IP Library › Assignment 026024/0842
Patent Assignment
Reel/Frame 026024/0842

Assignment of Assignor's Interest

Recorded: 2011-03-25 Pages: 23
Assignors
CRONQUIST, BRIAN
Executed: 2011-03-16
BEINGLASS, ISRAEL
Executed: 2011-03-16
DEJONG, JAN LODEWIJK
Executed: 2011-03-16
SEKAR, DEEPAK C.
Executed: 2011-03-16
WURMAN, ZE'EV
Executed: 2011-03-16
LIM, PAUL
Executed: 2011-03-16
Assignee
MONOLITHIC 3D INC.
3555 WOODFORD DRIVE, SAN JOSE, CALIFORNIA, 95124
Covered Properties (16)
Method for Fabrication of a Semiconductor Device and Structure
Patent: 8,461,035 →
Application: 12/894,235 →
3D Semiconductor Device
Patent: 8,258,810 →
Application: 12/894,252 →
Publication: US 2012/0194218
Semiconductor and Optoelectronic Devices
Patent: 8,163,581 →
Application: 12/904,103 →
3D Semiconductor Device Including Field Repairable Logics
Patent: 8,362,800 →
Application: 12/904,108 →
Publication: US 2012/0194216
Method for Fabrication of a Semiconductor Device and Structure
Patent: 8,373,230 →
Application: 12/904,114 →
Method of Fabricating a Semiconductor Device and Structure
Patent: 8,476,145 →
Application: 12/904,119 →
Publication: US 2012/0193719
Semiconductor Device and Structure
Patent: 8,379,458 →
Application: 12/904,124 →
3D Semiconductor Device
Patent: 8,427,200 →
Application: 12/941,073 →
Publication: US 2012/0196409
Method to Form a 3D Semiconductor Device
Patent: 9,577,642 →
Application: 12/941,074 →
Publication: US 2012/0193806
3D Semiconductor Device
Patent: 8,373,439 →
Application: 12/941,075 →
Publication: US 2012/0193681
Method of Manufacturing a Semiconductor Device and Structure
Patent: 8,536,023 →
Application: 12/951,913 →
Publication: US 2012/0220102
3D Integrated Circuit with Logic
Patent: 8,492,886 →
Application: 12/951,924 →
Publication: US 2012/0196390
A Semiconductor Device and Structure
Patent: 8,541,819 →
Application: 12/963,659 →
Method for Fabrication of a Semiconductor Device and Structure
Patent: 8,298,875 →
Application: 13/041,404 →
Semiconductor Device and Structure for Heat Removal
Patent: 8,901,613 →
Application: 13/041,405 →
Publication: US 2012/0223436
3D Semiconductor Device
Patent: 9,509,313 →
Application: 13/041,406 →
Publication: US 2012/0193621
Related Assignments (20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 27, 2012
From: OR-BACH, ZVI
To: MONOLITHIC 3D INC.
Reel/Frame 029534/0390 →
Assignment of Assignor's Interest Jan 11, 2013
From: OR-BACH, ZVI; WURMAN, ZE'EV
To: MONOLITHIC 3D INC.
Reel/Frame 029612/0256 →
Assignment of Assignor's Interest Jan 23, 2013
From: OR-BACH, ZVI
To: MONOLITHIC 3D INC.
Reel/Frame 029682/0583 →
Assignment of Assignor's Interest Jan 24, 2013
From: OR-BACH, ZVI
To: MONOLITHIC 3D INC.
Reel/Frame 029682/0831 →
Assignment of Assignor's Interest Jan 24, 2013
From: OR-BACH, ZVI
To: MONOLITHIC 3D INC.
Reel/Frame 029682/0833 →
Assignment of Assignor's Interest Jan 24, 2013
From: OR-BACH, ZVI
To: MONOLITHIC 3D INC.
Reel/Frame 029682/0839 →
Assignment of Assignor's Interest Jan 24, 2013
From: OR-BACH, ZVI
To: MONOLITHIC 3D INC.
Reel/Frame 029682/0841 →
Assignment of Assignor's Interest Jan 24, 2013
From: OR-BACH, ZVI
To: MONOLITHIC 3D INC.
Reel/Frame 029682/0843 →
Assignment of Assignor's Interest Jan 24, 2013
From: OR-BACH, ZVI
To: MONOLITHIC 3D INC.
Reel/Frame 029682/0845 →
Assignment of Assignor's Interest Jan 24, 2013
From: OR-BACH, ZVI
To: MONOLITHIC 3D INC.
Reel/Frame 029682/0847 →
Assignment of Assignor's Interest Jan 24, 2013
From: OR-BACH, ZVI
To: MONOLITHIC 3D INC.
Reel/Frame 029682/0849 →
Assignment of Assignor's Interest Jan 24, 2013
From: OR-BACH, ZVI
To: MONOLITHIC 3D INC.
Reel/Frame 029682/0851 →
Assignment of Assignor's Interest Jan 24, 2013
From: OR-BACH, ZVI
To: MONOLITHIC 3D INC.
Reel/Frame 029682/0856 →
Assignment of Assignor's Interest Jan 24, 2013
From: OR-BACH, ZVI
To: MONOLITHIC 3D INC.
Reel/Frame 029682/0858 →
Assignment of Assignor's Interest Jan 24, 2013
From: OR-BACH, ZVI
To: MONOLITHIC 3D INC.
Reel/Frame 029682/0860 →
Assignment of Assignor's Interest Jan 24, 2013
From: OR-BACH, ZVI
To: MONOLITHIC 3D INC.
Reel/Frame 029682/0865 →
Assignment of Assignor's Interest Jan 24, 2013
From: WIDJAJA, YUNIARTO
To: MONOLITHIC 3D INC.
Reel/Frame 029690/0050 →
Assignment of Assignor's Interest Dec 8, 2020
From: MONOLITHIC 3D INC.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 054576/0686 →
Assignment of Assignor's Interest Jan 11, 2022
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 058625/0664 →
Assignment of Assignor's Interest Jan 7, 2026
From: MONOLITHLC 3D™ INC.
To: SAMSUNG ELECTRONICS CO. , LTD.
Reel/Frame 073397/0890 →