Multi-dimensional integrated circuits having semiconductors mounted on multi- dimensional planes and multi-dimensional memory structure
Monolithic multi-dimensional integrated circuits and memory architecture are provided. Exemplary integrated circuits comprise an electronic board having a first side and a second side, a multi-dimensional electronic package having multiple planes, and one or more semiconductor wafers mounted on the first side and the second side of the electronic board and on the multiple planes of the electronic package. Exemplary monolithic multi-dimensional memory architecture comprises one or more tiers, one or more monolithic inter-tier vias spanning the one or more tiers, at least one multiplexer disposed in one of the tiers, and control logic determining whether memory cells are active and which memory cells are active and controlling usage of the memory cells based on such determination. Each tier has a memory cell, and the inter-tier vias act as crossbars in multiple directions. The multiplexer is communicatively coupled to the memory cell in the respective tier. In exemplary embodiments, the one or more semiconductor wafers include one or more solar cells. The solar cells may comprise MEMS and/or on-chip solar cells.
1. A monolithic multi-dimensional memory architecture comprising:
one or more tiers, each tier having a memory cell;
one or more monolithic inter-tier vias spanning the one or more tiers, the inter-tier vias acting as crossbars and including vertical, horizontal, or angled crossbars;
at least one multiplexer disposed in one of the tiers, the multiplexer being communicatively coupled to the memory cell in the respective tier; and
control logic determining whether memory cells are active and which memory cells are active and controlling usage of the memory cells based on such determination;
wherein the monolithic inter-tier vias are minimized to small run-length; and
wherein a first vertical, horizontal or angled crossbar is associated with a first tier, and the first vertical, horizontal or angled crossbar couples a plurality of client memory units within a single tier to the first vertical, horizontal, or angled crossbar.
2. The memory architecture of claim 1 wherein the inter-tier vias act as crossbars in multiple directions.
3. The memory architecture of claim 1 wherein the crossbars are configured in a bee-hive structure.
4. The memory architecture of claim 1 wherein the crossbars are configured in a honeycomb structure.
5. The memory architecture of claim 4 further comprising one or more silicon sub-dies mounted to planes of the honeycomb structure.
6. The memory architecture of claim 1 further comprising an integrated circuit;
wherein the integrated circuit incorporates the memory architecture.
7. The memory architecture of claim 1 wherein the control logic deactivates unused memory cells to conserve power.
8. The memory architecture of claim 1 further comprising one or both of: a three-dimensional mask-programmed read-only memory or a three-dimensional electrically programmable read-only memory.
9. The memory architecture of claim 1 wherein at least one of the monolithic inter-tier vias acts as a horizontal crossbar communicating signals between memory cells within a single tier.
10. The memory architecture of claim 1 wherein at least one of the monolithic inter-tier vias acts as a vertical, horizontal or angled crossbar spanning tiers and communicatively couples electronic memory units between tiers.
11. The memory architecture of claim 1 wherein the monolithic inter-tier vias are minimized to small run-length in all directions.
12. The memory architecture of claim 1 further comprising one or more silicon sub-dies mounted to the one or more tiers.
13. The memory architecture of claim 1 wherein the crossbars are configured in a cube and sub-cube structure.
14. The memory architecture of claim 13 wherein the cube structure is constructed of multiple sub-cubes.
15. The memory architecture of claim 14 wherein memory cells are located on the planes of the sub-cubes.
16. The memory architecture of claim 1 wherein the at least one multiplexer comprises a first multiplexer disposed in a first tier and coupled to a first memory cell in the first tier and a second multiplexer disposed in a second tier and coupled to a second memory cell in the second tier.
17. A stack of integrated circuit memory chips, each integrated circuit memory chip containing memory circuitry comprising:
one or more tiers, each tier having a memory cell;
one or more monolithic inter-tier vias spanning the one or more tiers, the inter-tier vias acting as crossbars and including vertical, horizontal, or angled crossbars;
at least one multiplexer disposed in one of the tiers, the multiplexer being communicatively coupled to the memory cell in the respective tier; and
control logic determining whether memory cells are active and which memory cells are active and controlling usage of the memory cells based on such determination;
wherein a first vertical, horizontal or angled crossbar is associated with a first tier, and the first vertical, horizontal or angled crossbar couples a plurality of client memory units within a single tier to the first vertical, horizontal, or angled crossbar;
wherein the integrated circuit memory chips are located on multi-planar structure and connected via vertical, horizontal and angled crossbars.