IP Library › Granted Patent US 12,353,749
Granted Patent B2
US 12,353,749 · App. 18/359,704 · Granted Jul 8, 2025

Firmware scheme for 3 tier memories

Inventors: Manoj M. Shenoy (Bangalore, IN); Lakshmi Sowjanya Sunkavelli (Bangalore, IN); Gopu S (Bengaluru, IN); Binoy Jose Panakkal (Bengaluru, IN)
Assignee: Sandisk Technologies, Inc.
G06F3/0652G06F3/0608G06F3/064G06F3/0679
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Quick Facts
Patent No.
US 12,353,749
App. No.
18/359,704
Filed
Jul 26, 2023
Granted
Jul 8, 2025
Kind
B2
Art Unit
2137
USPC
711/154
Abstract

A three tier memory has an upper sub block, a lower sub block, and a middle sub block. In the present disclosure, rather than precharging the upper and lower sub blocks, use is made of the middle sub block using a firmware (FW) scheme. Upon receiving a write request from a host, the FW will route the data to the middle sub block (SB 1 ) through reverse order programming (ROP) so that the SB 1 is pre-charged through the source side through the lower sub block (SB 0 ). Once the SB 1 is written, data is then routed to the SB 0 and then to the upper sub block (SB 2 ). When there is a garbage collection (GC) request, the FW will move the data from the SB 2 and then erase the SB 2 . Then the data moves from the SB 0 and SB 0 is erased. Finally, the data moves from the SB 1 and then SB 1 is erased.

Claims (53)

1. A data storage device, comprising:

a memory device, wherein the memory device includes a block subdivided into an upper block, a middle block, and a lower block, wherein:

the lower block is located on a first tier of memory cell transistors of the block;

the middle block is located on a second tier of memory cell transistors of the block; and

the upper block is located on a third tier of memory cell transistors of the block, and wherein a first tier select gate transistor is arranged between the first and the second tiers of memory cell transistors and a second tier select gate transistor is arranged between the second and the third tiers of memory cell transistors; and

a controller coupled to the memory device, wherein the controller is configured to:

receive a command to write data to the block;

write data to the middle block;

write data to either the upper block or the lower block after writing data to the middle block; and

erase data from both the upper block and the lower block prior to erasing data from the middle block.

2. The data storage device of claim 1 , wherein the controller is configured to determine whether the command is a host write command.

3. The data storage device of claim 1 , wherein the controller is configured to erase the middle block and write data to the middle block.

4. The data storage device of claim 3 , wherein the controller is configured to erase the upper block and write data to the upper block.

5. The data storage device of claim 4 , wherein the controller is configured to erase the lower block and write data to the lower block.

6. The data storage device of claim 1 , wherein the controller is configured to determine whether garbage collection is needed.

7. The data storage device of claim 1 , wherein the controller is configured to relocate data from either the upper block or the lower block and then erase either the upper block or the lower block.

8. A data storage device, comprising:

a memory device, wherein the memory device includes a block subdivided into an upper block, a middle block, and a lower block, wherein:

the lower block is located on a first tier of memory cell transistors of the block;

the middle block is located on a second tier of memory cell transistors of the block; and

the upper block is located on a third tier of memory cell transistors of the block, and wherein a first tier select gate transistor is arranged between the first and the second tiers of memory cell transistors and a second tier select gate transistor is arranged between the second and the third tiers of memory cell transistors; and

a controller coupled to the memory device, wherein the controller is configured to:

receive a command to write data to the block;

write data to the middle block;

write data to either the upper block or the lower block after writing data to the middle block;

relocate data from either the upper block or the lower block and then erase either the upper block or the lower block; and

relocate data from the middle block and then erase the middle block, wherein relocating data from the middle block occurs after both the upper block and lower block have been relocated and erased.

9. The data storage device of claim 1 , wherein upon receiving the command to write data, the controller is configured to route data into the middle block through reverse order programming to pre-charge the middle block through a source side of a transistor through the lower block.

10. The data storage device of claim 9 , wherein the controller is configured to route data through the middle block to the upper block.

11. A data storage device, comprising:

a memory device, wherein the memory device includes a block subdivided into an upper block, a middle block, and a lower block, wherein:

the lower block is located on a first tier of memory cell transistors of the block;

the middle block is located on a second tier of memory cell transistors of the block; and

the upper block is located on a third tier of memory cell transistors of the block, and wherein a first tier select gate transistor is arranged between the first and the second tiers of memory cell transistors and a second tier select gate transistor is arranged between the second and the third tiers of memory cell transistors; and

a controller coupled to the memory device, wherein the controller is configured to:

receive a command to erase data from the block;

erase data from either the upper block or the lower block; and

erase data from the middle block after erasing data from either the upper block or the lower block.

12. The data storage device of claim 11 , wherein the erasing data from the middle block occurs after erasing data from both the upper block and the lower block.

13. The data storage device of claim 11 , further comprising at least one first select gate transistor disposed between the middle block and the upper block.

14. The data storage device of claim 13 , further comprising at least one second select gate transistor disposed between the middle block and the lower block.

15. The data storage device of claim 14 , wherein the middle block is coupled to a source electrode of the at least one first select gate transistor.

16. The data storage device of claim 15 , wherein the middle block is coupled to a drain electrode of the at least one second select gate transistor.

17. A data storage device, comprising:

means to store data, wherein the means to store data includes a block subdivided into an upper block, a middle block, and a lower block, wherein

the lower block is located on a first tier of memory cell transistors of the block;

the middle block is located on a second tier of memory cell transistors of the block; and

the upper block is located on a third tier of memory cell transistors of the block, and wherein a first tier select gate transistor is arranged between the first and the second tiers of memory cell transistors and a second tier select gate transistor is arranged between the second and the third tiers of memory cell transistors, and wherein the first and second select gate transistors comprise an N-channel Metal-Oxide-Semiconductor (NMOS) transistor; and

a controller coupled to the means to store data, wherein the controller is configured to:

write data to the middle block of the means to store data prior to writing data to either the upper block or the lower block of the means to store data; and

erase data from the upper block and the lower block prior to erasing data from the middle block.

18. The data storage device of claim 17 , wherein the controller is configured to erase data upon determining that a garbage collection operation is needed.

19. The data storage device of claim 17 , wherein prior to writing data to the middle block, data is erased from the middle block.

Assignments (8)
PARTIAL RELEASE OF SECURITY INTERESTS Recorded Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
SECURITY AGREEMENT Recorded Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
PATENT COLLATERAL AGREEMENT Recorded Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
CHANGE OF NAME Recorded Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
PATENT COLLATERAL AGREEMENT - DDTL Recorded Nov 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 065657/0158 →
PATENT COLLATERAL AGREEMENT- A&R Recorded Nov 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 065656/0649 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 13, 2023
From: SHENOY, MANOJ M.; SUNKAVELLI, LAKSHMI SOWJANYA; S, GOPU; PANAKKAL, BINOY JOSE
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 064893/0620 →
Continuity (2)
Provisional Application 63481274 · Jan 24, 2023
Related Publication 20240248631A1 · Jul 25, 2024
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