IP Library › Assignment 021291/0072
Patent Assignment
Reel/Frame 021291/0072

Change of Name

Recorded: 2008-07-24 Pages: 3
Assignor
NEOPAD TECHNOLOGIES CORPORATION
Executed: 2008-07-09
Assignee
NEXPLANAR CORPORATION
7425 NW EVERGREEN PARKWAY, SUITE 150, HILLSBORO, OREGON, 97124
Covered Property (1)
Methods for Producing in-Situ Grooves in Chemical Mechanical Planarization (Cmp) Pads, and Novel Cmp Pad Designs
Patent: 7,377,840 →
Application: 10/897,192 →
Publication: US 2006/0019587
Related Assignments (12)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 13, 2004
From: DEOPURA, MANISH; VAIDYA, HEM M.; ROY, PRADIP K.
To: NEOPAD TECHNOLOGIES CORPORATION
Reel/Frame 015244/0743 →
Change of Name Jul 23, 2008
From: NEOPAD TECHNOLOGIES CORPORATION
To: NEXPLANAR CORPORATION
Reel/Frame 021283/0520 →
Intellectual Property Security Joinder Agreement Dec 31, 2015
From: NEXPLANAR CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037407/0071 →
Assignment of Assignor's Interest Jul 19, 2017
From: NEXPLANAR CORPORATION
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 043046/0377 →
Release of Security Interest Nov 16, 2018
From: BANK OF AMERICA, N.A.
To: CABOT MICROELECTRONICS CORPORATION; NEXPLANAR CORPORATION
Reel/Frame 047586/0400 →
Security Agreement Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
Change of Name Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
Release of Security Interest Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
Reel/Frame 060592/0260 →
Security Interest Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
Security Interest Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
Change of Name Nov 8, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065517/0783 →
Change of Name Nov 22, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065663/0466 →