IP Library › Granted Patent US 12,250,024
Granted Patent B2
US 12,250,024 · App. 17/947,045 · Granted Mar 11, 2025

Data processing systems including optical communication modules

Inventors: Peter Johannes Winzer (Aberdeen, NJ); Brett Michael Dunn Sawyer (Pasadena, CA); Ron Zhang (Sunnyvale, CA); Peter James Pupalaikis (Ramsey, NJ); Clinton Randy Giles (Watchung, NJ); Guilhem de Valicourt (Jersey City, NJ); Jonathan Proesel (Mount Vernon, NY)
Assignee: Nubis Communications, Inc.
H04B10/25
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,250,024
App. No.
17/947,045
Granted
Mar 11, 2025
Kind
B2
Abstract

A system includes a housing and a first circuit board positioned inside the housing. The housing has a top panel, a bottom panel, a left side panel, a right side panel, a front panel, and a rear panel. The front panel is at an angle relative to the bottom panel in which the angle is in a range from 30 to 150°. The first circuit board has a length, a width, and a thickness, in which the length is at least twice the thickness, the width is at least twice the thickness, and the first circuit board has a first surface defined by the length and the width. The first surface of the first circuit board is at a first angle relative to the bottom panel in which the first angle is in a range from 30 to 150°. The first surface of the first circuit board is substantially parallel to the front panel or at a second angle relative to the front panel in which the second angle is less than 60°. The system includes a first data processing module and a first optical interconnect module both electrically coupled to the first circuit board. The optical interconnect module is configured to receive first optical signals from a first optical link, convert the first optical signals to first electrical signals, and transmit the first electrical signals to the first data processing module.

Claims (116)

1. A system comprising:

a housing comprising a bottom panel and a front panel, wherein the front panel is at an angle relative to the bottom panel in which the angle is in a range from 30° to 150°;

a first circuit board positioned inside the housing, in which the first circuit board has a length, a width, and a thickness, wherein the length is at least twice the thickness, the width is at least twice the thickness, and the first circuit board has a first surface defined by the length and the width,

wherein the first surface of the first circuit board is at a first angle relative to the bottom panel in which the first angle is in a range from 30° to 150°,

wherein the first surface of the first circuit board is substantially parallel to the front panel or at a second angle relative to the front panel when the front panel is closed in which the second angle is less than 60°;

a first data processing module electrically coupled to the first circuit board; and

a first optical interconnect module electrically coupled to the first circuit board, in which the optical interconnect module is configured to receive first optical signals from a first optical link, convert the first optical signals to first electrical signals, and transmit the first electrical signals to the first data processing module.

2. The system of claim 1 , comprising a second circuit board that has a length, a width, and a thickness, in which the length is at least twice the thickness, the width is at least twice the thickness, and the second circuit board has a first surface defined by the length and the width,

wherein the first surface of the second circuit board is substantially parallel to the bottom panel or at an angle relative to the bottom panel in which the angle is less than 20°, and the second circuit board is electrically coupled to the first circuit board.

3. The system of claim 2 in which the second circuit board comprises a motherboard, the first circuit board comprises a daughter card, and the motherboard is configured to provide electrical power to the daughter card.

4. The system of claim 1 in which the front panel is spaced apart from the rear panel at a mean distance of at least 12 inches, and the first circuit board is spaced apart from the front panel at a mean distance of less than 4 inches.

5. The system of claim 1 in which the first data processing module comprises at least a network switch, a central processor unit, a graphics processor unit, a tensor processing unit, a neural network processor, an artificial intelligence accelerator, a digital signal processor, a microcontroller, an application specific integrated circuit (ASIC), or a data storage device.

6. The system of claim 5 in which the first data processing module is capable of processing data from the first optical interconnect module at a rate of at least 25 gigabits per second.

7. The system of claim 5 in which the first data processing module comprises an integrated circuit or a system on a chip (SoC) that includes at least one million transistors.

8. The system of claim 1 in which the system comprises a rackmount server, the housing comprises an enclosure for the rackmount server, and the rackmount server has an n rack unit form factor, and n is an integer in a range from 1 to 8.

9. The system of claim 1 in which the first data processing module is mounted on a substrate, and the substrate is electrically coupled to the first circuit board.

10. The system of claim 1 in which the first optical interconnect module is releasably coupled to the first circuit board.

11. The system of claim 10 in which a socket is mounted on the first circuit board, and the first optical interconnect module is releasably coupled to the socket.

12. The system of claim 1 in which the first optical interconnect module comprises a photonic integrated circuit mounted on a substrate, and the substrate is electrically coupled to the first circuit board.

13. The system of claim 1 in which the first optical interconnect module comprises a connector part that enables one or more optical fibers to be releasably connected to the first optical interconnect module.

14. The system of claim 1 in which the optical interconnect module is mounted on the first surface of the first circuit board, and the first surface faces the rear panel and away from the front panel.

15. The system of claim 14 in which the first circuit board defines a first opening, the front panel defines a second opening, the system comprises an optical path that passes through the first and second openings and enables the first optical signals from the first optical link to be transmitted to the first optical interconnect module.

16. The system of claim 1 in which the first electrical signals comprise first serial electrical signals, and the system comprises:

a first serializer/deserializer configured to generate a set of first parallel electrical signals based on the first serial electrical signals, and condition the first parallel electrical signals; and

a second serializer/deserializer configured to generate a second serial electrical signal based on the set of first parallel electrical signals;

wherein the first data processing module is configured to process data carried in the second serial electrical signal.

17. The system of claim 16 , comprising a third serializer/deserializer configured to generate a set of second parallel electrical signals based on the second serial electrical signal;

wherein the first data processing module is configured to process data carried by the set of second parallel electrical signals.

18. The system of claim 17 in which the third serializer/deserializer is embedded in the first data processing module.

19. The system of claim 1 in which the first optical interconnect module comprises a photonic integrated circuit and a first optical connector optically coupled to the photonic integrated circuit, the first optical connector is configured to releasably connect with a second optical connector that is coupled to a bundle of at least 100 optical fibers, and the first optical connector is configured to provide at least 100 optical paths to enable optical signals from the bundle of optical fibers to be coupled to the photonic integrated circuit.

20. The system of claim 1 in which the first optical interconnect module comprises an array of grating couplers, a plurality of optical waveguides coupled to the array of grating couplers, and a plurality of photodetectors coupled to the plurality of optical waveguides.

21. The system of claim 20 wherein the first optical interconnect module comprises a photonic integrated circuit and an optical fiber connector coupled to the photonic integrated circuit,

wherein the photonic integrated circuit comprises the array of grating couplers, the plurality of optical waveguides, and the plurality of photodetectors, and

wherein the optical fiber connector comprises an array of lenses configured to focus light to or from the grating couplers.

22. The system of claim 1 wherein the first data processing module is mounted directly or indirectly on the first circuit board.

