Granted Patent B2

US 12,531,475 · App. 18/175,133 · Granted Jan 20, 2026

Inventors: David Paul Buehler (Noblesville, IN); Kevin M. Gertiser (Carmel, IN); David W. Ihms (Kokomo, IN); Mark Wendell Gose (Kokomo, IN)

Assignee: BorgWarner US Technologies LLC

H05K7/20927H05K7/20254H05K7/209B60L3/003B60L15/007B60L15/08B60L15/20B60L50/40B60L50/51B60L50/60B60L50/64B60L53/20B60L53/22B60L53/62B60L2210/30B60L2210/40B60L2210/42B60L2210/44B60L2240/36B60R16/02G01R15/20G06F1/08G06F13/4004G06F2213/40H01L23/15H01L23/3672H01L23/3735H01L2023/405H01L2023/4087H01L23/473H01L23/5383H01L24/32H01L24/33H01L25/072H01L25/50H01L2224/32225H01L2224/32245H01L2224/33181H02J7/0063H02J2207/20H02M1/0009H02M1/08H02M1/084H02M1/088H02M1/123H02M1/32H02M1/322H02M1/327H02M1/4258H02M1/44H02M3/33523H02M7/003H02M7/537H02M7/5387H02M7/53871H02M7/53875H02M7/5395H02P27/06H02P27/08H02P27/085H02P29/024H02P29/027H02P29/68H02P2207/05H03K19/20H05K1/145H05K1/181H05K1/182H05K5/0247H05K7/2039H05K2201/042H05K2201/10166H10D64/018

Abstract

Claims (46)

1 . A power module, comprising:

a first substrate having an outer surface and an inner surface;

a semiconductor die coupled to the inner surface of the first substrate;

a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate;

a first group of electrically conductive spacers coupled to the inner surface of the first substrate and to the inner surface of the second substrate, and arranged along a first axis; and

a second group of electrically conductive spacers coupled to the inner surface of the first substrate and to the inner surface of the second substrate, and arranged along a second axis substantially perpendicular to the first axis.

2 . The power module of claim 1 , wherein the first substrate further includes a middle section between the inner surface and the outer surface, wherein the middle section includes a ceramic, and the outer surface and the inner surface of the first substrate includes a metal.

3 . The power module of claim 2 , wherein the ceramic includes silicon nitride.

4 . The power module of claim 1 , further including a first lead coupled to the inner surface of the second substrate.

5 . The power module of claim 1 , wherein the first group of electrically conductive spacers is coupled to a first part of the inner surface of the second substrate, and the semiconductor die is coupled to a second part of the inner surface of the second substrate, wherein the first part and the second part are not directly coupled to one another.

6 . The power module of claim 1 , wherein the first group of electrically conductive spacers and the second group of electrically conductive spacers are coplanar.

7 . The power module of claim 1 , wherein the second substrate further includes a middle layer between the inner surface and the outer surface, wherein the middle layer includes a ceramic, and the outer surface and the inner surface of the second substrate includes a metal.

8 . The power module of claim 1 , wherein the semiconductor die includes a drain, wherein the drain is coupled to the inner surface of the first substrate.

9 . The power module of claim 1 , wherein the semiconductor die includes a source, wherein the source is coupled to the inner surface of the second substrate.

10 . An inverter comprising the power module of claim 1 .

11 . A vehicle comprising the inverter of claim 10 .

12 . A system comprising:

an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes:

a power module for the inverter for an electric vehicle, the power module comprising:

a first substrate;

a second substrate;

a first group of electrically conductive spacers connecting the first substrate to the second substrate, the first group of electrically conductive spacers arranged along a first axis; and

a second group of electrically conductive spacers connecting the first substrate to the second substrate, and arranged along a second axis substantially perpendicular to the first axis.

13 . The system of claim 12 , further comprising:

the battery configured to supply the DC power to the inverter; and

the motor configured to receive the AC power from the inverter to drive the motor.

14 . A system comprising:

a power module for an inverter, the power module including:

a lower substrate including an upper conductive layer;

an upper substrate including a lower conductive layer; and

electrically conductive spacers between the lower substrate and the upper substrate, the electrically conductive spacers configured to maintain a distance between the lower substrate and the upper substrate and provide an electrically conductive path from the lower conductive layer to the upper conductive layer,

wherein a first group of the electrically conductive spacers are located on a first axis and a second group of the electrically conductive spacers are located on a second axis substantially perpendicular to the first axis.

15 . The system of claim 14 , wherein:

the lower conductive layer includes a first lower conductive region, a second lower conductive region, and a third lower conductive region, and

the upper conductive layer includes a first upper conductive region and a second upper conductive region.

16 . The system of claim 15 , wherein:

the electrically conductive spacers include a first electrically conductive spacer and a second electrically conductive spacer,

the first electrically conductive spacer connects the first lower conductive region to the first upper conductive region, and

the second electrically conductive spacer connects the second lower conductive region to the second upper conductive region.

17 . The system of claim 16 , wherein the power module further includes:

a first power switch configured to selectively electrically connect the first upper conductive region to the second lower conductive region, and

a second power switch configured to selectively electrically connect the third lower conductive region to the second upper conductive region.

18 . The system of claim 17 , wherein the power module further includes:

a first interconnect on the first lower conductive region,

a second interconnect on the third lower conductive region, and

a third interconnect on the third lower conductive region.

Assignments (2)

Continuity (5)

References Cited (307)