IP Library Granted Patent US 8,287,793
Granted Patent B2
US 8,287,793 · App. 11/998,212 · Granted Oct 16, 2012

Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs

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Quick Facts
Patent No.
US 8,287,793
App. No.
11/998,212
Granted
Oct 16, 2012
Kind
B2
Abstract

Methods for producing in-situ grooves in CMP pads are provided. In general, the methods for producing in-situ grooves comprise the steps of patterning a silicone lining, placing the silicone lining in, or on, a mold, adding CMP pad material to the silicone lining, and allowing the CMP pad to solidify. CMP pads comprising novel groove designs are also described. For example, described here are CMP pads comprising concentric circular grooves and axially curved grooves, reverse logarithmic grooves, overlapping circular grooves, lassajous grooves, double spiral grooves, and multiple overlapping axially curved grooves. The CMP pads may be made from polyurethane, and the grooves produced therein may be made by a method from the group consisting of silicone lining, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.

Claims (13)

1. A method for producing a CMP pad having in-situ grooves, the method comprising:

adding CMP pad material to a patterned mold having ridges corresponding to grooves to be formed in the CMP pad, wherein said grooves are concentric circular grooves in a first region of the pad and in a second region of the pad adjacent to the first region and radiating grooves which radiate only linearly in the first region of the pad and are only curved in the second region of the pad, wherein the radiating grooves cross the concentric circular grooves, wherein the first region is closer than the second region to a central axis of the pad, and wherein the radiating grooves comprise pairs of overlapping radiating grooves, each radiating groove overlapping only one other radiating groove; and

allowing the CMP pad material to solidify and form the CMP pad.

2. The method of claim 1 , wherein the patterned mold comprises a silicone lining having ridges, and the silicone lining is made from a silicone elastomer.

3. The method of claim 2 further comprising the step of adhering the silicon lining to the mold.

4. The method of claim 3 , wherein the step of adhering the silicone lining to the mold is selected from the group consisting of gluing, taping, clamping and pressure fitting the silicone lining to the mold.

5. The method of claim 1 , wherein the mold is metallic.

6. The method of claim 5 , wherein the mold is made from a material selected from the group consisting of aluminum, steel, ultramold material, and mixtures thereof.

7. The method of claim 1 , wherein the CMP material is a thermoplastic material.

8. The method of claim 1 , wherein the CMP material is a thermoset material.

9. The method of claim 1 , wherein the CMP material is polyurethane.

10. The method of claim 1 , further comprising the step of patterning the mold.

11. The method of claim 1 wherein the radiating grooves are continuous.

Assignments (10)
CHANGE OF NAME Recorded Nov 22, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065663/0466 →
CHANGE OF NAME Recorded Nov 8, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065517/0783 →
SECURITY INTEREST Recorded Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
SECURITY INTEREST Recorded Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
RELEASE OF SECURITY INTEREST Recorded Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; KMG-BERNUTH, INC.; MPOWER SPECIALTY CHEMICALS LLC; SEALWELD (USA), INC.; INTERNATIONAL TEST SOLUTIONS, LLC; CMC MATERIALS, INC.
Reel/Frame 060592/0260 →
CHANGE OF NAME Recorded Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
SECURITY AGREEMENT Recorded Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; MPOWER SPECIALTY CHEMICALS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 19, 2017
From: NEXPLANAR CORPORATION
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 043046/0377 →
CHANGE OF NAME Recorded Jul 23, 2008
From: NEOPAD TECHNOLOGIES CORPORATION
To: NEXPLANAR CORPORATION
Reel/Frame 021283/0520 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 30, 2008
From: DEOPURA, MANISH; VAIDYA, HEM M.; ROY, PRADIP K.
To: NEOPAD TECHNOLOGIES CORPORATION
Reel/Frame 021023/0170 →