23. The system of claim 22 wherein the first data processing module is mounted on the first circuit board.

24. The system of claim 22 wherein the first data processing module is mounted on a substrate or another circuit board, and the substrate or the other circuit board is mounted on the first circuit board.

25. The system of claim 1 wherein the first data processing module is supported by the first circuit board.

26. The system of claim 25 , comprising a heatsink for dissipating heat from the data processing module, and the heatsink is also supported by the first circuit board.

27. The system of claim 1 wherein the first data processing module communicates with the first optical interconnect module through electrical connectors or traces, and a majority of the connectors or traces are on or in the first circuit board.

28. The system of claim 1 wherein the first data processing module communicates with the first optical interconnect module through electrical connectors or traces, wherein each electrical connector or trace consists of a first portion followed by a second portion, the length of the first portion being longer than the length of the second portion, and wherein the first portion is completely on or in the first circuit board.

29. The system of claim 1 wherein the first data processing module communicates with the first optical interconnect module through electrical connectors or traces that are on or in the first circuit board and not on or in any other circuit board or substrate except for circuit board(s) or substrate(s), if any, that is/are positioned between the first data processing module and the first circuit board.

30. The system of claim 1 wherein the first data processing module has a main surface that is substantially parallel to a main surface of the first circuit board.

31. A system comprising:

a housing comprising a bottom panel and a front panel, the front panel comprising a plurality of optical connector parts, each optical connector part is configured to be optically coupled to an external optical fiber cable and an internal optical fiber cable;

a first circuit board or a first substrate positioned in the housing, in which the first circuit board or the first substrate is oriented at an angle relative to the bottom panel in which the angle is in a range from 30° to 150°;

wherein the first circuit board or the first substrate is substantially parallel to the front panel or at an angle relative to the front panel in which the angle is less than 60°;

a plurality of optical interconnect modules electrically coupled to the first circuit board; and

a plurality of internal optical fiber cables, in which each internal optical fiber cable is optically coupled to one of the optical interconnect modules and a corresponding optical connector part on the front panel.

32. The system of claim 31 wherein the front panel of the housing is configured to be movable between a closed position and an open position, when the front panel is at the closed position the first circuit board or the first substrate is positioned behind the front panel and substantially parallel to the front panel or at an angle relative to the front panel in which the angle is less than 60°.

33. A rackmount system configured to be placed on a rack during operation, the rackmount system comprising:

a housing comprising a front panel, in which the housing defines a front opening when the front panel is opened;

a first circuit board or a first substrate positioned in the housing;

a data processing module electrically coupled to the first circuit board or the first substrate, in which the data processing module has a throughput of at least 100 gigabits per second; and

a plurality of optical interface modules electrically coupled to a first surface of the first circuit board or the first substrate, in which at least one of the plurality of optical interface modules are configured to receive first optical signals, convert the first optical signals to first electrical signals, and transmit the first electrical signals to the data processing module, and at least one of the plurality of optical interface modules are configured to receive second electrical signals from the data processing module, convert the second electrical signals to second optical signals, and output the second optical signals;

wherein the first surface of the first circuit board or the first substrate is oriented to face towards the front opening to allow the optical interface modules to be accessed after the front panel is opened without removing the rackmount system from the rack, in which accessing the optical interface module includes at least one of attaching the optical interface module to the first circuit board or the first substrate, or removing the optical interface module from the first circuit board or the first substrate.

34. An apparatus comprising:

a co-packaged optical module comprising:

a photonic integrated circuit;

an optical connector coupled to a first surface of the photonic integrated circuit; and

a first set of at least two electrical integrated circuits that are coupled to the first surface of the photonic integrated circuit;

wherein the first set of at least two electrical integrated circuit comprises three electrical integrated circuits that surround three sides of the optical connector along a plane parallel to the first surface of the photonic integrated circuit.

35. The apparatus of claim 34 in which the three electrical integrated circuits comprise two electrical integrated circuits that are positioned on opposite sides of the optical connector along a plane parallel to the first surface of the photonic integrated circuit.

36. The apparatus of claim 34 in which the co-packaged optical module comprises:

a substrate, in which the photonic integrated circuit is mounted on the substrate, and

a second set of at least one electrical integrated circuit mounted on the substrate and electrically coupled to the photonic integrated circuit through one or more signal conductors and/or traces.

37. The apparatus of claim 34 in which the photonic integrated circuit comprises at least one of a photodetector or an optical modulator, and the first set of at least one integrated circuit comprises at least one of a transimpedance amplifier configured to amplify a current generated by the photodetector or a driver configured to drive the optical modulator.

38. The apparatus of claim 37 in which the second set of at least one electrical integrated circuit comprises a serializers/deserializers module.

39. The apparatus of claim 34 in which the photonic integrated circuit comprises a silicon substrate and an active layer at a second surface that is opposite to the first surface relative to the photonic integrated circuit,

wherein the active layer comprises grating couplers, and at least one of photodetectors or optical modulators,

wherein the optical connector is optically coupled to the grating couplers using backside illumination; and

wherein the first set of at least one electrical integrated circuits is coupled to the at least one of photodetectors or optical modulators using through silicon vias.

40. An apparatus comprising:

a co-packaged optical module comprising:

a photonic integrated circuit;

an optical connector coupled to a first surface of the photonic integrated circuit;

a first set of at least one electrical integrated circuit that is coupled to a second surface of the photonic integrated circuit, in which the second surface is opposite to the first surface relative to the photonic integrated circuit;

wherein the photonic integrated circuit comprises an active layer at the first surface, the active layer comprises grating couplers, and at least one of photodetectors or optical modulators;

wherein the optical connector has a footprint that overlaps a footprint of the grating couplers;

wherein the at least one of photodetectors or optical modulators are spaced apart from the grating couplers; and

wherein the first set of at least one electrical integrated circuits is coupled to the at least one of photodetectors or optical modulators using through silicon vias.

41. The apparatus of claim 40 in which the photonic integrated circuit comprises a silicon substrate and an active layer at the second surface,

wherein the active layer comprises grating couplers, and at least one of photodetectors or optical modulators,

wherein the optical connector is optically coupled to the grating couplers using backside illumination; and

wherein the at least one of photodetectors or optical modulators are spaced apart from the grating couplers, and the first set of at least one electrical integrated circuits is electrically coupled to the at least one of photodetectors or optical modulators.

42. The apparatus of claim 40 in which the photonic integrated circuit comprises at least one of a photodetector or an optical modulator, and the first set of at least one integrated circuit comprises at least one of a transimpedance amplifier configured to amplify a current generated by the photodetector or a driver configured to drive the optical modulator.

43. The apparatus of claim 42 in which the co-packaged optical module comprises:

a substrate, in which the photonic integrated circuit is mounted on the substrate, and

a second set of at least one electrical integrated circuit mounted on the substrate and electrically coupled to the photonic integrated circuit through one or more signal conductors and/or traces.

