IP Library Granted Patent US 7,287,537
Granted Patent B2
US 7,287,537 · App. 10/059,682 · Granted Oct 30, 2007

Megasonic probe energy director

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Quick Facts
Patent No.
US 7,287,537
App. No.
10/059,682
Granted
Oct 30, 2007
Kind
B2
Abstract

A megasonic cleaning apparatus configured to provide effective cleaning of a substrate without causing damage to the substrate is provided. The apparatus includes a megasonic probe, a transducer configured to energize the probe, and a heat transfer element disposed between the transducer and the probe. The heat transfer element may be configured to direct the sonic energy from the transducer toward specific areas of the probe so as to reduce the effect of normal-incident waves relative to shallow-angle waves. Alternatively, a rear end face of the probe may be configured for this purpose. Another embodiment provides a coupler disposed between the heat transfer element and the rear end face of the probe for directing the sonic energy from the transducer toward specific areas of the probe.

Claims (19)

1. An assembly for cleaning a thin, flat substrate comprising:

a transmitter to be positioned above a substantially flat surface of the substrate so that when liquid is applied to a gap between the transmitter and the substrate, a meniscus of liquid is formed between the transmitter and the substrate;

a transducer coupled to the transmitter in a manner to create a transmission path for transmitting megasonic vibration from the transducer through the transmitter to the substrate; and

a heat transfer element positioned between the transducer and the transmiter and forming a portion of said transmission path, said heat transfer element having a barrier gap in the transmission path between the transducer and an end face of the transmitter.

2. The assembly of claim 1 wherein the gap in the transmission path is aligned with a lowermost portion or the transmitter to attenuate the megasonic energy transmitted to the lowermost portion.

3. The assembly of claim 2 , wherein said lowermost portion has an elongated configuration forming an edge uniformly spaced from the substrate.

4. The assembly of claim 1 , further including a support for the substrate; and a source of liquid to be applied to the gap between the substrate and the transmitter.

5. The assembly of claim 4 , wherein said source of liquid includes a dispenser for dispensing liquid into said gap.

6. The assembly of claim 1 , wherein said transmitter comprises an elongated rod.

7. A megasonic probe assembly for cleaning a thin flat substrate comprising: a probe including an elongated rod with a lower edge along the length of the rod to be positioned above but closely adjacent to a flat surface of the substrate; a transducer for translating electrical energy into megasonic vibration; a heat transfer element positioned between the transducer and a rear end face of the probe; and a coupler positioned between the heat transfer element and the rear end face of the probe, the coupler transmitting the megasonic vibration to the rear end of the probe, the coupler being configured to attenuate the energy transmitted to a portion of said probe, wherein the coupler is generally disk-shaped, but has a portion aligned with the probe lower edge that is configured to minimize the transmission of megasonic energy to the lower edge.

8. A megasonic probe assembly for cleaning a thin fiat substrate composing: a probe including an elongated rod with a lower edge along the length of the rod to be positioned above but closely adjacent to a flat surface of the substrate; a transducer for translating electrical energy into megasonic vibration; a heat transfer element positioned between the transducer and a rear end face of the probe; and a coupler positioned between the heat transfer element and the rear end face of the probe, the coupler transmitting the megasonic vibration to the rear end of the probe, the coupler being configured to attenuate the energy transmitted to a portion of said probe, wherein a portion of the end face of the probe is spaced from the heat transfer element and the spaced portion is aligned with the probe lower edge so that the transmission of megasonic energy to the probe lower edge is minimized.

9. The assembly of claim 8 , wherein the coupler is configured to produce a pattern of megasonic energy transmission from the probe other than a radial pattern.

10. The assembly of claim 8 , wherein the coupler is generally elliptical, and the coupler is configured to produce a pattern of megasonic energy transmission from the probe other than a radial pattern.

11. An assembly for cleaning a thin flat substrate comprising: a transmitter including an elongated element with a lower edge to be positioned above but closely adjacent to a flat surface of the substrate; a transducer for translating electrical energy into megasonic vibration; and a heat transfer element positioned between the transducer and the transmitter to transmit vibration to the transmitter; wherein the heat transfer element is configured to attenuate the energy transmitted to a portion of the probe, wherein a gap in the heat transfer element is aligned with a lowermost portion of the transmitter to attenuate the megasonic energy transmitted to the lowermost portion.

12. The assembly of claim 11 wherein the gap is in the transmission path between the transducer and an end face of the transmitter.

13. The assembly of claim 11 wherein said lowermost portion has an elongated configuration forming an edge uniformly spaced from the substrate.

14. The assembly of claim 11 further including a support for the substrate; and a source of liquid to be applied to the gap between the substrate and the transmitter.

