Low-k feature formation processes and structures formed thereby
Embodiments of the present disclosure relate to a method of forming a low-k dielectric material, for example, a low-k gate spacer layer in a FinFET device. The low-k dielectric material may be formed using a precursor having a general chemical structure comprising at least one carbon atom bonded between two silicon atoms. A target k-value of the dielectric material may be achieved by controlling carbon concentration in the dielectric material.
1. A semiconductor device comprising:
a gate electrode over a semiconductor fin over a substrate; and
a spacer located adjacent to the gate electrode, wherein at least a portion of the spacer has a density of between 1 g/cm 3 and 3 g/cm 3 , a non-zero carbon concentration less than 30 at. % and a non-zero nitrogen concentration of less than 3 at. %.
2. The semiconductor device of claim 1 , wherein the spacer has a constant carbon concentration throughout the spacer.
3. The semiconductor device of claim 2 , wherein the spacer has a constant k-value throughout the spacer.
4. The semiconductor device of claim 3 , wherein the spacer has a constant density throughout the spacer.
5. The semiconductor device of claim 1 , wherein the spacer has a decreasing k-value as the spacer extends away from the gate electrode.
6. The semiconductor device of claim 5 , wherein the spacer has an increasing carbon concentration as the spacer extends away from the gate electrode.
7. The semiconductor device of claim 6 , wherein the spacer has a decreasing k-value as the spacer extends away from the gate electrode.
8. A semiconductor device comprising:
a dielectric material over a semiconductor fin over a substrate, the dielectric material having a density of between 1 g/cm 3 and 3 g/cm 3 , a non-zero carbon concentration less than 30 at. % and a non-zero nitrogen concentration of less than 3 at. %;
a gate dielectric adjacent to the dielectric material; and
a gate electrode adjacent to the gate dielectric.
9. The semiconductor device of claim 8 , wherein the dielectric material comprises:
a first region with a first carbon concentration in a range from o at. % to 5 at. %;
a second region with a second carbon concentration in a range from 5 at. % to 10 at. %; and
a third region with a third carbon concentration in a range 10 at. % to 20 at. %.
10. The semiconductor device of claim 9 , wherein the first region has a first density in a range from 2 g/cm 3 to 2.5 g/cm 3 , the second region has a second density in a range from 1.8 g/cm 3 to 2 g/cm 3 , and the third region has a third density in a range from 1.5 g/cm 3 to 1.8 g/cm 3 .
11. The semiconductor device of claim 10 , wherein the first region has a first k-value in a range from 3.9 to 5, the second region has a second k-value in a range from 3.7 to 3.9, and the third region has a third k-value in a range from 3.0 to 3.7.
12. The semiconductor device of claim 8 , wherein the dielectric material has a thickness in a range from 10 Å to 70 Å.
13. The semiconductor device of claim 12 , wherein the gate dielectric is located between the gate electrode and the dielectric material.
14. The semiconductor device of claim 8 , wherein the dielectric material has a constant carbon concentration, k-value, and density throughout the dielectric material.
15. A semiconductor device comprising:
a gate structure over a semiconductor fin;
a gate contact adjacent to the gate structure; and
at least one dielectric material located between the gate structure and the gate contact, the at least one dielectric material having a density of between 1 g/cm 3 and 3 g/cm 3 , a non-zero carbon concentration less than 30 at. % and a non-zero nitrogen concentration of less than 3 at. %.
16. The semiconductor device of claim 15 , wherein the gate structure is separated from the gate contact by a first distance and the at least one dielectric material has a first thickness that is between 30% and 40% of the first distance.
17. The semiconductor device of claim 16 , wherein the first thickness is between 10 Å and 70 Å.
18. The semiconductor device of claim 17 , wherein the first thickness is between 10 Å and 40 Å.
19. The semiconductor device of claim 15 , wherein the at least one dielectric material has a conformity greater than 95%.
20. The semiconductor device of claim 15 , wherein the at least one dielectric material comprises silicon oxycarbide.