44. The apparatus of claim 43 in which the second set of at least one electrical integrated circuit comprises a serializers/deserializers module.

45. The system of claim 31 , comprising at least one inlet fan configured to push at least a first portion of inlet air toward at least one of (i) the plurality of optical interconnect modules, or (ii) at least one first heat dissipating device thermally coupled to the plurality of optical interconnect modules.

46. The system of claim 45 in which the at least one inlet fan is configured to push at least a second portion of the inlet air toward at least one of (i) the data processing module, or (ii) at least one second heat dissipating device thermally coupled to the data processing module.

47. The system of claim 45 in which at least one of (i) at least one inlet fan is attached to a portion of the front panel, or (ii) at least one inlet fan is positioned near the front panel in which at least a portion of a fan blade of the at least one inlet fan is within a first distance from the front panel for at least some time period during operation of the at least one inlet fan, the first distance is less than one-fourth of a second distance between the front panel and a rear panel.

48. The apparatus of claim 34 in which the first set of at least one electrical integrated circuit comprises four electrical integrated circuits that surround four sides of the optical connector along a plane parallel to the first surface of the photonic integrated circuit.

49. An apparatus comprising:

a co-packaged optical module comprising:

a photonic integrated circuit;

an optical connector coupled to a first surface of the photonic integrated circuit; and

a first set of at least two electrical integrated circuits that are coupled to the first surface of the photonic integrated circuit;

wherein the photonic integrated circuit comprises a silicon substrate and an active layer at a second surface that is opposite to the first surface relative to the photonic integrated circuit,

wherein the active layer comprises grating couplers, and at least one of photodetectors or optical modulators;

wherein the optical connector is optically coupled to the grating couplers using backside illumination; and

wherein the first set of at least one electrical integrated circuits is coupled to the at least one of photodetectors or optical modulators using through silicon vias.

50. The apparatus of claim 49 wherein the co-packaged optical module comprises:

a substrate, wherein the photonic integrated circuit is mounted on the substrate, and

a second set of at least one electrical integrated circuit mounted on the substrate and electrically coupled to the photonic integrated circuit through one or more signal conductors and/or traces.

51. An apparatus comprising:

a co-packaged optical module comprising:

a photonic integrated circuit;

an optical connector coupled to a first surface of the photonic integrated circuit;

a first set of at least one electrical integrated circuit that is coupled to a second surface of the photonic integrated circuit, wherein the second surface is opposite to the first surface relative to the photonic integrated circuit;

wherein the photonic integrated circuit comprises a silicon substrate and an active layer at the second surface;

wherein the active layer comprises grating couplers, and at least one of photodetectors or optical modulators;

wherein the optical connector is optically coupled to the grating couplers using backside illumination; and

wherein the at least one of photodetectors or optical modulators are spaced apart from the grating couplers, and the first set of at least one electrical integrated circuits is electrically coupled to the at least one of photodetectors or optical modulators.