15. The assembly of claim 14 wherein said source of liquid includes a dispenser for dispensing liquid into said gap.

16. The assembly of claim 11 wherein said transmitter comprises an elongated rod.

Assignments (24)
CHANGE OF NAME Recorded May 26, 2022
From: NAURA AKRION INC.
To: AKRION TECHNOLOGIES INC.
Reel/Frame 060201/0991 →
TERMINATION AND RELEASE OF TRADEMARK AND PATENT SECURITY AGREEMENT RECORDED AT REEL 21744/FRAME 0209 AND REEL 21731/FRAME 0608 Recorded Jan 19, 2018
From: PNC BANK, NATIONAL ASSOCIATION
To: WAFER HOLDINGS, INC.
Reel/Frame 045097/0070 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 19, 2018
From: AKRION SYSTEMS LLC
To: NAURA AKRION INC.
Reel/Frame 045097/0140 →
TERMINATION AND RELEASE OF TRADEMARK AND PATENT SECURITY AGREEMENT RECORDED AT REEL 23220/FRAME 0423 Recorded Jan 19, 2018
From: BHC INTERIM FUNDING II, L.P.
To: AKRION SYSTEMS LLC
Reel/Frame 045102/0189 →
TERMINATION AND RELEASE OF TRADEMARK AND PATENT SECURITY AGREEMENT RECORDED AT REEL 22973/FRAME 0811 Recorded Jan 19, 2018
From: PNC BANK, NATIONAL ASSOCIATION
To: AKRION SYSTEMS LLC
Reel/Frame 045102/0288 →
TERMINATION AND RELEASE OF TRADEMARK AND PATENT SECURITY AGREEMENT RECORDED AT REEL 021731/FRAME 0718 Recorded Jan 19, 2018
From: BHC INTERIM FUNDING II, L.P.
To: WAFER HOLDINGS, INC.
Reel/Frame 045103/0624 →
SECURITY AGREEMENT Recorded Sep 14, 2009
From: AKRION SYSTEMS LLC
To: BHC INTERIM FUNDING II, L.P.
Reel/Frame 023220/0423 →
SECURITY AGREEMENT Recorded Jul 20, 2009
From: AKRION SYSTEMS, LLC
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 022973/0811 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 17, 2009
From: WAFER HOLDINGS, INC.; AKRION TECHNOLOGIES, INC.
To: AKRION SYSTEMS LLC
Reel/Frame 022824/0970 →
SECURITY AGREEMENT Recorded Oct 27, 2008
From: WAFER HOLDINGS, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 021744/0209 →
SECURITY AGREEMENT Recorded Oct 27, 2008
From: WAFER HOLDINGS, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 021731/0608 →
SECURITY AGREEMENT Recorded Oct 27, 2008
From: WAFER HOLDINGS, INC.
To: BHC INTERIM FUNDING II, L.P.
Reel/Frame 021731/0718 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 10, 2008
From: PNC BANK, NATIONAL ASSOCIATION; BHC INTERIM FUNDING II, L.P.; AKRION, INC.; GOLDFINGER TECHNOLOGIES, LLC; AKRION TECHNOLOGIES, INC.; SCP SERVICES, INC. (F/K/A AKRION SCP ACQUISITION CORP.)
To: WAFER HOLDINGS, INC.
Reel/Frame 021658/0928 →
SECURITY AGREEMENT Recorded Sep 1, 2008
From: AKRION TECHNOLOGIES, INC.
To: SUNRISE CAPITAL PARTNERS, L.P.
Reel/Frame 021462/0283 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Aug 24, 2006
From: ORIX VENTURE FINANCE LLC
To: GOLDFINGER TECHNOLOGIES, LLC; AKRION INC.
Reel/Frame 018160/0627 →
SECURITY AGREEMENT Recorded Aug 24, 2006
From: AKRION TECHNOLOGIES, INC.
To: BHC INTERIM FUNDING II, L.P.
Reel/Frame 018160/0597 →
SECURITY AGREEMENT Recorded Jul 19, 2006
From: AKRION TECHNOLOGIES, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 017961/0645 →
AMENDMENT TO PREVIOUSLY RECORDED ASSIGNMENT FROM GOLDFINGER TECHNOLOGIES, LLC TO AKRION TECHNOLOGIES, LLC: CORRECTION OF CONVEYING PARTY NAME FROM GOLDFINGER, LLC TO GOLDFINGER TECHNOLOGIES, LLC WITHIN DOCUMENT ITSELF Recorded Jun 26, 2006
From: GOLDFINGER TECHNOLOGIES, LLC
To: AKRION TECHNOLOGIES, INC.
Reel/Frame 017833/0798 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 26, 2006
From: GOLDFINGER TECHNOLOGIES, LLC
To: AKRION TECHNOLOGIES, INC.
Reel/Frame 017072/0495 →
NUNC PRO TUNC ASSIGNMENT Recorded Jan 5, 2006
From: VERTEQ, INC.
To: DEVELOPMENT SPECIALISTS, INC.
Reel/Frame 016975/0491 →
SECURITY AGREEMENT Recorded May 21, 2004
From: GOLDFINGER TECHNOLOGIES LLC
To: ORIX VENTURE FINANCE LLC
Reel/Frame 015334/0872 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 13, 2004
From: DEVELOPMENT SPECIALISTS, INC.
To: GOLDFINGER TECHNOLOGES, LLC
Reel/Frame 015215/0698 →
SECURITY INTEREST Recorded Feb 6, 2004
From: WELLS FARGO FOOTHILL, INC.
To: WESTAR CAPITAL II, LLC
Reel/Frame 014953/0457 →
SECURITY INTEREST Recorded Sep 22, 2003
From: VERTEQ, INC.
To: WELLS FARGO FOOTHILL, INC.
Reel/Frame 014515/0041 →