Semiconductor laminate, semiconductor device, and method for manufacturing semiconductor device
A semiconductor laminate at least including: a base; a buffer layer; and a crystalline metal oxide semiconductor film containing at least one metal element and having a corundum structure, the semiconductor laminate having the buffer layer on a main surface of the base directly or via another layer, the semiconductor laminate having the crystalline metal oxide semiconductor film on the buffer layer. The buffer layer is a laminate structure of a plurality of buffer films each with a different composition, and at least two buffer films of the plurality of buffer films have a film thickness of 200 nm or more and 650 nm or less.
1 . A semiconductor laminate at least comprising:
a base;
a buffer layer; and
a crystalline metal oxide semiconductor film containing at least one metal element and having a corundum structure, the semiconductor laminate having the buffer layer on a main surface of the base directly or via another layer, the semiconductor laminate having the crystalline metal oxide semiconductor film on the buffer layer, wherein
the buffer layer is a laminate structure of a plurality of buffer films each with a different composition, and
at least two buffer films of the plurality of buffer films have a film thickness of 200 nm or more and 650 nm or less, wherein
the buffer films contain a main metal element of the crystalline metal oxide semiconductor film that is the most abundant among metal elements contained in the crystalline metal oxide semiconductor film, and
the buffer layer is a laminate structure in which the plurality of buffer films are laminated such that a proportion of the main metal element of the crystalline metal oxide semiconductor film increases from the base side toward the crystalline metal oxide semiconductor film side of the buffer layer.
2 . The semiconductor laminate according to claim 1 , wherein the buffer films contain a main metal element of an underlayer of the buffer layer that is the most abundant among metal elements contained in the underlayer.
3 . The semiconductor laminate according to claim 2 , wherein the buffer layer is a laminate structure in which the plurality of buffer films are laminated such that a proportion of the main metal element of the underlayer of the buffer layer decreases from the base side toward the crystalline metal oxide semiconductor film side of the buffer layer.
4 . The semiconductor laminate according to claim 1 , wherein the underlayer of the buffer layer is the base, and the main metal element of the base is aluminum.
5 . The semiconductor laminate according to claim 1 , wherein the main metal element of the crystalline metal oxide semiconductor film is gallium.
6 . The semiconductor laminate according to claim 1 , wherein the crystalline metal oxide semiconductor film has a film thickness of 1 μm or more.
7 . The semiconductor laminate according to claim 1 , wherein the main surface of the base has an area of 10 cm 2 or more.
8 . A semiconductor device at least comprising the buffer layer and the crystalline metal oxide semiconductor film of the semiconductor laminate according to claim 1 .
9 . A semiconductor laminate at least comprising:
a base;
a buffer layer; and
a crystalline metal oxide semiconductor film containing at least one metal element and having a corundum structure, the semiconductor laminate having the buffer layer on a main surface of the base directly or via another layer, the semiconductor laminate having the crystalline metal oxide semiconductor film on the buffer layer, wherein
the buffer layer is a laminate structure of a plurality of buffer films each with a different composition, and
all of the plurality of buffer films have a film thickness of 200 nm or more and 650 nm or less, wherein
the buffer films contain a main metal element of the crystalline metal oxide semiconductor film that is the most abundant among metal elements contained in the crystalline metal oxide semiconductor film, and
the buffer layer is a laminate structure in which the plurality of buffer films are laminated such that a proportion of the main metal element of the crystalline metal oxide semiconductor film increases from the base side toward the crystalline metal oxide semiconductor film side of the buffer layer.
10 . The semiconductor laminate according to claim 9 , wherein the buffer films contain a main metal element of an underlayer of the buffer layer that is the most abundant among metal elements contained in the underlayer.
11 . The semiconductor laminate according to claim 10 , wherein the buffer layer is a laminate structure in which the plurality of buffer films are laminated such that a proportion of the main metal element of the underlayer of the buffer layer decreases from the base side toward the crystalline metal oxide semiconductor film side of the buffer layer.
12 . The semiconductor laminate according to claim 9 , wherein the underlayer of the buffer layer is the base, and the main metal element of the base is aluminum.
13 . The semiconductor laminate according to claim 9 , wherein the main metal element of the crystalline metal oxide semiconductor film is gallium.
14 . The semiconductor laminate according to claim 9 , wherein the crystalline metal oxide semiconductor film has a film thickness of 1 μm or more.
15 . The semiconductor laminate according to claim 9 , wherein the main surface of the base has an area of 10 cm 2 or more.
16 . A semiconductor device at least comprising the buffer layer and the crystalline metal oxide semiconductor film of the semiconductor laminate according to claim 9 .
17 . A method for manufacturing a semiconductor device at least including a crystalline metal oxide semiconductor film and an electrode, comprising:
a step of forming a plurality of buffer films, each with a different composition, as a buffer layer on a main surface of a base, the plurality of buffer films including two or more buffer films with a thickness of 200 nm or more and 650 nm or less, wherein
the buffer films contain a main metal element of the crystalline metal oxide semiconductor film that is the most abundant among metal elements contained in the crystalline metal oxide semiconductor film, and
the buffer layer is a laminate structure in which the plurality of buffer films are laminated such that a proportion of the main metal element of the crystalline metal oxide semiconductor film increases from the base side toward the crystalline metal oxide semiconductor film side of the buffer layer;
a step of forming a crystalline metal oxide semiconductor film with a corundum structure on the buffer layer; and
a step of forming an electrode at least on the crystalline metal oxide semiconductor film.
18 . A method for manufacturing a semiconductor device at least including a crystalline metal oxide semiconductor film and an electrode, comprising:
a step of forming a plurality of buffer films, each with a different composition and a thickness of 200 nm or more and 650 nm or less, as a buffer layer on a main surface of a base, wherein
the buffer films contain a main metal element of the crystalline metal oxide semiconductor film that is the most abundant among metal elements contained in the crystalline metal oxide semiconductor film, and
the buffer layer is a laminate structure in which the plurality of buffer films are laminated such that a proportion of the main metal element of the crystalline metal oxide semiconductor film increases from the base side toward the crystalline metal oxide semiconductor film side of the buffer layer;
a step of forming a crystalline metal oxide semiconductor film with a corundum structure on the buffer layer; and
a step of forming an electrode at least on the crystalline metal oxide semiconductor film.