52. The apparatus of claim 51 wherein the photonic integrated circuit comprises at least one of a photodetector or an optical modulator, and the first set of at least one integrated circuit comprises at least one of a transimpedance amplifier configured to amplify a current generated by the photodetector or a driver configured to drive the optical modulator.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2026
From: NUBIS COMMUNICATIONS, INC.
To: CIENA CORPORATION
Reel/Frame 073911/0036 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 21, 2024
From: WINZER, PETER JOHANNES; DUNN SAWYER, BRETT MICHAEL; ZHANG, RON; PUPALAIKIS, PETER JAMES; GILES, CLINTON RANDY; DE VALICOURT, GUILHEM; PROESEL, JONATHAN
To: NUBIS COMMUNICATIONS, INC.
Reel/Frame 067800/0162 →
Continuity (4)
Provisional Application 63245559 · Sep 17, 2021
Provisional Application 63245011 · Sep 16, 2021
Provisional Application 63245005 · Sep 16, 2021
Related Publication 20230077979A1 · Mar 16, 2023
References Cited (400)
US 5136410A · Heiling et al. · 1992 [cited by applicant]
US 5229925A · Spencer et al. · 1993 [cited by applicant]
US 6305848B1 · Gregory · 2001 [cited by applicant]
US 6396990B1 · Ehn et al. · 2002 [cited by applicant]
US 6411520B1 · Hauke et al. · 2002 [cited by applicant]
US 6563696B1 · Harris et al. · 2003 [cited by applicant]
US 6675976B2 · Steinman et al. · 2004 [cited by applicant]
US 6769812B1 · Handforth · 2004 [cited by applicant]
US 6822874B1 · Marler · 2004 [cited by applicant]
US 6924986B1 · Sardella et al. · 2005 [cited by applicant]
US 7042737B1 · Woolsey et al. · 2006 [cited by applicant]
US 7170749B2 · Hoshino et al. · 2007 [cited by applicant]
US 7180751B1 · Geschke et al. · 2007 [cited by applicant]
US 7239523B1 · Collins et al. · 2007 [cited by applicant]
US 7643292B1 · Chen · 2010 [cited by applicant]
US 7787772B2 · Ota · 2010 [cited by applicant]
US 7813143B2 · Dorenkamp et al. · 2010 [cited by applicant]
US 8047856B2 · Mccolloch · 2011 [cited by applicant]
US 8090230B1 · Hasharoni et al. · 2012 [cited by applicant]
US 8116095B2 · Dorenkamp et al. · 2012 [cited by applicant]
US 8208253B1 · Goergen et al. · 2012 [cited by applicant]
US 8482917B2 · Rose · 2013 [cited by applicant]
US 8488921B2 · Doany et al. · 2013 [cited by applicant]
US 8780551B2 · Farnholtz · 2014 [cited by applicant]
US 8992099B2 · Blackwell et al. · 2015 [cited by applicant]
US 9250649B2 · Shabbir et al. · 2016 [cited by applicant]
US 9301025B2 · Kioski et al. · 2016 [cited by applicant]
US 9366832B2 · Arao et al. · 2016 [cited by applicant]
US 9461768B2 · Kipp · 2016 [cited by applicant]
US 9557478B2 · Doerr et al. · 2017 [cited by applicant]
US 9622388B1 · Gaal · 2017 [cited by applicant]
US 9645316B1 · Hasharoni et al. · 2017 [cited by applicant]
US 9722381B1 · Moen et al. · 2017 [cited by applicant]
US 9768881B2 · Georgas et al. · 2017 [cited by applicant]
US 9781546B2 · Barrett et al. · 2017 [cited by applicant]
US 9786641B2 · Budd et al. · 2017 [cited by applicant]
US 9794195B1 · Wilson et al. · 2017 [cited by applicant]
US 9874688B2 · Doerr et al. · 2018 [cited by applicant]
US 9927575B2 · Goodwill et al. · 2018 [cited by applicant]
US 10012811B2 · Rivaud et al. · 2018 [cited by applicant]
US 10018787B1 · Wang · 2018 [cited by applicant]
US 10025043B2 · Vallance et al. · 2018 [cited by applicant]
US 10054749B1 · Wang et al. · 2018 [cited by applicant]
US 10082633B2 · Schaevitz et al. · 2018 [cited by applicant]
US 10135218B2 · Popovic et al. · 2018 [cited by applicant]
US 10135539B2 · Moss et al. · 2018 [cited by applicant]
US 10209464B2 · Pfnuer et al. · 2019 [cited by applicant]
US 10215944B2 · Sedor et al. · 2019 [cited by applicant]
US 10234646B2 · Mack et al. · 2019 [cited by applicant]
US 10271461B2 · Schmidtke · 2019 [cited by applicant]
US 10330875B2 · Fini et al. · 2019 [cited by applicant]
US 10365436B2 · Byrd et al. · 2019 [cited by applicant]
US 10514509B2 · Popovic et al. · 2019 [cited by applicant]
US 10568238B1 · Leung · 2020 [cited by applicant]
US 10582639B1 · Chopra · 2020 [cited by applicant]
US 10615903B2 · Welch · 2020 [cited by applicant]
US 10725245B2 · Leigh et al. · 2020 [cited by applicant]
US 10750250B1 · Parker et al. · 2020 [cited by applicant]
US 10866376B1 · Ghiasi · 2020 [cited by applicant]
US 10905025B1 · Thomas et al. · 2021 [cited by applicant]
US 11005572B1 · Chiang et al. · 2021 [cited by applicant]
US 11051422B2 · Norton et al. · 2021 [cited by applicant]
US 11058034B2 · Leung · 2021 [cited by applicant]
US 11079559B2 · Leclair et al. · 2021 [cited by applicant]
US 11107770B1 · Ramalingam et al. · 2021 [cited by applicant]
US 11121776B2 · Aboagye · 2021 [cited by applicant]
US 11153670B1 · Winzer · 2021 [cited by applicant]
US 11165509B1 · Nagarajan et al. · 2021 [cited by applicant]
US 11190172B1 · Raj et al. · 2021 [cited by applicant]
US 11194109B2 · Winzer · 2021 [cited by applicant]
US 11276955B2 · Rivaud et al. · 2022 [cited by applicant]
US 11287585B2 · Winzer · 2022 [cited by applicant]
US 11381891B2 · Leigh · 2022 [cited by applicant]
US 11385426B2 · Bechtolsheim et al. · 2022 [cited by applicant]
US 11411643B1 · Chaouch · 2022 [cited by applicant]
US 11483943B2 · Leigh et al. · 2022 [cited by applicant]
US 11509399B2 · Paraiso et al. · 2022 [cited by applicant]
US 11510329B2 · Leigh · 2022 [cited by applicant]
US 11521543B2 · Morris et al. · 2022 [cited by applicant]
US 11525967B1 · Bismuto et al. · 2022 [cited by applicant]
US 11543671B2 · Xu et al. · 2023 [cited by applicant]
US 11551636B1 · Buckley et al. · 2023 [cited by applicant]
US 11557875B2 · Kovsh · 2023 [cited by applicant]
US 11573387B2 · Sawyer et al. · 2023 [cited by applicant]
US 11580662B2 · Kimura · 2023 [cited by applicant]
US 11585977B2 · Lambert · 2023 [cited by applicant]
US 11592629B2 · Kawamura et al. · 2023 [cited by applicant]
US 11596073B2 · Zhang et al. · 2023 [cited by applicant]
US 11602086B2 · Crisp et al. · 2023 [cited by applicant]
US 11604347B2 · Axelrod et al. · 2023 [cited by applicant]
US 11609873B2 · Cannata et al. · 2023 [cited by applicant]
US 11612079B2 · Nagarajan et al. · 2023 [cited by applicant]
