Patent Assignment
Reel/Frame 013678/0203
Assignment of Assignor's Interest
Recorded: 2003-01-21
Pages: 8
Assignor
ANAM SEMICONDUCTOR, INC.
Executed: 2000-05-02
Assignee
AMKOR TECHNOLOGY KOREA, INC.
280-8, 2-GA, SUNGSU-DONG, SUNGDONG-GU, SEOUL, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Molding Ball Grid Array Semiconductor Packages
Patent:
6,214,645 →
Application:
09/240,423 →
Related Assignments
(11)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 29, 1999
From: KIM, SUNG JIN
To: ANAM SEMICONDUCTOR INC.; AMKOR TECHNOLOGY, INC.
Reel/Frame 009743/0073 →
Security Interest
Nov 15, 2000
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: SOCIETE GENERALE
Reel/Frame 011491/0917 →
Security Interest
Apr 16, 2001
From: SOCIETE GENERALE; GUARDIAN ASSETS, INC.
To: CITICORP USA, INC.
Reel/Frame 011682/0416 →
Security Interest
Apr 23, 2003
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: CITICORP USA, INC. AS "COLLATERAL AGENT"
Reel/Frame 013974/0893 →
Security Agreement
Jul 6, 2004
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: CITICORP NORTH AMERICA, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 014885/0691 →
Release of Lien on Patents
Jul 16, 2004
From: CITICORP USA, INC. AS COLLATERAL AGENT
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 015603/0572 →
Security Agreement
Nov 2, 2004
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: CITICORP NORTH AMERICA, INC. AS "AGENT"
Reel/Frame 015942/0521 →
Termination & Release of Patent Security Agreement
Jan 3, 2006
From: CITICORP NORTH AMERICA, INC.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 017388/0868 →
Security Agreement
Jan 3, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017379/0630 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054036/0599 →