Patent Assignment
Reel/Frame 021283/0520
Change of Name
Recorded: 2008-07-23
Pages: 4
Assignor
NEOPAD TECHNOLOGIES CORPORATION
Executed: 2008-07-09
Assignee
NEXPLANAR CORPORATION
7425 NW EVERGREEN PARKWAY, SUITE 150, HILLSBORO, OREGON, 97124
Covered Properties
(8)
Customized Polish Pads for Chemical Mechanical Planarization
Methods for Producing in-Situ Grooves in Chemical Mechanical Planarization (Cmp) Pads, and Novel Cmp Pad Designs
Customized Polishing Pads for Cmp and Methods of Fabrication and Use Thereof
Customized Polishing Pads for CMP and Methods of Fabrication and Use Thereof
Customized Polish Pads for Chemical Mechanical Planarization
Methods for Producing in-Situ Grooves in Chemical Mechanical Planarization (Cmp) Pads, and Novel Cmp Pad Designs
Customized polishing pads for CMP and methods of fabrication and use thereof
Chemical Mechanical Planarization (Cmp) Pads Comprising Novel Groove Configurations
Application:
61/036,897 →
Related Assignments
(19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 17, 2004
From: MISRA, SUDHANSHU; ROY, PRADIP K.
To: NEOPAD TECHNOLOGIES CORPORATION
Reel/Frame 015148/0245 →
Assignment of Assignor's Interest
Oct 13, 2004
From: DEOPURA, MANISH; VAIDYA, HEM M.; ROY, PRADIP K.
To: NEOPAD TECHNOLOGIES CORPORATION
Reel/Frame 015244/0743 →
Assignment of Assignor's Interest
Apr 19, 2006
From: ROY, PRADIP K.; DEOPURA, MANISH; MISRA, SUDHANSHU
To: NEOPAD TECHNOLOGIES CORPORATION
Reel/Frame 017497/0770 →
Assignment of Assignor's Interest
May 28, 2008
From: MISRA, SUDHANSHU; ROY, PRADIP K.
To: NEOPAD TECHNOLOGIES CORPORATION
Reel/Frame 021008/0968 →
Assignment of Assignor's Interest
May 30, 2008
From: ROY, PRADIP K.; DEOPURA, MANISH; MISRA, SUDHANSHU
To: NEOPAD TECHNOLOGIES CORPORATION
Reel/Frame 021021/0617 →
Assignment of Assignor's Interest
May 30, 2008
From: ROY, PRADIP K.; DEOPURA, MANISH; MISRA, SUDHANSHU
To: NEOPAD TECHNOLOGIES CORPORATION
Reel/Frame 021021/0777 →
Assignment of Assignor's Interest
May 30, 2008
From: DEOPURA, MANISH; VAIDYA, HEM M.; ROY, PRADIP K.
To: NEOPAD TECHNOLOGIES CORPORATION
Reel/Frame 021023/0170 →
Assignment of Assignor's Interest
Jul 2, 2008
From: KERPRICH, ROBERT; MISRA, SUDHANSHU; HOLLAND, KAREY; SCOTT, DIANE
To: NEOPAD TECHNOLOGIES CORPORATION
Reel/Frame 021189/0842 →
Change of Name
Jul 24, 2008
From: NEOPAD TECHNOLOGIES CORPORATION
To: NEXPLANAR CORPORATION
Reel/Frame 021291/0072 →
Intellectual Property Security Joinder Agreement
Dec 31, 2015
From: NEXPLANAR CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037407/0071 →
Assignment of Assignor's Interest
Jul 19, 2017
From: NEXPLANAR CORPORATION
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 043046/0377 →
Release of Security Interest
Nov 16, 2018
From: BANK OF AMERICA, N.A.
To: CABOT MICROELECTRONICS CORPORATION; NEXPLANAR CORPORATION
Reel/Frame 047586/0400 →
Security Agreement
Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
Change of Name
Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
Release of Security Interest
Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
Reel/Frame 060592/0260 →
Security Interest
Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
Security Interest
Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
Change of Name
Nov 8, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065517/0783 →
Change of Name
Nov 22, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065663/0466 →