a second etch step to open lithography windows to underlying alignment marks.
20. The method according to claim 15 ,
wherein said performing additional processing steps comprises using Atomic Layer Deposition (ALD).