US 11615044B2 · Cannata et al. · 2023 [cited by applicant]
US 11620805B2 · Carminati et al. · 2023 [cited by applicant]
US 11621795B2 · Winzer · 2023 [cited by applicant]
US 11627682B2 · Murakami · 2023 [cited by applicant]
US 11630261B2 · Xie · 2023 [cited by applicant]
US 11630799B2 · Nagarajan et al. · 2023 [cited by applicant]
US 11632175B2 · Di Mola et al. · 2023 [cited by applicant]
US 11639846B2 · Xian et al. · 2023 [cited by applicant]
US 11644628B1 · Brisebois et al. · 2023 [cited by applicant]
US 11650384B2 · Edwards et al. · 2023 [cited by applicant]
US 11650631B2 · Watamura et al. · 2023 [cited by applicant]
US 11652129B1 · Vincentsen et al. · 2023 [cited by applicant]
US 11657684B2 · Gupta et al. · 2023 [cited by applicant]
US 11662081B2 · Tamma et al. · 2023 [cited by applicant]
US 11665862B2 · Crisp et al. · 2023 [cited by applicant]
US 11665863B2 · Crisp et al. · 2023 [cited by applicant]
US 11668590B2 · Xie · 2023 [cited by applicant]
US 11675114B2 · Teissier et al. · 2023 [cited by applicant]
US 11677478B2 · Nagarajan et al. · 2023 [cited by applicant]
US 11681019B2 · O'Connor et al. · 2023 [cited by applicant]
US 11681209B1 · Sullivan et al. · 2023 [cited by applicant]
US 11681443B1 · Venugopal et al. · 2023 [cited by applicant]
US 11687480B2 · Heyd et al. · 2023 [cited by applicant]
US 11688088B2 · Kimura · 2023 [cited by applicant]
US 11699243B2 · Von Cramon · 2023 [cited by applicant]
US 11710914B2 · Azuma et al. · 2023 [cited by applicant]
US 11716278B1 · Grandhye et al. · 2023 [cited by applicant]
US 11720514B2 · Shah et al. · 2023 [cited by applicant]
US 11727858B2 · Peng et al. · 2023 [cited by applicant]
US 11735560B2 · Nishihara · 2023 [cited by applicant]
US 11736195B2 · Leclair et al. · 2023 [cited by applicant]
US 11754767B1 · Soskind et al. · 2023 [cited by applicant]
US 11757705B2 · Vobbilisetty et al. · 2023 [cited by applicant]
US 11764339B2 · Biebersdorf et al. · 2023 [cited by applicant]
US 11764878B2 · Pezeshki et al. · 2023 [cited by applicant]
US 11778354B2 · Chaouch et al. · 2023 [cited by applicant]
US 11817903B2 · Pleros et al. · 2023 [cited by applicant]
US 11828954B2 · Huang et al. · 2023 [cited by applicant]
US 11836019B2 · Dube et al. · 2023 [cited by applicant]
US 11844186B2 · Mcparland et al. · 2023 [cited by applicant]
US 11853587B2 · Tang et al. · 2023 [cited by applicant]
US 11868279B2 · Long et al. · 2024 [cited by applicant]
US 11895798B2 · Winzer et al. · 2024 [cited by applicant]
US 11988874B2 · Winzer et al. · 2024 [cited by applicant]
US 11997819B2 · Winzer et al. · 2024 [cited by applicant]
US 12004318B2 · Winzer et al. · 2024 [cited by applicant]
US 12019289B2 · Winzer et al. · 2024 [cited by applicant]
US 12029004B2 · Winzer et al. · 2024 [cited by applicant]
US 12055766B2 · Pupalaikis et al. · 2024 [cited by applicant]
US 12066653B2 · Winzer et al. · 2024 [cited by applicant]
US 12101904B2 · Cole et al. · 2024 [cited by applicant]
US 20020003232A1 · Ahn et al. · 2002 [cited by applicant]
US 20020142634A1 · Poplawski · 2002 [cited by examiner]
US 20030030977A1 · Garnett et al. · 2003 [cited by applicant]
US 20030081287A1 · Jannson et al. · 2003 [cited by applicant]
US 20030211759A1 · Olzak et al. · 2003 [cited by applicant]
US 20040027462A1 · Hing · 2004 [cited by applicant]
US 20040033016A1 · Kropp · 2004 [cited by applicant]
US 20040257766A1 · Rasmussen · 2004 [cited by examiner]
US 20040264838A1 · Uchida et al. · 2004 [cited by applicant]
US 20050025409A1 · Welch et al. · 2005 [cited by applicant]
US 20050083653A1 · Chen · 2005 [cited by applicant]
US 20050111810A1 · Giraud et al. · 2005 [cited by applicant]
US 20050124224A1 · Schunk · 2005 [cited by applicant]
US 20050147117A1 · Pettey et al. · 2005 [cited by applicant]
US 20050224946A1 · Dutta · 2005 [cited by applicant]
US 20060005038A1 · Kitahara et al. · 2006 [cited by applicant]
US 20060062526A1 · Ikeuchi · 2006 [cited by applicant]
US 20060128091A1 · Chidambarrao et al. · 2006 [cited by applicant]
US 20060239605A1 · Palen et al. · 2006 [cited by applicant]
US 20070223865A1 · Lu et al. · 2007 [cited by applicant]
US 20070258683A1 · Rolston et al. · 2007 [cited by applicant]
US 20080055847A1 · Belady et al. · 2008 [cited by applicant]
US 20080181608A1 · Parker et al. · 2008 [cited by applicant]
US 20080259566A1 · Fried · 2008 [cited by applicant]
US 20090093073A1 · Chan et al. · 2009 [cited by applicant]
US 20090113698A1 · Love et al. · 2009 [cited by applicant]
US 20090154932A1 · Hinderthuer et al. · 2009 [cited by applicant]
US 20100008038A1 · Coglitore · 2010 [cited by applicant]
US 20100054681A1 · Biribuze · 2010 [cited by applicant]
US 20100097752A1 · Doll et al. · 2010 [cited by applicant]
US 20100262285A1 · Teranaka · 2010 [cited by applicant]
US 20100265658A1 · Sawai et al. · 2010 [cited by applicant]
US 20100284698A1 · Mccolloch · 2010 [cited by applicant]
US 20100288420A1 · Kimura · 2010 [cited by examiner]
US 20100302754A1 · Nordin et al. · 2010 [cited by applicant]
US 20110150486A1 · Davidson et al. · 2011 [cited by applicant]
US 20110188054A1 · Petronius et al. · 2011 [cited by applicant]
US 20110188815A1 · Blackwell et al. · 2011 [cited by applicant]
US 20110261427A1 · Hart et al. · 2011 [cited by applicant]
US 20120014639A1 · Doany et al. · 2012 [cited by applicant]
US 20120120596A1 · Bechtolsheim et al. · 2012 [cited by applicant]
US 20120201542A1 · Dahlfort · 2012 [cited by applicant]
US 20120257355A1 · Yi et al. · 2012 [cited by applicant]
US 20130089293A1 · Howard et al. · 2013 [cited by applicant]
US 20130094827A1 · Haataja · 2013 [cited by applicant]
US 20130102237A1 · Zhou et al. · 2013 [cited by applicant]
US 20130107454A1 · Wilke et al. · 2013 [cited by applicant]
US 20130193304A1 · Yu et al. · 2013 [cited by applicant]
US 20130279916A1 · Cho et al. · 2013 [cited by applicant]
US 20130315586A1 · Kipp · 2013 [cited by applicant]
US 20130342993A1 · Singleton · 2013 [cited by applicant]
US 20140002988A1 · Roesner et al. · 2014 [cited by applicant]
US 20140049931A1 · Wellbrock et al. · 2014 [cited by applicant]
