Data processing systems including optical communication modules
An apparatus includes: at least one of a circuit board or a substrate; and a first structure attached to the at least one of a circuit board or a substrate. The first structure is configured to enable an optical module with connector to be removably coupled to the first structure, and the optical module with connector is configured to enable an optical fiber connector to be removably coupled to the optical module with connector. For example, the circuit board or the substrate includes first electrical contacts, the first structure includes walls that define a first opening, the walls also define one or more retaining mechanisms such that when the optical module with connector is inserted into the first opening, the one or more retaining mechanisms on the walls of the first structure engage one or more latch mechanisms on the optical module with connector to secure the optical module with connector to the first structure, and second electrical contacts on the optical module with connector are electrically coupled to the first electrical contacts on the circuit board or the substrate.
1. A system comprising:
a housing having a front panel;
at least one of a circuit board or a substrate;
a data processor unit mounted on the circuit board or the substrate;
a first structure attached to a first side of the circuit board or the substrate; and
a second structure attached to a second side of the circuit board or the substrate;
wherein the first structure and the second structure each extend along a plane that is substantially parallel to a main surface of the front panel of the housing and in which the first structure and the second structure are mechanically connected through openings in the circuit board or substrate;
wherein the first side of the circuit board or the substrate comprises a two-dimensional arrangement of electrical contacts, the first structure is configured to be mechanically coupled to an optical module;
wherein the optical module comprises a two-dimensional arrangement of electrical contacts;
wherein the first structure comprises walls that define a first opening, the walls also define one or more retaining mechanisms such that when the optical module is inserted into the first opening, the one or more retaining mechanisms on the walls of the first structure engage one or more latch mechanisms on the optical module to secure the optical module to the first structure, and the electrical contacts on the optical module are electrically coupled to the electrical contacts on the circuit board or the substrate; and
wherein the optical module (i) is coupled to, (ii) extends partially through, or (iii) extends through a front panel of the housing.
2. The system of claim 1 wherein the data processor is mounted on the first side of the circuit board or substrate.
3. The system of claim 1 wherein the data processor is mounted on the second side of the circuit board or substrate.
4. The system of claim 1 wherein the second structure comprises a bolster plate.
5. The system of claim 4 wherein the bolster plate is attached to the second side of the circuit board or substrate.
6. The system of claim 5 wherein the circuit board or substrate is sandwiched between the first structure and the bolster plate.
7. The system of claim 6 wherein guide rails or a guide cage extend from the front panel or a front portion of the first structure to the bolster plate and provide a rigid connection between the first structure and the front panel.
8. The system of claim 7 , comprising a clamp mechanism that is configured to push the optical module towards the electrical contacts on the circuit board or the substrate, pull the bolster plate towards the second side of the circuit board or substrate and provide a counteracting force that pushes the electrical contacts on the circuit board or the substrate in the direction of the optical module.
9. The system of claim 8 wherein the clamp mechanism comprises screws.
10. The system of claim 1 , comprising a heat dissipating device attached to at least one of first structure or the second structure.
11. The system of claim 3 wherein the second structure defines a second opening that allows the data processor to protrude through the second opening of the second structure.
12. The system of claim 1 , comprising a second circuit board disposed between the circuit board or the substrate and the first structure, wherein the second circuit board defines a third opening that allows the optical module to pass through,
wherein the second circuit board comprises connectors configured to receive at least one of electrical power, control signals, or data signals that are forwarded to the data processor unit.
13. The system of claim 1 wherein the data processor unit comprises at least one of a network switch, a central processor unit, a graphics processor unit, a tensor processing unit, a neural network processor, an artificial intelligence accelerator, a digital signal processor, a microcontroller, a storage device, or an application specific integrated circuit (ASIC) that is configured to process electrical signals received from or transmitted to the optical module.
14. The system of claim 1 wherein the data processor unit comprises at least one of (i) a bare die processor that is mounted on the circuit board or the substrate, or (ii) a packaged processor that includes a package substrate that is mounted on the circuit board or the substrate.
15. The system of claim 1 , comprising at least one optical module, wherein the optical module comprises a mechanical connector structure configured to couple the optical module to the first structure to enable electrical signals to be transmitted between the optical module and the electrical contacts on the first side of the circuit board or the substrate;
wherein the mechanical connector structure comprises the one or more latch mechanisms that engage the one or more retaining mechanisms on the walls of the first structure to secure the optical module to the first structure, and wherein the one or more latch mechanisms and the one or more retaining mechanisms are configured to allow the optical module to be removed from the first structure by disengaging the one or more latch mechanisms from the one or more retaining mechanisms.
16. The system of claim 15 wherein the mechanical connector structure comprises a connector configured to receive the optical fiber connector to enable light signals from the optical fiber connector to be transmitted to the optical module.
17. The system of claim 16 , comprising the optical fiber connector, wherein the optical fiber connector is optically coupled to a fiber cable comprising a plurality of optical fibers, and the optical fiber connector is configured to transmit optical signals carried in the optical fibers to the optical module.
18. The system of claim 17 , comprising the optical module, wherein the optical module comprises a photonic integrated circuit comprising a two-dimensional array of optical coupling elements, and the optical fiber connector is configured to couple a two-dimensional array of optical fibers to the two-dimensional array of optical coupling elements on the photonic integrated circuit.
19. A system comprising:
a housing having a front panel;
at least one of a circuit board or a substrate;
a data processor unit mounted on the circuit board or the substrate;
a first structure attached to a first side of the circuit board or the substrate; and
a second structure attached to a second side of the circuit board or the substrate;
wherein the first structure and the second structure each extend along a plane that is substantially parallel to a main surface of the front panel of the housing and wherein the first structure and the second structure are mechanically connected through openings in the circuit board or substrate;
wherein the first side of the circuit board or the substrate comprises a two-dimensional arrangement of electrical contacts, the first structure is configured to be mechanically coupled to an optical module;
wherein the optical module comprises a two-dimensional arrangement of electrical contacts;
wherein the first structure comprises walls that define a first opening, the optical module is inserted into the first opening, and the electrical contacts on the optical module are electrically coupled to the electrical contacts on the circuit board or the substrate; and
wherein the optical module (i) is coupled to, (ii) extends partially through, or (iii) extends through a front panel of the housing.
20. An apparatus comprising:
an optical module configured to be coupled to a first structure that is attached to a circuit board or a substrate, wherein the optical module comprises a two-dimensional arrangement of at least 16 electrical contacts distributed in a two-dimensional surface area of the optical module, the optical module comprises a photonic integrated circuit, the optical module is configured to hold the photonic integrated circuit in place when the optical module is coupled to the first structure and to enable electronic signals from the photonic integrated circuit to be transmitted to at least one of the circuit board or the substrate through the two-dimensional arrangement of at least 16 electrical contacts;
wherein the optical module comprises a connector part configured to receive an optical fiber connector and enable the optical fiber connector to be coupled to the optical module wherein the optical module is configured to enable optical signals from the optical fiber connector to be transmitted to the photonic integrated circuit.