IP Library Granted Patent US 12,588,440
Granted Patent B2
US 12,588,440 · App. 18/316,692 · Granted Mar 24, 2026

Substrate processing method and substrate processing apparatus for etching using oxidization

Inventors: Kazumasa Igarashi (Yamanashi, JP); Yamato Tonegawa (Yamanashi, JP); Jun Ogawa (Yamanashi, JP); Yuki Tanaka (Yamanashi, JP)
Assignee: Tokyo Electron Limited
H01L21/0214H01L21/02233H01L21/31116
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Quick Facts
Patent No.
US 12,588,440
App. No.
18/316,692
Granted
Mar 24, 2026
Kind
B2
Abstract

A substrate processing method includes preparing a substrate having a target film including silicon, carbon, and nitrogen on a surface of the substrate; supplying hydrogen gas and oxygen gas to the target film to oxidize a surface layer of the target film and form an oxide film; and etching the oxide film.

Claims (21)

1 . A substrate processing method comprising:

preparing a substrate having a target film including silicon, carbon, and nitrogen on a surface of the substrate;

supplying hydrogen gas and oxygen gas to the target film to oxidize a surface layer of the target film and form an oxide film; and

etching the oxide film,

wherein

the etching includes

supplying a gas including a fluorine-containing gas and a basic gas to the target film to convert at least a part of the target film into a reaction product; and

heating the substrate to sublimate the reaction product.

2 . The substrate processing method according to claim 1 , wherein

the fluorine-containing gas is a hydrogen fluoride gas; and

the basic gas is an ammonia gas.

3 . A substrate processing method comprising:

preparing a substrate having a target film including silicon, carbon, and nitrogen on a surface of the substrate;

supplying hydrogen gas and oxygen gas to the target film to oxidize a surface layer of the target film and form an oxide film; and

etching the oxide film,

wherein

the oxide film is formed and etched in a same processing container.

4 . The substrate processing method according to claim 3 , wherein the processing container houses a plurality of the substrates in a shape of a shelf.

5 . The substrate processing method according to claim 1 , wherein the target film further includes an element different from silicon, carbon, and nitrogen.

6 . The substrate processing method according to claim 5 , wherein the element is oxygen, boron, or a combination of oxygen and boron.

7 . The substrate processing method according to claim 1 , wherein the target film is a SiCN film.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 12, 2023
From: IGARASHI, KAZUMASA; TONEGAWA, YAMATO; OGAWA, JUN; TANAKA, YUKI
To: TOKYO ELECTRON LIMITED
Reel/Frame 063627/0983 →
Priority Claims (1)
JP 2022-091976 · Jun 7, 2022 · national
Continuity (1)
Related Publication 20230395368A1 · Dec 7, 2023
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