US 20140064659A1 · Doerr et al. · 2014 [cited by applicant]
US 20140098492A1 · Lam · 2014 [cited by applicant]
US 20140106582A1 · Wig et al. · 2014 [cited by applicant]
US 20140133101A1 · Sunaga et al. · 2014 [cited by applicant]
US 20140306131A1 · Mack et al. · 2014 [cited by applicant]
US 20140321803A1 · Thacker · 2014 [cited by examiner]
US 20140321804A1 · Thacker · 2014 [cited by applicant]
US 20140327902A1 · Giger et al. · 2014 [cited by applicant]
US 20150037044A1 · Peterson et al. · 2015 [cited by applicant]
US 20150094896A1 · Cuddihy et al. · 2015 [cited by applicant]
US 20150107101A1 · DeCusatis et al. · 2015 [cited by applicant]
US 20150125110A1 · Anderson et al. · 2015 [cited by applicant]
US 20150139223A1 · Mayenburg · 2015 [cited by examiner]
US 20150261269A1 · Bruscoe · 2015 [cited by applicant]
US 20150293305A1 · Nakagawa et al. · 2015 [cited by applicant]
US 20160011390A1 · Montalvo Urbano · 2016 [cited by examiner]
US 20160062068A1 · Giraud et al. · 2016 [cited by applicant]
US 20160073544A1 · Heyd et al. · 2016 [cited by applicant]
US 20160116693A1 · Oki et al. · 2016 [cited by applicant]
US 20160125706A1 · Butterbaugh et al. · 2016 [cited by applicant]
US 20160156999A1 · Liboiron-Ladouceur · 2016 [cited by examiner]
US 20160209610A1 · Kurtz et al. · 2016 [cited by applicant]
US 20160216445A1 · Thacker et al. · 2016 [cited by applicant]
US 20160291273A1 · Nguyen · 2016 [cited by applicant]
US 20160337727A1 · Graves et al. · 2016 [cited by applicant]
US 20160377821A1 · Vallance et al. · 2016 [cited by applicant]
US 20170005446A1 · Regnier · 2017 [cited by applicant]
US 20170077643A1 · Zbinden · 2017 [cited by examiner]
US 20170123164A1 · Suematsu et al. · 2017 [cited by applicant]
US 20170131469A1 · Kobrinsky · 2017 [cited by examiner]
US 20170139145A1 · Heanue et al. · 2017 [cited by applicant]
US 20170168253A1 · Wilcox et al. · 2017 [cited by applicant]
US 20170181314A1 · Leigh et al. · 2017 [cited by applicant]
US 20170308725A1 · Sardaryan et al. · 2017 [cited by applicant]
US 20170332519A1 · Schmidtke · 2017 [cited by applicant]
US 20170363826A1 · Zer et al. · 2017 [cited by applicant]
US 20170364295A1 · Sardinha et al. · 2017 [cited by applicant]
US 20180131056A1 · Sato · 2018 [cited by applicant]
US 20180159651A1 · Li et al. · 2018 [cited by applicant]
US 20180188459A1 · Mekis et al. · 2018 [cited by applicant]
US 20180196196A1 · Byrd et al. · 2018 [cited by applicant]
US 20180223582A1 · Shin · 2018 [cited by examiner]
US 20180231727A1 · Kurtz et al. · 2018 [cited by applicant]
US 20180278332A1 · Leigh · 2018 [cited by examiner]
US 20180295737A1 · Balasubramania et al. · 2018 [cited by applicant]
US 20180303004A1 · Zhai et al. · 2018 [cited by applicant]
US 20180306990A1 · Badihi · 2018 [cited by examiner]
US 20180329159A1 · Mathai et al. · 2018 [cited by applicant]
US 20180335558A1 · Fini et al. · 2018 [cited by applicant]
US 20180335595A1 · Takeuchi · 2018 [cited by examiner]
US 20190027898A1 · Bovington et al. · 2019 [cited by applicant]
US 20190027899A1 · Krishnamoorthy et al. · 2019 [cited by applicant]
US 20190027901A1 · Zheng et al. · 2019 [cited by applicant]
US 20190028207A1 · Saeedi et al. · 2019 [cited by applicant]
US 20190033528A1 · Ootorii · 2019 [cited by applicant]
US 20190086618A1 · Shastri et al. · 2019 [cited by applicant]
US 20190098788A1 · Leigh et al. · 2019 [cited by applicant]
US 20190116689A1 · Chen et al. · 2019 [cited by applicant]
US 20190207342A1 · Aden et al. · 2019 [cited by applicant]
US 20190208290A1 · Olson · 2019 [cited by applicant]
US 20190258175A1 · Dietrich et al. · 2019 [cited by applicant]
US 20190285815A1 · Sugiyama · 2019 [cited by applicant]
US 20190293971A1 · Yu et al. · 2019 [cited by applicant]
US 20190307014A1 · Adiletta · 2019 [cited by applicant]
US 20190312642A1 · Neilson et al. · 2019 [cited by applicant]
US 20190317287A1 · Raghunathan et al. · 2019 [cited by applicant]
US 20200015386A1 · Gupta · 2020 [cited by examiner]
US 20200033544A1 · Costello · 2020 [cited by examiner]
US 20200073061A1 · Leigh et al. · 2020 [cited by applicant]
US 20200077544A1 · Leung · 2020 [cited by examiner]
US 20200104064A1 · The et al. · 2020 [cited by applicant]
US 20200132930A1 · Bchir · 2020 [cited by examiner]
US 20200158964A1 · Winzer et al. · 2020 [cited by applicant]
US 20200158967A1 · Winzer et al. · 2020 [cited by applicant]
US 20200161243A1 · Lee et al. · 2020 [cited by applicant]
US 20200163242A1 · Leigh et al. · 2020 [cited by applicant]
US 20200219865A1 · Nelson et al. · 2020 [cited by applicant]
US 20200292769A1 · Zbinden · 2020 [cited by applicant]
US 20210044356A1 · Aboagye · 2021 [cited by examiner]
US 20210072473A1 · Wall, Jr. · 2021 [cited by applicant]
US 20210074677A1 · Kwon et al. · 2021 [cited by applicant]
US 20210084749A1 · Devalla et al. · 2021 [cited by applicant]
US 20210112683A1 · Mohajer et al. · 2021 [cited by applicant]
US 20210210894A1 · Rivaud et al. · 2021 [cited by applicant]
US 20210211785A1 · Rose et al. · 2021 [cited by applicant]
US 20210239927A1 · Rivaud et al. · 2021 [cited by applicant]
US 20210247580A1 · Reagan · 2021 [cited by applicant]
US 20210257021A1 · Meade et al. · 2021 [cited by applicant]
US 20210263247A1 · Bechtolsheim et al. · 2021 [cited by applicant]
US 20210281323A1 · Williams et al. · 2021 [cited by applicant]
US 20210281932A1 · Chaouch et al. · 2021 [cited by applicant]
US 20210286140A1 · Winzer · 2021 [cited by applicant]
US 20210294052A1 · Winzer · 2021 [cited by applicant]
US 20210305127A1 · Refai-Ahmed et al. · 2021 [cited by applicant]
US 20210345024A1 · Leigh · 2021 [cited by examiner]
US 20210345511A1 · Leigh · 2021 [cited by examiner]
US 20210367674A1 · Leclair et al. · 2021 [cited by applicant]
US 20210376950A1 · Winzer · 2021 [cited by applicant]
US 20210384989A1 · Nagarajan et al. · 2021 [cited by applicant]
US 20210385000A1 · Nagarajan et al. · 2021 [cited by applicant]
US 20210389536A1 · Dietrich · 2021 [cited by examiner]
US 20220003946A1 · Edwards, Jr. et al. · 2022 [cited by applicant]
US 20220029379A1 · Kovsh · 2022 [cited by examiner]
US 20220029380A1 · Kovsh · 2022 [cited by examiner]
