IP Library › Granted Patent US 6,798,035
Granted Patent Utility
US 6,798,035 · Confirmation No. 7554

BONDING PAD FOR LOW K DIELECTRIC

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2022-04-15 OATH Oath or Declaration filed 236 View
2022-04-15 OATH Oath or Declaration filed 222 View
2004-07-02 IFEE Issue Fee Payment (PTO-85B) 3 View
2004-06-17 NOA Notice of Allowance and Fees Due (PTOL-85) 3 View
2004-06-17 NOA Notice of Allowance and Fees Due (PTOL-85) 3 View
2004-06-17 892 List of references cited by examiner 1 View
2004-06-17 IIFW Issue Information including classification, examiner, name, claim, renumbering, etc. 1 View
2004-06-17 FWCLM Index of Claims 1 View
2004-06-17 SRFW Search information including classification, databases and other search related notes 1 View
2004-06-10 SRNT Examiner's search strategy and results 1 View
2003-06-20 TRNA Transmittal of New Application 1 View
2003-06-20 SPEC Specification 11 View
2003-06-20 CLM Claims 4 View
2003-06-20 ABST Abstract 1 View
2003-06-20 DRW Drawings-only black and white line drawings 2 View
2003-06-20 OATH Oath or Declaration filed 4 View
2003-06-20 WFEE Fee Worksheet (SB06) 1 View
2003-06-20 WFEE Fee Worksheet (SB06) 1 View
2003-06-20 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
Patent No.
US 6,798,035
App. No.
10/600,255
Filed
2003-06-20
Granted
2004-09-28
Art Unit
2811
PTA
0 days