Multilayer electronic component
A multilayer electronic component includes a body including a capacitance forming portion including a dielectric layer and an internal electrode, alternately arranged in a first direction, and a cover portion disposed on both surfaces of the capacitance forming portion opposing the first direction; and an external electrode disposed outside the body and connected to the internal electrode, wherein the cover portion includes a first dielectric material having a perovskite structure represented by the formula ABO 3 , and a first metal including one or more of Cu, W, Ag, and Zn, and wherein, in at least a portion of the cover portion, an amount of the first metal is 2.0 mole or more and 9.0 mole or less, based on 100 mole of an element of B.
1 . A multilayer electronic component comprising:
a body including a capacitance forming portion including a dielectric layer and an internal electrode, alternately arranged in a first direction, and a cover portion disposed on both surfaces of the capacitance forming portion opposing the first direction; and
an external electrode disposed on outer surface the body and connected to the internal electrode,
wherein the cover portion includes a first dielectric material having a perovskite structure represented by chemical formula ABO 3 , and a first metal including one or more of Cu, W, Ag, and Zn, and
wherein, in at least a portion of the cover portion, an amount of the first metal is more than 2.0 mole and 9.0 mole or less, based on 100 mole of an element of B.
2 . The multilayer electronic component of claim 1 , wherein the first metal comprises Cu.
3 . The multilayer electronic component of claim 2 , wherein, in the at least a portion of the cover portion, the amount of the first metal is 6.0 mole or less, based on 100 mole of the element of B.
4 . The multilayer electronic component of claim 1 , wherein the cover portion has a standard deviation of the amount of the first metal of 3.0 mole or less based on 100 mole of the element of B, in the first direction.
5 . The multilayer electronic component of claim 1 , wherein the first dielectric material comprises a plurality of dielectric grains and a grain boundary disposed between the plurality of dielectric grains adjacent to each other, and
at least a portion of the first metal is included in the plurality of dielectric grains.
6 . The multilayer electronic component of claim 1 , wherein the first dielectric material comprises a plurality of dielectric grains and a grain boundary disposed between the plurality of dielectric grains adjacent to each other, and
at least a portion of the first metal is present at the grain boundary.
7 . The multilayer electronic component of claim 1 , wherein the dielectric layer comprises the first dielectric material,
an element of A comprises Ca, and
the element of B comprises Zr.
8 . The multilayer electronic component of claim 7 , wherein the dielectric layer comprises a first minor component including Mn, and
in at least a portion of the dielectric layer, an amount of the first minor component is 0.1 mole or more and 2.0 mole or less, based on 100 mole of the element of B.
9 . The multilayer electronic component of claim 7 , wherein the dielectric layer comprises a second minor component including Y, and
in at least a portion of the dielectric layer, an amount of the second minor component is 0.1 mole or more and 2.0 mole or less based on 100 mole of an the element of B.
10 . The multilayer electronic component of claim 7 , wherein the dielectric layer comprises a third minor component including Si, and
wherein, in at least a portion of the dielectric layer, an amount of the third minor component is 0.1 mole or more and 2.0 mole or less, based on 100 mole of the element of B.
11 . The multilayer electronic component of claim 1 , wherein the first dielectric material comprises (Ca 1-x Sr x )(Zr 1-y Ti y )O 3 , where x is 0≤x<0.5, and y is 0≤y≤0.5.
12 . The multilayer electronic component of claim 1 , wherein the dielectric layer does not comprise the first metal.
13 . The multilayer electronic component of claim 1 , wherein the dielectric layer comprises the first metal, and
wherein a concentration of the first metal in the dielectric layer is lower than a concentration of the first metal in the cover portion.
14 . The multilayer electronic component of claim 1 , wherein the body has first and second surfaces opposing in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing in a third direction;
the external electrode is disposed on the third and fourth surfaces; and
a maximum size of the multilayer electronic component in the second direction is 3.2 mm or more, and a maximum size of the multilayer electronic component in the third direction is 1.6 mm or more.