Granted Patent B2

US 12,400,902 · App. 18/494,756 · Granted Aug 26, 2025

Inventors: Michael John Janicki (Portland, OR); Brian Joseph Williams (Tigard, OR)

Assignee: Lam Research Corporation

H01L21/68721H01J37/32642H01J37/32715H01L21/68735H01L21/68785H01J2237/332

Abstract

Claims (29)

1. A carrier ring for supporting a substrate during semiconductor processing operations, the carrier ring comprising a ring structure having an inner diameter and an outer diameter, wherein:

the ring structure has a cross-sectional profile having at least a first portion, a second portion, a third portion, a fourth portion, a fifth portion, and a sixth portion;

the ring structure has a top surface that connects with the first portion;

the first portion connects with the second portion and extends along a direction perpendicular to the top surface;

the second portion connects with the third portion;

the third portion connects with the fourth portion and extends along a direction perpendicular to the top surface;

the fifth portion connects with the fourth portion and is parallel to the top surface;

the sixth portion connects with the fifth portion;

the first portion is located between parallel planes defined by the top surface and the second portion;

the third portion is located radially inward of the first portion;

at least part of the fourth portion is linear and at a first acute angle relative to the top surface; and

the sixth portion is at a second acute angle relative to the top surface.

2. The carrier ring of claim 1 , further comprising a seventh portion that connects with the sixth portion, wherein the seventh portion is parallel to the top surface.

3. The carrier ring of claim 2 , wherein the first acute angle is between 15° and 45°.

4. The carrier ring of claim 3 , wherein the first acute angle is 30°.

5. The carrier ring of claim 4 , further comprising a circular array of holes extending around the ring structure, each hole extending through the ring structure from the top surface.

6. The carrier ring of claim 5 , wherein:

each hole has a first end that exits the ring structure at the top surface and a second end opposite the first end, and

the second ends of the holes are positioned radially outward of the first ends of the holes.

7. The carrier ring of claim 6 , wherein the second ends of the holes exit the ring structure in the fifth portion.

8. The carrier ring of claim 6 , wherein each hole extends along an axis that is at an angle of between 30° and 90° relative to the top surface.

9. The carrier ring of claim 7 , wherein each hole extends along an axis that is at a 45° angle relative to the top surface.

10. The carrier ring of claim 2 , wherein the connection between the fourth portion and the fifth portion is rounded.

11. The carrier ring of claim 10 , wherein the connection between the fifth portion and the sixth portion is rounded.

12. The carrier ring of claim 11 , wherein the connection between the sixth portion and the seventh portion is rounded.

13. The carrier ring of claim 12 , wherein the connection between the third portion and the fourth portion is rounded.

14. The carrier ring of claim 13 , wherein the connection between the first portion and the second portion is rounded.

15. The carrier ring of claim 14 , wherein the connection between the first portion and the top surface is rounded.

16. The carrier ring of claim 15 , further comprising a plurality of protrusions protruding from the seventh portion.

Continuity (4)

References Cited (205)

Cited By (2)

US 12,531,210 US 12,567,566