Methods and systems for filling a gap
Disclosed are methods and systems for filling a gap. An exemplary method comprises providing a substrate to a reaction chamber. The substrate comprises the gap. The method further comprises at least partially filling the gap with a gap filling fluid. The methods and systems are useful, for example, in the field of integrated circuit manufacture.
1. A method of filling a gap, the method comprising
providing a substrate to a reaction chamber, the substrate comprising the gap;
exposing the substrate to a precursor and to a reactant, at least one of the precursor and the reactant comprising a metal or a metalloid, and at least one of the precursor and the reactant comprising a halogen;
thereby allowing the precursor and the reactant to form a gap filling fluid; and,
thereby at least partially filling the gap with a gap filling fluid, the gap filling fluid comprising the metal or the metalloid, and
exposing the substrate to a transformation treatment
wherein the transformation treatment comprises exposing the substrate to ultraviolet radiation.
2. The method according to claim 1 wherein the gap filling fluid comprises the metal or metalloid and the halogen.
3. The method according to claim 1 wherein the precursor and the reactant thermally form the gap filling fluid.
4. The method according to claim 1 wherein the metal or metalloid comprises an element selected from W, Ge, Sb, Te, Nb, Ta, V, Ti, Zr, Rh, Fe, Cr, Mo, Au, Pt, Ag, Ni, Cu, Co, Zn, Al, In, Sn, and Bi.
5. The method according to claim 1 wherein the precursor comprises an alkyl-substituted benzene ring.
6. The method according to claim 1 wherein the reactant comprises a bond selected from a X—X bond, a H—X bond, a C—X bond, a P—X bond, a N—X bond, and a S—X bond; wherein X is a halogen.
7. The method according to claim 6 wherein the reactant comprises an alkyl halide.
8. The method according to claim 1 wherein the precursor comprises bis(ethylbenzene) molybdenum, and wherein the reactant comprises 1,2-diiodoethane.
9. The method according to claim 1 wherein exposing the substrate to a precursor and to a reactant comprises one or more deposition cycles, a deposition cycle comprising a precursor pulse and a reactant pulse;
wherein the precursor pulse comprises exposing the substrate to the precursor; and,
wherein the reactant pulse comprises exposing the substrate to the reactant.
10. The method according to claim 9 wherein a deposition cycle further comprises a nitrogen reactant pulse, and wherein the nitrogen reactant pulse comprises exposing the substrate to the nitrogen reactant.
11. The method according to claim 10 wherein a deposition cycle comprises sequentially executing a plurality of subsequent precursor pulses and nitrogen reactant pulses before or after executing a reactant pulse.
12. The method according to claim 9 wherein, while precursor and the reactant are allowed to form a gap filling fluid, the precursor and the reactant simultaneously react to form a conformal liner in the gap.
13. The method according to claim 1 comprising a plurality of super cycles, a super cycle comprising a step of exposing the substrate to a precursor and to a reactant, and the step of exposing the substrate to a transformation treatment.
14. The method according to claim 1 wherein the transformation treatment comprises exposing the substrate to a plasma.
15. The method according to claim 1 wherein the transformation treatment comprises exposing the substrate to at least one of radicals and ions.
16. The method according to claim 1 wherein the transformation treatment comprises exposing the substrate to a thermal anneal, the thermal anneal comprising at least one of exposing the substrate to an oxidizing agent, a nitridation agent, a reducing agent, and an inert gas.
17. The method according to claim 1 wherein the gap comprises a distal end and a sidewall, and wherein the distal end and the sidewall comprise the same material.