Granted Patent B2

US 12,302,691 · App. 17/634,232 · Granted May 13, 2025

Inventors: Zhibin Wang (Toronto, CA); Yi-Lu Chang (Scarborough, CA); Qi Wang (North York, CA)

Assignee: OTI Lumionics Inc.

H10K50/824H10K59/122H10K71/621

Abstract

Claims (39)

1. An opto-electronic device having a plurality of layers, comprising:

a nucleation-inhibiting coating (NIC) disposed on a first layer surface in a first portion of a lateral aspect thereof, the first portion comprising a first electrode, a second electrode and a semiconducting layer between the first electrode and the second electrode, wherein the second electrode lies between the NIC and the semiconducting layer in the first portion;

a conductive coating disposed on a second layer surface in a second portion of the lateral aspect thereof;

wherein an initial sticking probability for forming the conductive coating onto a surface of the NIC in the first portion is substantially less than the initial sticking probability for forming the conductive coating onto the second layer surface in the second portion, such that the first portion is substantially devoid of a closed film of the conductive coating; and

wherein the conductive coating is electrically coupled to the second electrode and to a third electrode in a sheltered region of a partition in the opto-electronic device.

2. The opto-electronic device of claim 1 , wherein the first portion comprises at least one emissive region.

3. The opto-electronic device of claim 1 , wherein the second portion comprises at least a part of a non-emissive region.

4. The opto-electronic device of claim 1 , wherein the sheltered region is substantially devoid of the NIC.

5. The opto-electronic device of claim 1 , wherein the sheltered region comprises a recess defined by the partition.

6. The opto-electronic device of claim 5 , wherein the recess extends substantially laterally within the partition.

7. The opto-electronic device of claim 5 , wherein the recess has a ceiling, a side and a floor.

8. The opto-electronic device of claim 7 , wherein the third electrode is provided on at least one of the ceiling, the side, the floor and any combination of any of these.

9. The opto-electronic device of claim 7 , wherein at least one of the ceiling and the side are defined by the partition.

10. The opto-electronic device of claim 5 , wherein the conductive coating is disposed within the recess.

11. The opto-electronic device of claim 5 , wherein the partition comprises a lower section and an upper section.

12. The opto-electronic device of claim 11 , wherein the lower section is laterally recessed relative to the upper section to form the recess.

13. The opto-electronic device of claim 11 , wherein the lower section comprises the third electrode.

14. The opto-electronic device of claim 1 , wherein the third electrode is integrally formed within the partition.

15. The opto-electronic device of claim 1 , wherein the conductive coating is in physical contact with the third electrode.

16. The opto-electronic device of claim 1 , wherein the conductive coating is electrically coupled to the second electrode in a coupling region (CR).

17. The opto-electronic device of claim 16 , wherein the NIC is disposed between the conductive coating and the second electrode in the CR.

18. The opto-electronic device of claim 1 , wherein the sheltered region comprises an aperture defined by the partition.

19. The opto-electronic device of claim 18 , wherein the aperture opens into a recess defined by the partition.

20. The opto-electronic device of claim 18 , wherein the aperture is angled relative to an axis extending normally away from a surface of the device.

21. The opto-electronic device of claim 18 , wherein the aperture has an annular conic profile.

22. The opto-electronic device of claim 18 , wherein the aperture exposes a surface of the third electrode.

23. The opto-electronic device of claim 22 , wherein the third electrode is provided on a substrate of the device.

24. The opto-electronic device of claim 22 , wherein the third electrode is integrally formed within a substrate of the device.

25. The opto-electronic device of claim 22 , further comprising an undercut portion that overlaps a layer surface of the third electrode in a cross-sectional aspect.

26. The opto-electronic device of claim 1 , wherein the third electrode is an auxiliary electrode electrically coupled to a busbar.

27. The opto-electronic device of claim 1 , further comprising:

a further NIC disposed on a third layer surface of the opto-electronic device in a third portion of a lateral aspect thereof; and

a further conductive coating disposed on a fourth layer surface of the opto-electronic device in a fourth portion of the lateral aspect thereof.

28. The opto-electronic device of claim 27 , wherein the third portion comprises at least one emissive region.

29. The opto-electronic device of claim 28 , wherein the fourth portion comprises at least a part of a non-emissive region.

30. The opto-electronic device of claim 27 , wherein the fourth portion comprises at least one emissive region.

31. The opto-electronic device of claim 30 , wherein the third portion comprises at least a part of a non-emissive region.

32. The opto-electronic device of claim 31 , wherein the third portion is substantially light-transmissive therethrough.

33. The opto-electronic device of claim 27 , further comprising a fourth electrode, a fifth electrode and a further semiconducting layer between the fourth electrode and the fifth electrode, wherein the fifth electrode extends between the further NIC and the further semiconducting layer in the third portion.

Assignments (1)

Continuity (5)

References Cited (400)