US 20220102583A1 · Baumheinrich et al. · 2022 [cited by applicant]
US 20220103261A1 · Di Mola et al. · 2022 [cited by applicant]
US 20220109501A1 · Latchman · 2022 [cited by applicant]
US 20220114125A1 · Thakur et al. · 2022 [cited by applicant]
US 20220141949A1 · Devalla et al. · 2022 [cited by applicant]
US 20220141990A1 · Gupta · 2022 [cited by examiner]
US 20220158752A1 · Duthel et al. · 2022 [cited by applicant]
US 20220159860A1 · Winzer · 2022 [cited by applicant]
US 20220159878A1 · Dillman et al. · 2022 [cited by applicant]
US 20220187559A1 · Lin et al. · 2022 [cited by applicant]
US 20220244465A1 · Winzer · 2022 [cited by examiner]
US 20220263586A1 · Winzer · 2022 [cited by applicant]
US 20220264759A1 · Sawyer et al. · 2022 [cited by applicant]
US 20220279256A1 · Chaouch et al. · 2022 [cited by applicant]
US 20220291461A1 · Elsinger et al. · 2022 [cited by applicant]
US 20220292035A1 · Li et al. · 2022 [cited by applicant]
US 20220329020A1 · Narayanan et al. · 2022 [cited by applicant]
US 20230003958A1 · Shimazu et al. · 2023 [cited by applicant]
US 20230018654A1 · Winzer · 2023 [cited by applicant]
US 20230039781A1 · Mohajer et al. · 2023 [cited by applicant]
US 20230043794A1 · Winzer · 2023 [cited by applicant]
US 20230064740A1 · Rathinasamy · 2023 [cited by applicant]
US 20230258873A1 · Pupalaikis et al. · 2023 [cited by applicant]
US 20230161109A1 · Pupalaikis et al. · 2023 [cited by applicant]
US 20230176304A1 · Winzer · 2023 [cited by applicant]
US 20230209761A1 · Winzer · 2023 [cited by applicant]
US 20230305247A1 · Hemp et al. · 2023 [cited by applicant]
US 20230305249A1 · Hemp et al. · 2023 [cited by applicant]
US 20230354541A1 · Cole et al. · 2023 [cited by applicant]
US 20230358979A1 · Winzer et al. · 2023 [cited by applicant]
US 20230375793A1 · Winzer et al. · 2023 [cited by applicant]
US 20230380095A1 · Winzer et al. · 2023 [cited by applicant]
US 20240036254A1 · Winzer · 2024 [cited by applicant]
US 20240049434A1 · Mohajer et al. · 2024 [cited by applicant]
US 20240064922A1 · Winzer · 2024 [cited by applicant]
US 20240097796A1 · Winzer · 2024 [cited by applicant]
US 20240118484A1 · Winzer et al. · 2024 [cited by applicant]
US 20240302612A1 · Winzer et al. · 2024 [cited by applicant]
CA 3055376 · 2018 [cited by applicant]
CN 103402337 · 2016 [cited by applicant]
DE 2833302 · 1980 [cited by applicant]
JP 2010176010 · 2010 [cited by applicant]
JP 2013051448 · 2013 [cited by applicant]
WO WO2006113094 · 2006 [cited by applicant]
WO WO2009107671 · 2009 [cited by applicant]
WO WO2020083845 · 2020 [cited by applicant]
WO WO2021183792 · 2021 [cited by applicant]
WO WO2021188648 · 2021 [cited by applicant]
WO WO2021211725 · 2021 [cited by applicant]
WO WO2021247521 · 2021 [cited by applicant]
WO WO2022061160 · 2022 [cited by applicant]
WO WO2022076539 · 2022 [cited by applicant]
WO WO2022109349 · 2022 [cited by applicant]
Cyriel Minkenberg, “Reimagining Datacenter Topologies With Integrated Silicon Photonics” Jun. 21, 2018, Optics Letters, vol. 39, No. 7,Apr. 1, 2014, pp. B126-B137. [cited by examiner]
Ashok V. Krishnamoorthy, “From Chip to Cloud: Optical Interconnects in Engineered Systems,”Jun. 19, 2017, Journal of Lightwave Technology, vol. 35, No. 15, Aug. 1, 2017, pp. 3101-3111. [cited by examiner]
John H Lau, “Redistribution-Layers for Fan-Out Wafer-Level Packaging and Heterogeneous Integrations,”Jul. 8, 2019,2019 China Semiconductor Technology International Conference (CSTIC), pp. 1-8. [cited by examiner]
Lars Brusberg, “On-board Optical Fiber and Embedded Waveguide Interconnects,”Nov. 29, 2018,2018 7th Electronic System—Integration Technology Conference (ESTC), pp. 1-8. [cited by examiner]
Marco Romagnoli, “High-bandwidth density optically interconnected terabit/s boards,”Jan. 30, 2018, Proceedings vol. 10560 , Metro and Data Center Optical Networks and Short-Reach Links; 105600E (2018) https://doi.org/10… [cited by examiner]
Martin Rostan, “EtherCAT enabled Advanced Control Architecture,”Aug. 19, 2010,2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC), pp. 39-41. [cited by examiner]
Paolo Grani, “Design and Evaluation of AWGR-based Photonic NoC Architectures for 2.5D Integrated High Performance Computing Systems,”May 8, 2017, 2017 IEEE International Symposium on High Performance Computer Architectu… [cited by examiner]
Christopher Cook, “A 36-Channel Parallel Optical Interconnect Module Based on Optoelectronics-on-VLSI Technology,”Feb. 12, 2003, IEEE Journal of Selected Topics in Quantum Electronics, vol. 9, No. 2, Mar./Apr. 2003, pp.… [cited by examiner]
Saeed Fathololoumi, “1.6 Tbps Silicon Photonics Integrated Circuit and 800 Gbps Photonic Engine for Switch Co-Packaging Demonstration,”Nov. 19, 2020, Journal of Lightwave Technology ( vol. 39, Issue: 4, Feb. 15, 2021), … [cited by examiner]
Fuad E. Doany, “Terabit/Sec VCSEL-Based 48-Channel Optical Module Based on Holey CMOS Transceiver IC,” Sep. 19, 2012, Journal of Lightwave Technology, vol. 31, No. 4, Feb. 15, 2013, pp. 672-678. [cited by examiner]
Schréder et al., “Demonstration of glass based photonic interposer for mid-board-optical engines and electrical-optical circuit board (EOCB) integration strategy,” Proc. SPIE, Optical Interconnects X VII, Feb. 22. 2018,… [cited by examiner]
[No Author Listed], “IEEE P802.3 Electrical I/O Specifications,” LAN/MAN Standards Committee of the IEEE Computer Society, May 13, 2022, 235 pages. [cited by applicant]
[No Author Listed], “QSFP-DD MSA QSFP-DD/QSFP-DD800/QSFP112 Hardware Specification for QSFP Double Density 8X and QSFP 4X Pluggable Transceivers,” Revision 6.2, Mar. 11, 2022, 169 pages. [cited by applicant]
[No Author Listed], “Support Tomorrow's Speeds Inside Today's Footprint; Molex Solutions for 112 Gbps Architecture,” Molex, 2019, 7 pages. [cited by applicant]
[No Author Listed], “QSFP-DD MSA QSFP-DD/QSFP-DD800/QSFP112 Hardware Specification for QSFP Double Density 8X and QSFP 4X Pluggable Transceivers,” QSFP-DD, Revision 6.01, May 28, 2021, 167 pages. [cited by applicant]
[No Author Listed], “Specification for OSFP OCTAL Small Form Factor Pluggable Module,” OSFP MSA, Rev 4.0, May 28, 2021, 109 pages. [cited by applicant]
