Solid-state imaging element and solid-state imaging apparatus
A first solid-state imaging element according to an embodiment of the present disclosure includes a bottom-electrode; a top-electrode opposed to the bottom-electrode; a photoelectric conversion layer provided between the bottom-electrode and the top-electrode and including a first organic semiconductor material; and—an upper inter-layer provided between the top-electrode and the photoelectric conversion layer, and including a second organic semiconductor material having a halogen atom in a molecule at a concentration in a range from 0 volume % or more to less than 0.05 volume %.
1. A light detecting element, comprising:
a first electrode;
a second electrode opposed to the first electrode; and
a photoelectric conversion layer provided between the first electrode and the second electrode,
wherein the photoelectric conversion layer includes an exciton generation layer including a first semiconductor material and a second semiconductor material, and an exciton disassociation layer including a third semiconductor material.
2. The light detecting element according to claim 1 , wherein the photoelectric conversion layer includes a first inter-layer including the second semiconductor material between the exciton generation layer and the exciton disassociation layer.
3. The light detecting element according to claim 2 , wherein the photoelectric conversion layer includes a second inter-layer including the second semiconductor material and the third semiconductor material between the first inter-layer and the exciton disassociation layer.
4. The light detecting element according to claim 1 , wherein the second semiconductor material and the third semiconductor material are semiconductor materials having mutually different polarities.
5. The light detecting element according to claim 1 , wherein a bandgap of the second semiconductor material is equal to a bandgap of the first semiconductor material or smaller than the bandgap of the first semiconductor material.
6. The light detecting element according to claim 1 , wherein the second semiconductor material and the third semiconductor material have a difference in energy level.
7. The light detecting element according to claim 1 , wherein the third semiconductor material forms an interface with the second semiconductor material and is not in direct contact with the first semiconductor material.
8. The light detecting element according to claim 1 , wherein the first semiconductor material, the second semiconductor material, and the third semiconductor material are organic materials.
9. The light detecting element according to claim 1 , wherein a lowest unoccupied molecular orbital (LUMO) level of the first semiconductor material is equal to a LUMO level of the second semiconductor material, or a highest occupied molecular orbit (HOMO) level of the first semiconductor material is equal to a HOMO level of the second semiconductor material.
10. A light detecting apparatus provided with a plurality of pixels each including one or a plurality of solid-state imaging elements, each of the solid-state imaging elements comprising:
a first electrode;
a second electrode opposed to the first electrode; and
a photoelectric conversion layer provided between the first electrode and the second electrode,
wherein the photoelectric conversion layer includes an exciton generation layer including a first semiconductor material and a second semiconductor material, and an exciton disassociation layer including a third semiconductor material.