Transistor structures with a metal oxide contact buffer and a method of fabricating the transistor structures
Transistor structures may include a metal oxide contact buffer between a portion of a channel material and source or drain contact metallization. The contact buffer may improve control of transistor channel length by limiting reaction between contact metallization and the channel material. The channel material may be of a first composition and the contact buffer may be of a second composition.
1. A transistor structure, comprising:
a substrate material;
a channel material over the substrate material, the channel material of a first composition comprising oxygen and one or more metals;
a gate electrode laterally adjacent to a sidewall of the channel material and over the substrate material;
a gate dielectric material between the gate electrode and the sidewall of the channel material; and
a contact buffer material between the channel material and a source contact metallization or a drain contact metallization that is between the channel material and the substrate material, wherein the contact buffer material is of a second composition comprising oxygen and one or more metals.
2. The transistor structure of claim 1 , wherein the contact buffer material comprises oxygen and at least one of In, Sn, Ir, Ti, Sb, Zn, or Al.
3. The transistor structure of claim 2 , wherein the channel material and the contact buffer material both comprise In, and the contact buffer material has a greater atomic % of In than the channel material.
4. The transistor structure of claim 1 , wherein the contact buffer material comprises at least one of In, Sn, Ir, or Ti.
5. The transistor structure of claim 4 , wherein the contact buffer material comprises two or more of In, Sn, Ir, Ti, Sb, Zn, or Al.
6. The transistor structure of claim 5 , wherein the contact buffer material comprises In and Sn.
7. The transistor structure of claim 1 , wherein a bottom one of the source contact metallization or the drain contact metallization is under a first layer of the contact buffer material, wherein a top one of the source contact metallization or the drain contact metallization is over a second layer of the contact buffer material that is over the channel material, and wherein the channel material spans a vertical distance between the first and second layers of the contact buffer material.
8. The transistor structure of claim 1 , wherein a first sidewall of the channel material is in contact with a first sidewall of the gate dielectric material, and a second sidewall of the gate dielectric material is in contact with gate electrode.
9. The transistor structure of claim 8 , further comprising a dielectric material in contact with a second sidewall of the channel material.
10. The transistor structure of claim 1 , wherein a first layer of the contact buffer material is in direct contact with a bottom surface of the channel material.
11. The transistor structure of claim 10 , wherein a second layer of the contact buffer material is in direct contact with a top surface of the channel material, and wherein the channel material is between the first and second layers of the contact buffer material.
12. An integrated circuit (IC) structure, comprising:
a plurality of complementary metal-oxide-semiconductor (CMOS) field effect transistor (FET) structures, wherein individual ones of the CMOS FET structures comprise a Group IV crystalline material; and
a plurality of back-end transistor structures over the CMOS FET structures, with one or more levels of interconnect metallization therebetween, wherein individual ones of the back-end transistor structures comprise:
a substrate material;
a channel material over the substrate material, the channel material of a first composition comprising oxygen and one or more metals;
a gate electrode coupled to a sidewall of the channel material;
a gate dielectric material between the gate electrode and the sidewall of the channel material; and
a contact buffer material between the channel material and a source contact metallization or a drain contact metallization that is between the channel material and the substrate material, wherein the contact buffer material is of a second composition comprising oxygen and one or more metals.
13. The IC structure of claim 12 , wherein the contact buffer material comprises at least one of In, Sn, Ir, or Ti.
14. The transistor structure of claim 13 , wherein the contact buffer material comprises two or more of In, Sn, Ir, Ti, Sb, Zn, or Al.
15. The IC structure of claim 12 , wherein a bottom one of the source contact metallization or the drain contact metallization is under a first layer of the contact buffer material, wherein a top one of the source contact metallization or the drain contact metallization is over a second layer of the contact buffer material that is over the channel material, and wherein the channel material spans a vertical distance between the first and second layers of the contact buffer material.
16. A method of fabricating a transistor structure, the method comprising:
forming a bottom one of a source or drain contact metallization;
forming a first layer of a contact buffer material over the bottom one of the source or drain contact metallization;
forming, over the first layer of a contact buffer material, a channel material of a first composition comprising oxygen and one or more metals;
forming a second layer of the contact buffer material over the channel material, wherein each of the first and second layers of the contact buffer material is of a second composition comprising oxygen and one or more metals;
forming a top one of a source or drain contact metallization over the second layer of the contact buffer material;
forming a gate dielectric adjacent to a sidewall of the channel material; and
forming a gate electrode adjacent to a sidewall of the gate dielectric.
17. The method of claim 16 , wherein forming the channel material comprises:
depositing a stack comprising dielectric material and gate electrode material;
etching a recess in the stack; and
depositing the channel material along a sidewall of the recess.
18. The method of claim 17 , wherein etching the recess comprises
exposing the first layer of the contact buffer material at a bottom of the recess.
19. The method of claim 16 , wherein forming each of the first and second layers of the contact buffer material comprises depositing a film comprising oxygen and least one of In, Sn, Ir, or Ti.
20. The method of claim 19 , wherein forming each of the first and second layers of the contact buffer material comprises depositing a film comprising oxygen and two or more of In, Sn, Ir, Ti, Sb, Zn, or Al.