Dogruoz et al., “Optimizing QSFP-DD Systems to Achieve at Least 25 Watt Thermal Port Performance, ” QSFP-DD, Jan. 2021, 30 pages. [cited by applicant]
Ieee802.org [online], “Broadened Consensus for a 200GEL Copper Cable Objective,” Aug. 26, 2021, retrieved Oct. 17, 2022, retrieved from URL<https://www.ieee802.org/3/B400G/public/21_08/kocsis_b400g_01a_210826.pdf>, 17 p… [cited by applicant]
Ieeee802.org [online], “Multi-200Gbps/lane Package Model Considerations,” Jul. 12, 2022, retrieved Oct. 17, 2022, retrieved from URL<https://www.ieee802.org/3/df/public/22_07/benartsi_3df_01a_2207.pdf>, 13 pages. [cited by applicant]
International Preliminary Report on Patentability Chapter II in International Appln. No. PCT/US2021/053745, mailed Jun. 14, 2023, 14 pages. [cited by applicant]
International Preliminary Report on Patentability in International Appln. No. PCT/US2021/060215, mailed Jun. 1, 2023, 41 pages. [cited by applicant]
International Search Report and Written Opinion in Internaitonal Appln. No. PCT/US2023/16573, mailed Aug. 11, 2023, 18 pages. [cited by applicant]
International Search Report and Written Opinion in International Appln. No. PCT/US2021/060215, dated Mar. 22, 2022, 46 pages. [cited by applicant]
International Search Report and Written Opinion in International Appln. No. PCT/US2022/033870, mailed Sep. 28, 2022, 15 pages. [cited by applicant]
International Search Report and Written Opinion in International Appln. No. PCT/US2022/071857, mailed Jun. 29, 2022, 25 pages. [cited by applicant]
International Search Report and Written Opinion in International Appln. No. PCT/US2023/20730, mailed Jul. 31, 2023, 10 pages. [cited by applicant]
Invitation to Pay Additional Fees in International Appln. No. PCT/US2021/060215, dated Jan. 26, 2022, 3 pages. [cited by applicant]
Invitation to Pay Additional Fees in International Appln. No. PCT/US2023/16573, mailed Jun. 6, 2023, 2 pages. [cited by applicant]
Kocsis et al., “OSFP MDI Proposal,” Amphenol, High Speed Interconnects, Mar. 6, 2016, 13 pages. [cited by applicant]
Lightcounting.com [online], “High Speed Cables, Embedded and Co-Packaged Optics,” Dec. 2022, retrieved on Jun. 8, 2023, retrieved from URL<www.lightcounting.com>, 100 pages. [cited by applicant]
Lusted et al. “Motions and Straw Polls,” IEEE P802.3df Task Force, Intel, Sep. 2022, 6 pages. [cited by applicant]
Samtec.com [online], “Flyover® QSFP Cable Systems, Cages, and Heat Sinks,” 2022, retrieved on Dec. 22, 2022, retrieved from URL<https://www.samtec.com/cables/high-speed/assemblies/qsfp-flyover>, 12 pages. [cited by applicant]
Samtec.com [online], “Novaray® I/O 112 Gbps PAM4 Panel Mount Cable System,” May 18, 2022, retrieved on Mar. 29, 2023, retrieved from URL<https://www.samtec.com/cables/high-speed/io-assemblies/novaray-io>, 12 pages. [cited by applicant]
Tracy, “Supporting Data to Demonstrate 100Gbps Capability of Proposed MDIs,” TW Connectivity, Sep. 13, 2018, 9 pages. [cited by applicant]
[No Author Listed], “Implementation Agreement for a 3.2Tb/s Co-Packaged (CPO) Module,” OIF-Co-Packaging-3.2T-Module-01.0, Mar. 29, 2023, 38 pages. [cited by applicant]
Alexoudi et al., “Optics in Computing: From Photonic Network-on-Chip to Chip-to-Chip Interconnects and Disintegrated Architectures,” Journal of Lightwave Technology, Jan. 15, 2019, 37(2):363-379. [cited by applicant]
Allaboutcircuits.com [online], “Innovative Interconnects: The Future of Chiplet-based Processors?” Apr. 18, 2022, retrieved on Oct. 26, 2023, retrieved from URL<https://www.allaboutcircuits.com/news/innovative-interconn… [cited by applicant]
Ase.aseglobal.com [online], “Fan-Out Packaging,”2022, retrieved on Jul. 8, 2022, retrieved from URL<https://ase.aseglobal.com/en/technology/fan_out>, 8 pages. [cited by applicant]
Awavesemi [online], “1G to 224G SerDes,” Jan. 28, 2023, retrieved on Oct. 24, 2023, retrieved from URL<http://web.archive.org/web/20230701000000*/https://awavesemi.com/silicon-ip/phy-ip/1g-224g-serdes/>, 4 pages. [cited by applicant]
Broadcom.com [online], “Broadcom's persistent cadence of co-packaged optics innovation,” Mar. 1, 2023, retrieved on Oct. 24, 2023, retrieved from URL<https://www.broadcom.com/blog/broadcoms-persistent-cadence-copackaged… [cited by applicant]
Cadence.com [online], “112Gbps XSR SerDes IP for TSMC 7nm FinFET,” 2022, retrieved on Oct. 24, 2023, retrieved from URL<https://www.cadence.com/content/dam/cadence-www/global/en_US/documents/tools/ip/design-ip/112g-xsr-… [cited by applicant]
Ethernetalliance.org [online], “CEI-28G: Paving the Way for 100 Gigabit,” Jun. 2010, retrieved on Sep. 26, 2023, retrieved from URL<https://www.ethernetalliance.org/wp-content/uploads/2011/10/document_files_CEI-28G_rev8… [cited by applicant]
Harrisburg.psu.edu [online], “112 Gbps Electrical Interfaces: Does rate drive architecture or does architecture enable rate?” Apr. 12, 2019, retrieved on Sep. 26, 2023, retrieved from URL<https://harrisburg.psu.edu/file… [cited by applicant]
I3electronics.com [online], “Advanced Semiconductor Packaging,” 2022, retrieved on Jul. 8, 2022, retrieved from URL<https://i3electronics.com/micro_semiconductor/>, 8 pages. [cited by applicant]
Imec-int.com [online], “A new approach to fan-out wafer-level packaging,” Jun. 6, 2019, retrieved on Jul. 8, 2022, retrieved from URL<https://www.imec-int.com/en/imec-magazine/imec-magazine-june-2019/a-new-approach-to-f… [cited by applicant]
Intel.com [online], “Accelerating Innovation Through a Standard Chiplet Interface: The Advanced Interface Bus (AIB),” Sep. 19, 2020, retrieved on Sep. 26, 2023, retrieved from URL<https://www.intel.com/content/dam/www/p… [cited by applicant]
Intel.com [online], “CEI 28 Very Short Reach (VSR) Specifications for CFP2/CFP4/QSFP+/QSFP28/zQSFP/SMA 2.4 mm,” available on or before Dec. 9, 2022, retrieved on Oct. 24, 2023, retrieved from URL<https://www.intel.com/c… [cited by applicant]
Cited By (10)
US 12,313,886 US 12,405,433 US 12,455,422 US 12,461,322 US 12,468,103 US 12,490,401 US 12,520,448 US 12,674,948 US 12,674,949 US 12,699,240