Patent Assignment
Reel/Frame 021023/0170
Assignment of Assignor's Interest
Recorded: 2008-05-30
Pages: 6
Assignors
DEOPURA, MANISH
Executed: 2004-10-04
VAIDYA, HEM M.
Executed: 2004-10-07
ROY, PRADIP K.
Executed: 2004-10-07
Assignee
NEOPAD TECHNOLOGIES CORPORATION
7425 NW EVERGREEN PARKWAY, SUITE 150, HILLSBORO, OREGON, 97124
Covered Property
(1)
Methods for Producing in-Situ Grooves in Chemical Mechanical Planarization (Cmp) Pads, and Novel Cmp Pad Designs
Related Assignments
(9)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jul 23, 2008
From: NEOPAD TECHNOLOGIES CORPORATION
To: NEXPLANAR CORPORATION
Reel/Frame 021283/0520 →
Assignment of Assignor's Interest
Jul 19, 2017
From: NEXPLANAR CORPORATION
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 043046/0377 →
Security Agreement
Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
Change of Name
Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
Release of Security Interest
Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
Reel/Frame 060592/0260 →
Security Interest
Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
Security Interest
Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
Change of Name
Nov 8, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065517/0783 →
Change of Name
Nov 22, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065663/0466 →